CN1299873C - Method for laser machining a workpiece with laser spot enlargement - Google Patents
Method for laser machining a workpiece with laser spot enlargement Download PDFInfo
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- CN1299873C CN1299873C CNB038019914A CN03801991A CN1299873C CN 1299873 C CN1299873 C CN 1299873C CN B038019914 A CNB038019914 A CN B038019914A CN 03801991 A CN03801991 A CN 03801991A CN 1299873 C CN1299873 C CN 1299873C
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- 238000000034 method Methods 0.000 title claims description 38
- 238000003754 machining Methods 0.000 title claims description 8
- 230000001133 acceleration Effects 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 5
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000012797 qualification Methods 0.000 claims 2
- 239000000463 material Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 11
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 238000005094 computer simulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000003252 repetitive effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 230000001052 transient effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- NOQGZXFMHARMLW-UHFFFAOYSA-N Daminozide Chemical group CN(C)NC(=O)CCC(O)=O NOQGZXFMHARMLW-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000006578 abscission Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
An fast steering mirror (30), such as a PMN actuated mirror, is positioned in a beam path (18) of a stage-based positioning system (40) to continuously move a laser beam (46) in a high speed prescribed pattern about a nominal target position (60) to spatially separate focused laser spots (48) generated at a high laser repetition rate and thereby create geometric features having dimensions greater than those of the focused laser spot (48). A series of laser spots (48) at a given repetition rate appear as a series of larger diameter laser spots at a lower pulse rate without beam quality problems associated with working out of focus.
Description
Technical field
The present invention relates to Laser Micro-Machining, and particularly relate to a kind of method and apparatus that adopts quick deflection mirror to come mobile laser facula, wherein this laser facula has the spot size of focusing according to required figure on substrate, in order to remove target area bigger than focused spot size on this substrate.
Background technology
Here only show background technology by way of example at the multilayer electronic workpiece, described multilayer electronic workpiece for example is IC chip encapsulation, multi-chip module (MCM) and high density interconnected circuit plate, and they have become the most preferred element of Electronic Packaging industry.
Be used to encapsulate the device of single chip,, generally include the element layer of discrete metal, organic dielectric and/or reinforcing material and other new material as ball grid array, Pin-Grid Array, circuit board and hybrid microcircuit.Recently, a large amount of work has been target with the micro-processing technology of developing based on laser, in order that form via hole (via) or carry out other processing on this electron-like material.For little processing, via hole here only is discussed by way of example, and its form that also can take complete through-hole form or take to be called as the incomplete hole of blind via hole.Regrettably, Laser Micro-Machining comprises a large amount of variablees, these variablees comprise laser type, operating cost and laser instrument and the specific running parameter of target material, as light beam wavelength, power and spot size, therefore cause the mass change in processing amount and hole very big.
For many purposes, compare with the diameter in desirable kerf width and hole, employed pulsed ultraviolet laser device produces less spot size in little process operation at present.The output that is used to form the Laser Processing of the feature geometries feature bigger than laser spot size (being referred to as " sharp processing " hereinafter) can improve by using than big and the lower laser beam of power density.Laser instrument out of focus operation as described in No. the 5841099th, people's such as Owen United States Patent (USP) can increase laser spot size effectively and reduce its power density.Belong to people's such as Owen United States Patent (USP) No. 5593606 and No. 5841099 equally, described and used the ultraviolet laser system in favourable parameter area, to produce laser pulse output, thus in multilayer device the advantage of formation via hole or blind via hole.These patents have been mentioned well-known technology, use these technology, can produce the diameter via hole bigger than focused spot size by perforation, concentric circles processing or spiral processing (spiral processing).These technology all will be called as " profile boring (contoured drilling) " hereinafter.
Regrettably, the out of focus of laser operation often cause unforeseen and undesirable Energy distribution and light spot shape and to via quality (comprise path hole wall tapering, the fusing degree of the copper layer of via bottom, and holing during by the caused height of splashing of melting copper around via hole " edge " on every side) have a negative impact.In addition, because the spot size of the spot size that enters conventional collimation and focusing optics and collision target is inversely proportional to, therefore be applied to the damaging thresholding that power density on the above-mentioned optics has exceeded optics very soon.
The United States Patent (USP) of Ward discloses a kind of method of profile boring for No. 4461947, in the method, rotates in the plane perpendicular to the incident laser light beam with lens, thereby influences target area bigger than laser focusing hot spot on the size.The rotation of described lens and the location independent that supports hold-down arm.The patent of Ward also discloses a kind of profile boring method of prior art, and this method relies on hold-down arm moving in a plane to realize the lens rotation.In this background technology, the patent disclosure of Ward can rotate light beam by rotating mirror.
People's such as Kawasaki United States Patent (USP) discloses a kind of laser welding system No. 5571430, this system has adopted a kind of concave surface condenser, it is around first pivot, thereby and is supported on by a rotary supporting part and makes this concave surface condenser can be around the second spool rotation vertical with first on the bearing.This concave surface condenser rotates in order that increase " width " that is removed target around first, and rotates in order that form ring-shaped figure around second.
Summary of the invention
Therefore, an object of the present invention is, a kind of method or equipment are provided, in order to the laser focusing hot spot of the high-repetition-rate pulse laser that spatially distributes fast, and distribution energy density therefrom.
Another object of the present invention is to form the geometric properties bigger than the size of laser focusing hot spot apace.
A further purpose of the present invention is to improve the production capacity and/or the quality of the workpiece in this laser machining operation.
United States Patent (USP) the 6430465th B2 of No. the 5751585th, people's such as Cutler United States Patent (USP) and No. 5847960 that is Cutler comprises the description of division axle navigation system, in this system, upper stages be do not supported by the bottom workbench and be independent of the bottom movable workbench, and in this system, workpiece is carried on an axle or the workbench, and instrument then is carried on another axle or the workbench.Above-mentioned these navigation systems have one or more upper stages, quick positioner of they each self-supportings, and can simultaneously handle one or more workpiece with high production rate, this is because above-mentioned by the workbench of the independent support inertia mass that CBR piling operation platform system is littler separately and can quicken quickly, slow down or change direction.Like this, because the quality of a workbench be can't help other workbench and carried, just increased for the resonant frequency of fixed load.In addition, thus in response positioning command data flow, coordinate locator shift position separately when producing temporary transient fixing tool location on the defined target location of database simultaneously, at a slow speed and fast locator is suitable for mobile and does not stop.The navigation system of these division axles, many speed has reduced the restriction of the quick positioner moving range of existing system, the tool processes that significantly improves output is provided simultaneously, and can have come work according to the database of panelization (panelized) or non-panelization (unpanelized).
Because the whole quality of workpiece and size increase, though use longer and therefore and such division axle navigation system of the bigger workbench of quality is becoming even be more favourable, they enough bandwidth can not be provided in case effectively with big how much at interval with Energy distribution between each laser pulse of high pulse repetition frequency (PRF).
Therefore the present invention adopts a kind of quick deflection mirror, for example a kind of piezoelectricity control mirror, in light path with speed prescribed pattern mobile continuously laser beam around the target location of nominal, so that separate the laser focusing hot spot that produces with high laser repetition rate from the space, and therefore form the geometric properties bigger than the size of laser focusing hot spot.The present invention allow a series of laser pulses on given repetitive rate show as a series of on low pulse recurrence rate than the major diameter pulse, and the beam quality problem relevant not with out of focus work.
Additional objects and advantages of this invention will become apparent from the detailed description of preferred embodiment being carried out below with reference to accompanying drawing.
Description of drawings
Fig. 1 is that the part of laser system that combines a simplification of quick deflection mirror according to the present invention is the view of schematic diagram character for normal axomometric drawing character part.
Fig. 2 is that the part of employed quick deflection mirror mechanical device in the laser system of Fig. 1 is the view of illustrative nature for the graphic nature part.
Fig. 3 is that the part of employed quick deflection mirror mechanical device in the laser system of Fig. 1 is the view of illustrative nature for analysing and observe the character part.
How crooked Fig. 4 be the front view of the quick deflection mirror of the demonstration speculum position that can influence laser facula.
Fig. 5 is by the computer model that forms profile according to the mobile and improved exemplary linear incision of quick deflection mirror of the present invention.
Fig. 6 is the computer model by the profile of holing according to the mobile and improved exemplary via hole of quick deflection mirror of the present invention.
The specific embodiment
Referring to Fig. 1, an one exemplary embodiment of laser system 10 of the present invention comprises solid state laser (SS) 12 Q-switch, diode pumping (DP), and this laser instrument preferably comprises solid-state lasant matter.But, it will be understood to those of skill in the art that the pumping source except diode, for example the krypton arc lamp also is exercisable.Pump diode, arc lamp or other conventional pump arrangement are accepted energy (not illustrating separately) from power supply, and they can constitute the part of laser instrument 12, perhaps can be configured to independently.
The laser output 14 with one or more laser pulse that exemplary laser instrument 12 provides resonance to produce, described laser pulse mainly has TEM
00Spatial mode distributes.Preferred optical maser wavelength, comprises from Nd:YAG, Nd:YLF, Nd:YVO to about 2000 nanometers from about 150 nanometers (nanometer)
4, Nd:YAP, Yb:YAG or 1.3,1.064 or 1.047,1.03～1.05,0.75～0.85 microns (μ m) or their secondary of Ti sapphire laser 64, three times, four times or quintuple harmonics, but be not limited to these wavelength.Such harmonic wave can comprise the wavelength that for example is approximately 532 nanometers (frequency multiplication Nd:YAG laser instrument), 355 nanometers (frequency tripling Nd:YAG laser instrument), 266 nanometers (quadruple Nd:YAG laser instrument) or 213 nanometers (five frequency multiplication Nd:YAG laser instruments), but is not limited to these wavelength.Laser instrument 12 and harmonic wave generating technique are well-known to those skilled in the art.In No. the 5593606th, people's such as Owen United States Patent (USP), described the details of an exemplary laser 12 in detail.The example of preferred laser 12 comprises 210 type UV-3500 laser instruments by Lightwave Electronics (Lightwave Electronics Inc.) sale of California, USA Mountain View.It will be understood to those of skill in the art that the emission other suitable wavelength laser instrument be can buy from the market and can use, comprise the carbon dioxide laser of optical fiber laser or Q-switch.December in 2002 people such as disclosed Dunsky on the 12nd publication number be US2002/0185474 A1 U.S. Patent Publication a kind of exemplary Q-switch carbon dioxide laser.
Referring to Fig. 1, laser instrument output 14 is before being subjected to a series of beam director 20 of beam position system 40 (as the positioning mirror of workbench axle), quick deflection mirror FSM (30) and quick positioner 32 (as a pair of X-axis and the Y-axis speculum that driven by galvanometer) guiding, can be handled by multiple known optical element, comprise the optical beam expander lens element 16 that is provided with along light path 18.At last, laser output 14, is being passed earlier such as the object lens 42 as focusing or telecentric iris scanning lens before being applied on the workpiece as the laser system output beam 46 with laser facula 48.
A kind of preferred beam position system 40 describes in detail in No. the 5751585th, people's such as Cutler United States Patent (USP), and this navigation system can also be included in Abbe error (ABBE error) means for correcting of describing in people's such as Cutler United States Patent (USP) 6430465B2 number.A kind of travelling table locator of beam position system 40 preferred employings, this locator is preferably controlled two platforms workbench 52 and 54 in other words at least, and support setting element 20, so that the output beam 46 of laser system is aimed at and focused on the needed laser eyepiece position 60.In a preferred embodiment, the travelling table locator is a kind of division axle system, wherein the Y workbench 52 that is usually moved by linear electric machine supports and along track 56 travelling workpieces 50, X workbench 54 supports and moves quick positioner 32 and object lens 42 along track 58, the size of Z between X and Y workbench is adjustable, and beam direction element 20 is adjusted light path 18 by any inferior the turning between laser instrument 12 and quick deflection mirror 30.Typical travelling table locator can have the speed of 500 mm/second and the acceleration of 1.5g.The navigation system that the combination of quick positioner 32 and one or more travelling table 52 and/or 54 can be called for simplicity, main navigation system or integrated form.
Beam position system 40 allows fast moving between each position 60, order border in identical or different circuit board or the chip encapsulation, to realize independent or dual process operation based on test data that is provided or design data.An exemplary quick positioner can have the speed of 400 mm/second or 500 mm/second and the acceleration of 300g or 500g, and therefore these parameters also are the typical performances of an exemplary integrated navigation system.Other these series of products that the 5320 type laser systems that Electro Scientific Ind., Inc. that example that comprises the preferred laser system 10 of a lot of above-mentioned navigation system elements is Ore. Portland city produces or the said firm produce.Yet it will be understood to those of skill in the art that it to be to appoint to get one ground and adopt to have and be used for the single X-Y workbench that workpiece locatees and be used for the fixed beam position of beam position and/or the system of quiescent current meter.
Laser system controller 62 preferably makes the startup of laser instrument 12 be synchronized with workbench 52 and 54 and the moving of quick positioner 32 in mode well-known to those skilled in the art.Shown in laser system controller 62 be generally used for controlling quick positioner 32, workbench 52 and 54, laser instrument 12 and deflection mirror controller 64 fast.It will be understood to those of skill in the art that, laser system controller 62 can comprise integrated or RACS independently, with in these laser components any one or all control and/or provide energy, and such subsystem can be configured to respect to laser system controller 62 be long-range.The also preferred motion of controlling quick deflection mirror 30 by speculum controller 64 directly or indirectly of laser controller system 62, comprise its direction, inclination angle or rotation and speed or frequency, and the element of control and laser instrument 12 or navigation system 40 is any synchronous.For convenience's sake, the combination of deflection mirror 30 and speculum controller 64 can be referred to as navigation system auxiliary or non-integrated form fast.
The parameter of laser system output beam 46 is chosen to be convenient to clean fully in various metals, dielectric and other target material, boring just forms via hole continuously, and above-mentioned these material response ultraviolet lights or visible light can demonstrate different optical absorption, ablation threshold or other characteristic.The exemplary of parameters of the output of laser system be included in measure on the spot area greater than about 120 little Jiao (μ J), be preferably the mean energy density of 200 μ J; Less than about 50 microns and preferably from about 1 micron to 50 microns, normally from about 20 microns to 30 microns spot diameter or space primary optical axis; Greater than about 1 kilo hertz (kHz) and be preferably greater than about 5kHz and most preferably what for to the repetitive rate that is higher than 20kHz; Wavelength preferably between about 150 nanometers between 2000 nanometers, more preferably between greatly about between 190 to 1325 nanometers, most preferably then between about 266 nanometers and 532 nanometers.Select the preferred parameter of laser system output beam 46, in order that try hard to avoid because certain fire damage effect of using the transient pulse width to cause, wherein this transient pulse width is less than about 100 nanoseconds (ns), and preferably from about 0.1 psec (ps) to 100 nanoseconds, preferred then is from about 1 to 90 nanosecond even shorter.It will be understood to those of skill in the art that these parameters will change according to processed material and can be optimised, and different parameters can be used to handle different destination layers.
The output beam 46 preferred light-beam positions 60 on workpiece 50 of laser system produce diameter less than about 25 to 50 microns spot area 48.Though particularly in relevant with the description of laser system 10, spot area 48 and diameter are commonly referred to as the 1/e2 size, these terms also can be used to refer to facula area or once in a while by the diameter in the formed hole of individual pulse.Those skilled in the art will be understood that also the spot area 48 of output beam 46 roughly is circular, but also can be shaped as square substantially.Those skilled in the art also will be understood that, are used for specific operation if desired, particularly handle for the first step, and output beam 46 can be by imaging, or is clipped its alar part and afterbody.
Fig. 2 shows the preferred embodiment of quick deflection mirror (FSM) 30, this speculum is positioned so that receive laser output 14, make its deflection and pass quick positioner 32, by the target location 60 that object lens 42 arrive on the workpiece 50, the ECB via hole is holed to be used for, component is repaired or other little processing purposes.Fast deflection mirror 30 preferably is implemented as the part of limited deflected beam positioning table, and this workbench uses the electrostriction adjuster with frequency response higher than quick positioner 32.Fast deflection mirror 30 is by ferroelectric ceramics adjuster (ferroelectric ceramic actuator) material such as the deflection of lead magnesium niobate (PMN) institute, and adjuster (actuator) 22 becomes displacement with voltage transitions.Lead magnesium niobate (PMN) material is similar to more common piezoelectric actuator material, but have less than centesimal hysteresis, high electromechanical conversion efficiency, show wide operating temperature range and processing temperature scope, do not need permanently-polarised, and provide useful mechanical validity with little electric driving voltage.
Exemplary PMN adjuster 22 has about 20 microns finite displacement for the PMN material cylinder material of 40 millimeters long, but has about every micron 210 newton's very high rigidity for the cylinder of 5 mm dias.Deflection mirror 30 is connected on three PMN adjusters 22 by sweep fast, and these PMN adjusters have first end that is arranged in equilateral triangle, the center 24 of the quick deflection mirror 30 of the centrally aligned of this equilateral triangle.The second terminal tool of PMN adjuster 22 is connected on the mount pad 26 that is attached to X-axis travelling table 54.Three PMN adjusters 22 preferably realize with the structure of three degree of freedom, and the structure of this three degree of freedom the pattern with two frees degree of being used to tilts and overturns quick deflection mirror 30.Three PMN adjusters 22 are preferably formed the hollow circular cylinder of a PMN material, and the hollow circular cylinder of this PMN material is divided into three zones of action from electric from circumference.Activate a zone and make its stretching, extension or contraction, overturn thus or tilt quick deflection mirror 30.
Preferably actuator triangle has 5 millimeters limit, make quick deflection mirror 30 can be deflected approximately ± angle of 4 milliradians (" mRad "), when this angle projects on the workpiece 50 when the object lens 42 that be utilized 80 millimeters, just be converted into laser output 14 ± 640 microns deflection.An exemplary quick deflection mirror 30 can provide typical travel limits scope, and its restriction dimension of picture is up to about 25 or 50 times of laser spot size; Yet the peak response frequency of deflection mirror 30 can be a restriction that constraint is stronger fast, and its restriction dimension of picture is up to about 15 times of laser spot size, and reaches 5 to 10 times of laser facula usually.X-axis and higher frequency and the acceleration work of Y-axis speculum that quick deflection mirror 30 drives with the exemplary galvanometer than quick positioner 32.The exemplary quick deflection mirror 30 of non-integrated form navigation system provides the speed greater than 1000 mm/second, and 4000 mm/second or higher speed can be provided, and this is 5 to 10 times of typical set accepted way of doing sth navigation system speed.The exemplary fsm 30 of non-integrated form navigation system provides the acceleration greater than 1000g, and 30000g or higher acceleration can be provided, and this is 50 to 100 times of acceleration of typical set accepted way of doing sth navigation system.
In detail, exemplary PMN adjuster 22 have about 20 microfarads electric capacity, 1.0 ohm dc impedance, when 5kHZ 17 ohm impedance and when 75V drives, flow through and surpass 3 amperes electric current.The exemplary PMN adjuster 22 that drives quick deflection mirror 30 has the large-signal bandwidth that surpasses about 5kHZ, surpass the small signal bandwidth of about 8kHZ and be used for deflection laser export 14, have ± deflection angle at least about 4 milliradians of 0.5 micron positioning resolution.
It will be understood to those of skill in the art that any other accurate high bandwidth adjuster can both be used to mirror actuators 22.Fig. 3 is that the part of some exemplary control circuits 70 of an optionally quick deflection mirror 30 and an exemplary speculum controller 64 is the view of illustrative nature for analysing and observe the character part, wherein this speculum controller 64 is to be used for mirror actuators 72A and 72B (briefly being called mirror actuators 72), they are preferably piezoelectric type (PZT) device, these piezoelectric devices are used to cause on the angle of quick deflection mirror 30 minor variations, thereby cause on laser output beam 46 angles, minor variations being arranged, and then cause that in the position 60 of the lip-deep laser facula 48 of workpiece 50 minor variations is arranged.Fig. 4 is the front view of quick deflection mirror 30, and how the bending of demonstration speculum can influence the position 60 of laser facula 48.
Referring to Fig. 3 and Fig. 4, in the one exemplary embodiment of a use PZT mirror actuators 72, one jiao of the quick deflection mirror 30 of essentially rectangular is fixed on the benchmark architecture with sweep, and but this sweep can be crooked can not compresses or stretch.Fast two other angle of deflection mirror 30 is driven by the piezoelectric mirror actuators 72A of response sine wave and 72B, thereby will cause the low-angle of the variation in the light-beam position (it is superimposed upon on the target location of being set up by other element of beam position system 40 60) of laser facula 48 to be incorporated in the light path 18.
In a preferred embodiment, sinusoidal sin (a) signal 74 drives piezo-electrical mirror adjuster 72A and 72B along relative direction, with angulation variation in one direction, sin (a+90 °) signal 76 then along identical direction with sinusoidal drive mirror actuators 72A and 72B, change the angles that are 90 degree with above-mentioned first kind of angle and change thereby produce.Laser output 14 is near the quick deflection mirror 30 of a bit being reflected out of center.Be scanned after lens 42 are converted to change in location at the low-angle that moving of speculum introduced like this, just cause circular motion at surface of the work.
For the laser drill operation, preferred objective focal length is approximately 50～100 millimeters, preferred distance from quick deflection mirror 30 to scanning lens 42 is as much as possible little in the design constraint scope, and when Z workbench (not shown) is in its standard focal height, preferably less than about 300 millimeters, preferred then is less than 100 millimeters.In preferred laser system 10, deflection mirror 30 is installed in the upstream of the quick positioner 32 on the X workbench 54 fast, and has replaced the last deviation mirror (turnmirror) in some conventional beam position systems.In a preferred embodiment, quick deflection mirror 30 be suitable for upgrading easily existing laser instrument and navigation system 40, adopted in 5200 types of producing as Ore. Portland city Electro Scientific Ind., Inc. or 5300 types, and can be easily with the X workbench 54 of conventional laser system on the transposing of afterbody deviation mirror.It will be understood to those of skill in the art that on X workbench 54, deflection mirror 30 still can be set at other position in the light path 18 fast.
It will be understood to those of skill in the art that and to adopt multiple technologies selectively, for example on two axles, move at center 24 around a pivoting point to control quick deflection mirror 30.These technology comprise quick deflection mirror 30, and this quick deflection mirror uses bending mechanism and voice coil loudspeaker voice coil adjuster, piezoelectric type adjuster (it depends on piezoelectric deforming, electrostriction or PMN material) and makes the electrostriction or the piezoelectric type adjuster of areal deformation of speculum.In No. the 5946152nd, the United States Patent (USP) of Baker, described the quick deflection mirror 30 that exemplary voice coil loudspeaker voice coil is regulated, and it is suitable for high-frequency operation.The quick deflection mirror 30 that suitable voice coil loudspeaker voice coil drives can be bought from the Ball Aerospace Corporation in Colorado Broomfield city and the Newport Corporation in California Irvine city.Suitable piezoelectric actuator city then is Physik Instrumente (" PI ") the GmbH ﹠amp in German Karlsruhe city; Co. the supper-fast piezoelectricity tip/tilt of the S-330 type platform of manufacturing.
In the application that the simulated laser hot spot amplifies, the workbench 52 of laser controller 64 command set accepted way of doing sth navigation systems and 54 and quick positioner 32 follow predetermined tool path, the boring profile of recontour or blind via hole for example, speculum controller 62 makes the laser spot position that quick deflection mirror 30 comes mobile laser system output beam 46 with needed figure such as roundlet or vibration independently simultaneously.Light beam this stack, free-moving moves or vibrates, and the Energy distribution that makes laser system output beam 46 and has caused the otch of a broad effectively along tool path on a bigger zone.Effective kerf width is generally equal to dimension of picture and adds spot diameter.Light beam moves laser energy is distributed on the bigger zone, thereby increases the area that can handle with given average energy effectively in a period of time.
Because speculum controller 64 send to the order of quick deflection mirror 30 be not with the workbench 52 that sends to the integrated form navigation system and 54 and the positioning command of quick positioner 32 be integrated but stack with it the function and the production capacity that obtain significantly to improve so can avoid a large amount of complexity and cost.Yet speculum controller 64 can cooperate with laser controller 62, so that the specific required mobile graphics of realization laser system output beam 46 in specific laser is used or in the particular tool path of integrated form navigation system.Effective spot pattern of deflection mirror can be selected fast, make it to have certain dimension of picture, for example be used for the specific kerf width of finishing operation with acquisition, and/or selected, so that in such, provide specific hole edge quality such as drilling operation.Yet it will be understood to those of skill in the art that speculum controller 64 can directly be programmed by the user, and do not need to cooperate, also do not need to control by laser controller 64 with laser controller 64.
Developed a computer graphics model, be used for showing that aforesaid quick deflection mirror 30 is moved the single position of laser facula 48 on surface of the work that is caused continuously by piezoelectric actuator.Fig. 5 B is the computer model that moves the exemplary linear pattern otch forming tool path 80 of being improved for quick deflection mirror 30 of Fig. 5 A.Referring to Fig. 5 A and Fig. 5 B (general designation Fig. 5), each parameter comprises: the pulse recurrence frequency of about 18kHz (PRF); The spot size of about 25 μ m; The space rate of about 50 mm/second (little rotation circular pattern moves through the speed of surface of the work); The speed of rotation of about 2kHz (speed of circular pattern rotation); The verticity of about 30 μ m (diameter of circular pattern (to the center of light beam)); The internal diameter of about 10 μ m (initial diameter of spirality pattern (to the center of circular pattern)); The external diameter of about 150 μ m (the termination diameter of spirality pattern (to the center of circular pattern)); The number of circle approximately is 2 (the rotation numbers of spirality pattern).This models show for the laser pulse frequency of supporting to arrive in the 20kHz scope between 15, needs 1kHz to be used for actual pulse overlapping to the speed of rotation of 2.5kHz (each rotates 5 to 15 pulses).
Refer again to Fig. 5, the straight-line profile 82 that strengthens with speculum forms kerf width 84, and the spot diameter 86 of this kerf width specific output light beam 46 is wide.This technology allows to form the otch wideer than spot diameter 86 with less number of times, keeps crudy and other to use the advantage that focuses on output beam 46 (just obtaining the broad hot spot without the out of focus light beam) simultaneously.In addition, application for high-repetition-rate, the bandwidth ability that can exceed most of quick positioners 32 with the straight-line profile 82 of speculum enhancing, and allow quick positioner 32 to keep simple location move, in contrast, spirte needs these location moves in addition, so that it realizes spirte in the straight-line profile 82 that speculum strengthens.
The exemplary via hole that Fig. 6 B is strengthened by moving of quick deflection mirror 30 forms the computer model in throw path 90 (Fig. 6 A).Referring to Fig. 6 A and Fig. 6 B (general designation Fig. 6), each parameter comprises: the pulse recurrence frequency of about 15kHz (PRF); The spot size of about 15 μ m; The space rate of about 30 mm/second (little rotation circular pattern moves through the speed of surface of the work); The speed of rotation of about 1.5kHz (speed of rotation of circular pattern); The verticity of about 20 μ m (diameter of circular pattern (to the center of light beam)); The internal diameter of about 10 μ m (initial diameter of spirality pattern (to the center of circular pattern)); The external diameter of about 150 μ m (the termination diameter of spirality pattern (to the center of circular pattern)); The number of circle is approximately 2 (the rotation numbers of spirality pattern).This models show goes out the laser pulse frequency that arrives in the 20kHz scope between 15 in order to support, needs 1kHz to be used for actual pulse overlapping to the speed of rotation of 2.5kHz (each rotates 5 to 15 pulses).
In the one exemplary embodiment of a carbon dioxide laser system 10 that uses Q-switch and the quick deflection mirror 30 of PMN, this carbon dioxide laser system 10 uses the pulse recurrence frequency of 30kHz to 40kHz, wherein 20 to 30 pulses of each via hole.Fast deflection mirror 30 make it form complete rotation when boring, and drilling time is less than 0.6 to 1 millisecond with 1.0 to 1.5kHz frequency vibration laser system output beam 46.
Referring to Fig. 6, be directed on the periphery by the laser system output beam 46 that sequentially will have facula area 86 along spirality tool path 90, and form a blind via hole at overlapping adjoining position.Light beam 46 is preferably moved continuously through each position, and its speed is enough to make system 10 to provide the light beam pulse of necessary number to reach cutting depth in above-mentioned position.Along with light beam 46 is advanced along spirality tool path 90, when each light beam 46 was moved to a new cutting position, target material just " was bit by bit downcut ", continued the hole that increases thereby form a size.The net shape of this hole normally obtains when circular path moves the arrival periphery at light beam 46.
Those skilled in the art will be noted that, the via hole profile 92 that strengthens with speculum has formed the bigger kerf width 84 of spot diameter 86 of specific output light beam 46, thereby makes the diameter 94 of last resulting via hole be far longer than the formed diameter of the kerf width spirality identical with spot size.The present invention allows a series of pulse hot spots 48 with given repetitive rate to have than the occurring than major diameter laser pulse hot spot of low pulse repetition frequency as a series of, thus the beam quality problem relevant not with out of focus.Via hole diameter or kerf width are in from 25 to 300 microns scope usually, perhaps also need but have 1 millimeter (mm) or bigger diameter or the via hole or the otch of width.
One available be used to form the tool path of blind via hole can be from the center, and the concentric circles that increases progressively of the radius that limited by kerf width 84 of cutting.Along with this concentric circles that forms via hole moves with the bigger distance in center, territory, abscission zone on circular path, the integral diameter of via hole will increase.Alternatively, this process can begin and processes the edge towards the center by limiting needed circumference.It is slightly more more continuous and faster than concentric circles processing that outside spirality adds trade union; Yet blind via hole also can form with inside spirality.
It will be understood to those of skill in the art that no matter to be workpiece 50 or processing output beam 46 can be fixed with respect to the opposing party's position or move.In a preferred embodiment, workpiece 50 and processing output beam 46 the two be moved simultaneously.The through-out pathway hole that in No. the 5593606th, United States Patent (USP), has proposed on multiple different substrates, to form and some examples of blind via hole with different depth and diameter.Different via hole process technologies comprises other tool path profiles, is disclosed in too in United States Patent (USP) the 6407363rd B2 number of people such as Dunsky, and this specification is reference paper with it in conjunction with drawing.It will be understood to those of skill in the art that non-circular via hole also can be ablated by similarly processing.For instance, such via hole can have square, rectangle, ellipse, slit shape or other surface configuration.
Those skilled in the art also will understand, the integrated form navigation system can directed single position to process a small size via hole, 30 of the quick deflection mirrors of non-integrated form are used to form the big via hole of spot diameter 48 of a diameter specific output light beam 46, and need not significant action time, also need not to forming the complexity of the tool path mobile set accepted way of doing sth navigation system as tool path 90.In addition, via quality comprises edge quality and bottom uniformity, all can be greatly improved, and especially true when the laser system output beam is Gaussian distribution relatively.
It will be apparent to those skilled in the art that not deviating from principle of the present invention can make a lot of changes to the details of the foregoing description.Therefore scope of the present invention only should be defined by the appended claims.
Claims (22)
1. one kind goes out the method for effective kerf width with laser output pulse with Laser Processing on workpiece, and the laser spot diameter that each described laser pulse is had on described workpiece is all less than described effective kerf width, and described method comprises:
From a main beam navigation system, with first group of speed and acceleration that limits, the principal phase of one laser spot position is delivered on the described workpiece motion, the beam position path of the described laser spot position on this main beam navigation system is provided with from laser instrument to described workpiece, described principal phase limits main machining path to motion; With
From an auxiliary beam navigation system along location, described beam position path, with second group of speed and the acceleration that is significantly higher than first group of speed and acceleration, the auxiliary relative motion of described laser spot position is delivered on the described workpiece, should auxiliary relative motion be added to described principal phase in the motion, and comprise perpendicular to described main machining path, figure with dimension of picture, this dimension of picture is less than or equal to 15 times described laser spot diameter, described principal phase is to motion and auxiliary relative motion cooperation and provide described effective kerf width along described main machining path, and this effective kerf width equals described dimension of picture and adds described spot diameter.
2. according to the process of claim 1 wherein that described second group comprises greater than the speed of 1000 mm/second and greater than the acceleration of 1000g.
3. according to the method for claim 2, wherein said second group of speed and acceleration from 1000g to 30000g that comprises from 1000 mm/second to 4000 mm/second.
4. according to the process of claim 1 wherein that described first group comprises less than the speed of 500 mm/second and less than the acceleration of 500g.
5. according to the process of claim 1 wherein that described dimension of picture is less than or equal to 10 times described laser spot diameter.
6. according to the process of claim 1 wherein that described auxiliary beam navigation system has greater than the large-signal bandwidth of 5kHz with greater than the small signal bandwidth of 8kHz.
7. according to the process of claim 1 wherein that described auxiliary beam navigation system comprises quick deflection mirror.
8. according to the method for claim 7, wherein said quick deflection mirror comprises the speculum that lead magnesium niobate or piezoelectric type are regulated.
9. according to the process of claim 1 wherein that described main beam navigation system comprises that at least one is moved and quick positioner.
10. according to the method for claim 9, wherein said quick positioner comprises a galvanometer driven mirror at least.
11. according to the method for claim 9, wherein said quick positioner is mounted on the travelling table.
12. according to the method for claim 11, wherein said main navigation system comprises division axle navigation system.
13. according to the method for claim 1, it further comprises with described laser output pulse implements the via hole drilling operation.
14. according to the method for claim 1, it further comprises with described laser output pulse implements the laser reconditioning operation.
15. one kind goes out the method for effective kerf width with laser output pulse with Laser Processing on workpiece, the laser spot diameter that each described laser pulse is had on described workpiece is all less than described effective kerf width, and described method comprises:
From a travelling table navigation system, the relative motion relevant with workbench of a laser spot position is delivered on the described workpiece with speed and the acceleration that travelling table limits;
From a quick positioning system, with the speed and the acceleration of quick qualification, the quick relative motion of described laser spot position is delivered on the described workpiece, this quick positioning system has than the high acceleration capacity of described travelling table navigation system;
In conjunction with described travelling table navigation system and quick positioning system, with first group of speed and acceleration that limits, the principal phase of described laser spot position is delivered on the described workpiece motion, the beam position path of the described laser spot position on described travelling table navigation system is provided with from laser instrument to described workpiece, described principal phase limits main machining path to motion; With
From a quick deflection mirror along location, described beam position path, with second group of speed and the acceleration that is significantly higher than first group of speed and acceleration, the auxiliary relative motion of described laser spot position is delivered on the described workpiece, should auxiliary relative motion be added to described principal phase to moving upward and not being integrated with it, and comprise perpendicular to described main machining path, figure with dimension of picture, this dimension of picture is less than or equal to 15 times described laser spot diameter, described principal phase is to motion and auxiliary relative motion cooperation and provide described effective kerf width along described main machining path, and this effective kerf width equals described dimension of picture and adds described spot diameter.
16. according to the method for claim 15, wherein said second group comprises greater than the speed of 1000 mm/second and greater than the acceleration of 1000g.
17. according to the method for claim 16, wherein said second group of speed and acceleration from 1000g to 30000g that comprises from 1000 mm/second to 4000 mm/second.
18. according to the method for claim 15, the speed of wherein said quick qualification and acceleration comprise less than the speed of 500 mm/second and less than the acceleration of 500g.
19. according to the method for claim 15, wherein said quick deflection mirror comprises the speculum that lead magnesium niobate or piezoelectric type are regulated.
20. according to the method for claim 15, wherein said quick positioner comprises a galvanometer driven mirror at least.
21. according to the method for claim 15, wherein said travelling table navigation system comprises division axle navigation system.
22. according to the method for claim 15, it further comprises with laser output pulse implements the via hole drilling operation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34861302P | 2002-01-11 | 2002-01-11 | |
| US60/348,613 | 2002-01-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1612793A CN1612793A (en) | 2005-05-04 |
| CN1299873C true CN1299873C (en) | 2007-02-14 |
Family
ID=23368777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB038019914A Expired - Lifetime CN1299873C (en) | 2002-01-11 | 2003-01-10 | Method for laser machining a workpiece with laser spot enlargement |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JP4340745B2 (en) |
| KR (1) | KR100982677B1 (en) |
| CN (1) | CN1299873C (en) |
| AU (1) | AU2003214818A1 (en) |
| CA (1) | CA2469520A1 (en) |
| DE (1) | DE10392185T5 (en) |
| GB (1) | GB2397545B (en) |
| TW (1) | TW564196B (en) |
| WO (1) | WO2003059568A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104981318A (en) * | 2013-02-13 | 2015-10-14 | 住友化学株式会社 | Laser irradiation device and method of manufacturing laminate optical member |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004059721A1 (en) * | 2004-12-11 | 2006-05-04 | Carl Baasel Lasertechnik Gmbh & Co. Kg | Irrigation hose has several longitudinal discharge openings formed by sectional grooves in hose wall whereby flow limiter is arranged at inside portion of hose |
| CN100462181C (en) * | 2006-10-30 | 2009-02-18 | 西安交通大学 | Femto-second laser ture three-D micro-nano-processing center |
| US7663269B2 (en) * | 2006-12-13 | 2010-02-16 | A-Tech Corporation | High bandwidth linear actuator for steering mirror applications |
| DE102007012815B4 (en) | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Method and device for forming a die |
| US20090312859A1 (en) * | 2008-06-16 | 2009-12-17 | Electro Scientific Industries, Inc. | Modifying entry angles associated with circular tooling actions to improve throughput in part machining |
| TWI594828B (en) | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method |
| DE102009044316B4 (en) | 2009-10-22 | 2015-04-30 | Ewag Ag | Method for producing a surface and / or edge on a blank and laser processing device for carrying out the method |
| US8338745B2 (en) * | 2009-12-07 | 2012-12-25 | Panasonic Corporation | Apparatus and methods for drilling holes with no taper or reverse taper |
| KR102253017B1 (en) * | 2010-10-22 | 2021-05-20 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser processing systems and methods for beam dithering and skiving |
| CN102069298A (en) * | 2010-12-20 | 2011-05-25 | 珠海市铭语自动化设备有限公司 | Laser cutting system for plates and cutting processing method thereof |
| CN102566590B (en) * | 2011-03-14 | 2014-03-26 | 北京国科世纪激光技术有限公司 | Intelligent adjusting system and method for optical element |
| CN103100797B (en) * | 2013-01-23 | 2015-09-09 | 刘茂珍 | Based on laser assisted microprocessing equipment and the method for adaptive optics |
| GB2511064A (en) | 2013-02-21 | 2014-08-27 | M Solv Ltd | Method of forming electrode structure for capacitive touch sensor |
| GB2514084B (en) * | 2013-02-21 | 2016-07-27 | M-Solv Ltd | Method of forming an electrode structure for capacitive touch sensor |
| WO2014150604A1 (en) * | 2013-03-15 | 2014-09-25 | Electro Scientific Industries, Inc. | Coordination of beam angle and workpiece movement for taper control |
| IT201600070259A1 (en) * | 2016-07-06 | 2018-01-06 | Adige Spa | Process of laser processing of a metal material with control of the position of the optical axis of the laser with respect to a flow of assistance gas, as well as a machine and computer program for carrying out such a process. |
| CN107876981B (en) * | 2017-11-20 | 2019-08-20 | 张家港初恒激光科技有限公司 | A kind of follow-on laser welding machining workstation |
| CN109579690A (en) * | 2018-12-04 | 2019-04-05 | 天津津航技术物理研究所 | A kind of high-precision angular displacement detecting device for fast anti-mirror image stabilization system |
| CN112122776A (en) * | 2020-09-23 | 2020-12-25 | 苏州科韵激光科技有限公司 | Nonlinear shape processing system and method based on high-speed rotating reflector |
| KR102497645B1 (en) * | 2021-06-23 | 2023-02-08 | 인하대학교 산학협력단 | Method of laser machine the mold surface |
| EP4137263A1 (en) * | 2021-08-20 | 2023-02-22 | Bystronic Laser AG | Support for a transmissive optical element, laser processing device with such support, and process of adjusting the position of a transmissive optical element using such support |
| CN113897608A (en) * | 2021-10-23 | 2022-01-07 | 河南省锅炉压力容器安全检测研究院 | Laser surface strengthening processing equipment for valve sealing surface |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992012820A1 (en) * | 1991-01-17 | 1992-08-06 | United Distillers Plc | Dynamic laser marking |
| US5484982A (en) * | 1992-01-31 | 1996-01-16 | Fanuc Ltd. | Beam axis adjusting method for a laser robot |
| JPH0885866A (en) * | 1994-09-16 | 1996-04-02 | Sumitomo Metal Mining Co Ltd | Production of ito sintered compact |
| US5798927A (en) * | 1995-03-20 | 1998-08-25 | Electro Scientific Industries, Inc. | Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system |
| CN1213440A (en) * | 1996-03-12 | 1999-04-07 | 电科学工业公司 | Mutli-tool positioning system |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54116356A (en) * | 1978-03-03 | 1979-09-10 | Hitachi Ltd | Welding method by laser |
| FR2577052B1 (en) * | 1985-02-05 | 1988-09-09 | Bertin & Cie | METHOD AND DEVICE FOR MOVING THE POINT OF IMPACT OF A LASER BEAM ON A WORKPIECE |
| JP3060813B2 (en) | 1993-12-28 | 2000-07-10 | トヨタ自動車株式会社 | Laser processing equipment |
| WO2001074529A2 (en) | 2000-03-30 | 2001-10-11 | Electro Scientific Industries, Inc. | Laser system and method for single pass micromachining of multilayer workpieces |
-
2003
- 2003-01-10 CN CNB038019914A patent/CN1299873C/en not_active Expired - Lifetime
- 2003-01-10 DE DE10392185T patent/DE10392185T5/en not_active Ceased
- 2003-01-10 GB GB0412827A patent/GB2397545B/en not_active Expired - Fee Related
- 2003-01-10 KR KR1020047010540A patent/KR100982677B1/en active IP Right Grant
- 2003-01-10 JP JP2003559716A patent/JP4340745B2/en not_active Expired - Lifetime
- 2003-01-10 AU AU2003214818A patent/AU2003214818A1/en not_active Abandoned
- 2003-01-10 WO PCT/US2003/000686 patent/WO2003059568A1/en active Application Filing
- 2003-01-10 CA CA002469520A patent/CA2469520A1/en not_active Abandoned
- 2003-01-10 TW TW092100478A patent/TW564196B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992012820A1 (en) * | 1991-01-17 | 1992-08-06 | United Distillers Plc | Dynamic laser marking |
| US5484982A (en) * | 1992-01-31 | 1996-01-16 | Fanuc Ltd. | Beam axis adjusting method for a laser robot |
| JPH0885866A (en) * | 1994-09-16 | 1996-04-02 | Sumitomo Metal Mining Co Ltd | Production of ito sintered compact |
| US5798927A (en) * | 1995-03-20 | 1998-08-25 | Electro Scientific Industries, Inc. | Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system |
| CN1213440A (en) * | 1996-03-12 | 1999-04-07 | 电科学工业公司 | Mutli-tool positioning system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104981318A (en) * | 2013-02-13 | 2015-10-14 | 住友化学株式会社 | Laser irradiation device and method of manufacturing laminate optical member |
| TWI607815B (en) * | 2013-02-13 | 2017-12-11 | 住友化學股份有限公司 | Laser beam irradiation apparatus and apparatus for manufacturing optical member affixed body |
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| Publication number | Publication date |
|---|---|
| GB2397545B (en) | 2005-05-11 |
| AU2003214818A1 (en) | 2003-07-30 |
| KR20040073542A (en) | 2004-08-19 |
| JP2005532908A (en) | 2005-11-04 |
| WO2003059568A1 (en) | 2003-07-24 |
| TW200301718A (en) | 2003-07-16 |
| GB0412827D0 (en) | 2004-07-14 |
| TW564196B (en) | 2003-12-01 |
| GB2397545A (en) | 2004-07-28 |
| DE10392185T5 (en) | 2004-12-02 |
| CA2469520A1 (en) | 2003-07-24 |
| JP4340745B2 (en) | 2009-10-07 |
| CN1612793A (en) | 2005-05-04 |
| KR100982677B1 (en) | 2010-09-17 |
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