CN102069298A - Laser cutting system for plates and cutting processing method thereof - Google Patents
Laser cutting system for plates and cutting processing method thereof Download PDFInfo
- Publication number
- CN102069298A CN102069298A CN2010105958201A CN201010595820A CN102069298A CN 102069298 A CN102069298 A CN 102069298A CN 2010105958201 A CN2010105958201 A CN 2010105958201A CN 201010595820 A CN201010595820 A CN 201010595820A CN 102069298 A CN102069298 A CN 102069298A
- Authority
- CN
- China
- Prior art keywords
- laser
- plate
- diced system
- plates
- lifting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a laser cutting system for plates and a cutting processing method thereof, wherein the laser cutting system for plates comprises an installation seat, a laser focusing component and a high-speed lifting driving device, and the laser cutting processing method for plates comprises the following steps: (a) placing the plates to be cut on a processing platform, wherein the laser cutting system for plates is arranged in the position above the processing platform; and (b) generating relative motion between the processing platform and the laser cutting system for plates in the horizontal direction according to setting, wherein at the same time, the laser focusing component of the laser cutting system for plates makes high-speed up and down lifting circulating motion under the driving action of the high-speed lifting driving device, thereby cutting the plates. The laser cutting system for plates provided by the invention has the advantages of simple composition and low manufacturing cost, the cutting efficiency of the cutting processing method can be greatly enhanced, the processing speed is high, and the obtained cut product has the advantages of better edge effect, level cut notch and high yield.
Description
Technical field
The present invention relates to used equipment of a kind of sheet material process and using method thereof, particularly a kind of plate with laser diced system and cutting process method thereof.
Background technology
Laser cutting system is a kind of equipment of often using in the sheet material process.This laser cutting system energy is very concentrated, the very little even not distortion of the distortion that during cutting sheet material is caused.Utilize laser cutting system can cut the sheet material of complicated shape very exactly, and do not need further processing procedure.But present laser cutting system generally only is suitable for the less sheet material of thickness is processed processing, for the bigger sheet material of thickness, is subjected to the influence of factors such as depth of focus, and the effect of cutting products obtained therefrom can be relatively poor.
With the glass product is the example explanation, because glass is especially responsive to the influence of depth of focus, therefore to obtain quality cutting products preferably, people generally need carry out the layering cutting to glass, concrete grammar is that the depth of cut of whenever finishing a certain size is just adjusted once the position of focusing, make the focal position move down one section less distance, and then cut, constantly circulation.The method efficient of this layering cutting is very low, waste time and energy, and because the repeatability of movement locus is had relatively high expectations, therefore higher to the required precision of position control assembly, cost of manufacture is bigger.If the control inaccuracy just can error as easy as rolling off a logly occur so, influences cutting effect.
In sum, also do not have a kind of suitable laser cutting system that the bigger sheet material of thickness is cut at present, do not have a kind of suitable Laser cutting method to make that the bigger sheet material cutting work of thickness is more convenient yet.
Summary of the invention
For addressing the above problem, the invention provides a kind of plate with laser diced system and cutting process method thereof, this diced system is formed simple, cost of manufacture is lower, cutting process method based on this diced system can cut the bigger sheet material of thickness quickly and easily, good cutting effect can disposablely be cut and be worn, and efficient gets a promotion.
An aspect according to the object of the invention, the invention provides a kind of plate with laser diced system, comprise mount pad, laser focusing block and high speed lifting drive, affiliated high speed lifting drive is fixedly installed on the mount pad, and the mobile lifting drive end of high speed lifting drive is fixedlyed connected with the laser focusing block.
Preferably, described mount pad is to comprise at least one top board and one and the structure of the affixed side plate of top board, described high speed lifting drive comprises a lifting limited device that is provided with the drive motors of mobile lifting drive end and is arranged at the drive motors below and is connected with the mobile lifting drive end of drive motors, described laser focusing block is fixedly installed in the below of lifting limited device, described side plate is provided with a line slide rail of vertically installing, described lifting limited device be provided with one with the corresponding chute of line slide rail, described lifting limited device is fastened on the line slide rail by chute, described drive motors, lifting limited device and the coaxial setting of laser focusing block are provided with a laser via that leads to the laser focusing block in described drive motors and the lifting limited device.
Further preferably, described mount pad also comprises affixed with side plate and parallel with a top board base plate that is oppositely arranged, the amasthenic lens that described laser focusing block comprises connecting duct and is fixed in the connecting duct below, described connecting duct is fixed in the below of lifting limited device and connects with laser via, the base plate of mount pad be provided with one with the big or small corresponding spacing hole of connecting duct, described connecting duct passes the below that spacing hole extends to base plate.
Described drive motors is a voice coil motor.
According to another aspect of the object of the invention, the invention provides a kind of plate with laser cutting process method, may further comprise the steps:
(a) sheet material to be cut is positioned on the processing platform, the plate with laser diced system is arranged at the top position of processing platform;
(b) processing platform and plate with laser diced system produce relative motion in the horizontal direction according to setting, simultaneously, the laser focusing block of plate with laser diced system carries out oscilaltion shuttling movement at a high speed under the driving effect of high speed lifting drive, the focus of laser along with the motion of laser part constantly up and down circulation move, realize cutting to sheet material.
Wherein, processing platform and the relative motion mode of plate with laser diced system are combining of processing platform horizontal movement mode or plate with laser diced system horizontal movement mode or the two in the step (b).
The invention has the beneficial effects as follows: the composition of plate with laser diced system of the present invention is simple, parts wherein can utilize existing parts to realize easily, cost of manufacture is low, during normal operation, laser focusing block wherein can be told the lifting do action with the high speed lifting drive, because the laser focusing block has determined the position of laser spot, therefore laser spot also can circulation variation back and forth in certain depth bounds constantly when laser focusing block Circularly liftable, motion frequency by the oscilaltion of control high speed lifting drive, the speed of related movement that cooperates sheet material to be processed and laser cutting system, so under the focus effect that constantly changes, even also can disposablely cutting, wears the sheet material that thickness is bigger, do not need the layering cutting, and then by controlling the relative motion path of sheet material and laser cutting system, just can once obtain the cutting finished product of required form, from above process as can be seen, cutting efficiency based on the cutting process method of laser cutting system of the present invention can get a promotion greatly, process velocity is fast, because it is once to cut the process of wearing, and the cutting work at sheet material different-thickness place is that the focus by different depth realizes, therefore the cutting products edge effect of gained is better, otch is smooth, the yield rate height.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples:
Fig. 1 is the overall structure schematic diagram of plate with laser diced system of the present invention;
Fig. 2 is the decomposition texture schematic diagram of plate with laser diced system of the present invention;
Fig. 3 is that cutting process method of the present invention is used schematic diagram.
The specific embodiment
See figures.1.and.2, a kind of plate with laser diced system of the present invention, comprise mount pad 1, laser focusing block 2 and high speed lifting drive 3, affiliated high speed lifting drive 3 is fixedly installed on the mount pad 1, and the mobile lifting drive end of high speed lifting drive 3 is fixedlyed connected with laser focusing block 2.The present invention is installed on the cutting machine by mount pad 1, mount pad 1 can play and support and spacing effect, the laser that the cutting machine other system is produced is transported on the native system, the control system of cutting machine control high speed lifting drive 3 actions then, constantly change the focal position of laser, make sheet material to cut fully and wear, thus the disposable cutting of realization sheet material.
Structures such as mount pad 1 of the present invention, high speed lifting drive 3 can adopt different forms to realize.As preferred embodiment, described mount pad 1 is to comprise at least one top board 11 and one and the structure of the affixed side plate 12 of top board 11, described high speed lifting drive 3 comprises a lifting limited device 32 that is provided with the drive motors 31 of mobile lifting drive end and is arranged at drive motors 31 belows and is connected with the mobile lifting drive end of drive motors 31, described laser focusing block 2 is fixedly installed in the below of lifting limited device 32, described side plate 12 is provided with a line slide rail 13 of vertically installing, described lifting limited device 32 be provided with one with line slide rail 13 corresponding chutes 33, described lifting limited device 32 is fastened on the line slide rail 13 by chute 33, described drive motors 31, lifting limited device 32 and the 2 coaxial settings of laser focusing block are provided with a laser via 34 that leads to laser focusing block 2 in described drive motors 31 and the lifting limited device 32.
During practical application, because the effect of drive motors 31 mainly is the vertical tremor function that realizes high frequency, therefore comparatively suitable drive motors is to adopt voice coil motor, utilize the driving effect laser focusing block 2 of voice coil motor can be in one second oscilaltion 100 times, certainly, the driving frequency of voice coil motor can be configured according to different situations, and the otch of sheet material can become more smooth along with the increase of voice coil motor driving frequency.
In addition, because laser focusing block 2 is to be connected on the mobile lifting drive end of drive motors 31 by lifting limited device 32, and lifting limited device 32 is to be fastened on the line slide rail 13 by chute 33, under the spacing guide effect of this chute 33 and line slide rail 13, the vertical tremor process of laser focusing block 2 can be stablized more reliable more.
Be provided with a laser via 34 that leads to laser focusing block 2 in drive motors 31 and the lifting limited device 32, laser can directly arrive in the laser focusing block 2 by this laser via 34, overall structure of the present invention is compact more, and the transmission path of laser also is easy to control more.
On the basis of above-mentioned preferred embodiment, the present invention can also be further improved: mount pad 1 also comprise one affixed with side plate 12 and with the top board 11 parallel base plates that are oppositely arranged 14, the amasthenic lens 22 that described laser focusing block 2 comprises connecting duct 21 and is fixed in connecting duct 21 belows, described connecting duct 21 is fixed in the below of lifting limited device 32 and connects with laser via 34, the base plate 14 of mount pad 1 be provided with one with the big or small corresponding spacing hole 15 of connecting duct 21, described connecting duct 21 passes the below that spacing hole 15 extends to base plate 14.Because connecting duct 21 is subjected to the restriction of spacing hole 15, so the course of action of laser focusing block 2 can be more reliable and more stable, in addition, the part transmission channel that laser focusing block 2 also can be used as connecting duct 21 uses.
Fig. 3 is for using the schematic diagram that diced system of the present invention is processed, the sheet material to be cut of A (can be products such as glass, stainless steel) wherein, the laser beam of B for bringing from the cutting machine other system.The plate with laser diced system carries out cutting processing according to following step:
(a) sheet material A to be cut is positioned on the processing platform (not drawing among the figure), the plate with laser diced system is arranged at the top position of processing platform;
(b) processing platform and plate with laser diced system produce relative motion in the horizontal direction according to setting, processing platform and the relative motion mode of plate with laser diced system are combining of processing platform horizontal movement mode or plate with laser diced system horizontal movement mode or the two, simultaneously, the laser focusing block of plate with laser diced system carries out oscilaltion shuttling movement at a high speed under the driving effect of high speed lifting drive, the focus of laser B is along with the motion of laser part constantly circulates mobile up and down, realization is to the cutting of sheet material, usually, when speed of related movement during at 500MM/S, laser cutting system up-down vibration 30 times, perhaps can satisfy the needs of cutting 50 times, both edge effects can be different certainly.
Utilize the cutting products edge effect of cutting process method gained of the present invention better, otch is smooth, the yield rate height.
Embodiments of the present invention are not restricted to the described embodiments, as long as it reaches technique effect of the present invention with essentially identical means, all should belong to protection scope of the present invention.
Claims (6)
1. plate with laser diced system, it is characterized in that comprising mount pad (1), laser focusing block (2) and high speed lifting drive (3), affiliated high speed lifting drive (3) is fixedly installed on the mount pad (1), and the mobile lifting drive end of high speed lifting drive (3) is fixedlyed connected with laser focusing block (2).
2. a kind of plate with laser diced system according to claim 1, it is characterized in that described mount pad (1) is to comprise at least one top board (11) and one and the structure of the affixed side plate (12) of top board (11), described high speed lifting drive (3) comprises a lifting limited device (32) that is provided with the drive motors (31) of mobile lifting drive end and is arranged at drive motors (31) below and is connected with the mobile lifting drive end of drive motors (31), described laser focusing block (2) is fixedly installed in the below of lifting limited device (32), described side plate (12) is provided with a line slide rail (13) of vertically installing, described lifting limited device (32) be provided with one with the corresponding chute of line slide rail (13) (33), described lifting limited device (32) is fastened on the line slide rail (13) by chute (33), described drive motors (31), lifting limited device (32) and the coaxial setting of laser focusing block (2) are provided with a laser via (34) that leads to laser focusing block (2) in described drive motors (31) and the lifting limited device (32).
3. a kind of plate with laser diced system according to claim 2, it is characterized in that described mount pad (1) also comprise one affixed with side plate (12) and with the parallel base plate that is oppositely arranged of top board (11) (14), the amasthenic lens (22) that described laser focusing block (2) comprises connecting duct (21) and is fixed in connecting duct (21) below, described connecting duct (21) is fixed in the below of lifting limited device (32) and connects with laser via (34), the base plate (14) of mount pad (1) be provided with one with the big or small corresponding spacing hole (15) of connecting duct (21), described connecting duct (21) passes the below that spacing hole (15) extends to base plate (14).
4. a kind of plate with laser diced system according to claim 2 is characterized in that described drive motors (31) is a voice coil motor.
5. plate with laser cutting process method is characterized in that may further comprise the steps:
(a) sheet material to be cut is positioned on the processing platform, the plate with laser diced system is arranged at the top position of processing platform;
(b) processing platform and plate with laser diced system produce relative motion in the horizontal direction according to setting, simultaneously, the laser focusing block of plate with laser diced system carries out oscilaltion shuttling movement at a high speed under the driving effect of high speed lifting drive, the focus of laser along with the motion of laser part constantly up and down circulation move, realize cutting to sheet material.
6. plate with laser cutting process method according to claim 5 is characterized in that processing platform and the relative motion mode of plate with laser diced system in the step (b) are combining of processing platform horizontal movement mode or plate with laser diced system horizontal movement mode or the two.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105958201A CN102069298A (en) | 2010-12-20 | 2010-12-20 | Laser cutting system for plates and cutting processing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105958201A CN102069298A (en) | 2010-12-20 | 2010-12-20 | Laser cutting system for plates and cutting processing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102069298A true CN102069298A (en) | 2011-05-25 |
Family
ID=44028170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105958201A Pending CN102069298A (en) | 2010-12-20 | 2010-12-20 | Laser cutting system for plates and cutting processing method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102069298A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102729377A (en) * | 2012-07-05 | 2012-10-17 | 张家港市民扬塑胶科技有限公司 | PET thick plate width trimming device |
CN103212832A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Medical bracket machining equipment |
CN107570885A (en) * | 2015-11-09 | 2018-01-12 | 常州科乐为数控科技有限公司 | A kind of laser cutting machine |
CN107900513A (en) * | 2017-10-12 | 2018-04-13 | 北京航天控制仪器研究所 | A kind of laser machining head device that can realize high-quality cleaning |
CN110508943A (en) * | 2019-09-07 | 2019-11-29 | 济南镭曼数控设备有限公司 | A kind of laser cutting machine improving working efficiency |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1612793A (en) * | 2002-01-11 | 2005-05-04 | 电子科学工业公司 | Method for laser machining a workpiece with laser spot enlargement |
CN1990153A (en) * | 2005-12-27 | 2007-07-04 | 富士迈半导体精密工业(上海)有限公司 | Laser cutting device |
CN1996197A (en) * | 2006-12-08 | 2007-07-11 | 王世有 | Temperature indicating controller for use in transformer |
US20080007737A1 (en) * | 2006-07-05 | 2008-01-10 | Kazuma Sekiya | Wafer laser processing method |
JP2008068308A (en) * | 2006-09-15 | 2008-03-27 | Keyence Corp | Laser machining apparatus |
DE102009038642A1 (en) * | 2008-08-25 | 2010-03-25 | Disco Corporation | Laser processing device |
CN202053021U (en) * | 2010-12-20 | 2011-11-30 | 珠海市铭语自动化设备有限公司 | Sheet material laser cutting system |
-
2010
- 2010-12-20 CN CN2010105958201A patent/CN102069298A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1612793A (en) * | 2002-01-11 | 2005-05-04 | 电子科学工业公司 | Method for laser machining a workpiece with laser spot enlargement |
CN1990153A (en) * | 2005-12-27 | 2007-07-04 | 富士迈半导体精密工业(上海)有限公司 | Laser cutting device |
US20080007737A1 (en) * | 2006-07-05 | 2008-01-10 | Kazuma Sekiya | Wafer laser processing method |
JP2008068308A (en) * | 2006-09-15 | 2008-03-27 | Keyence Corp | Laser machining apparatus |
CN1996197A (en) * | 2006-12-08 | 2007-07-11 | 王世有 | Temperature indicating controller for use in transformer |
DE102009038642A1 (en) * | 2008-08-25 | 2010-03-25 | Disco Corporation | Laser processing device |
CN202053021U (en) * | 2010-12-20 | 2011-11-30 | 珠海市铭语自动化设备有限公司 | Sheet material laser cutting system |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103212832A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Medical bracket machining equipment |
CN103212832B (en) * | 2012-01-19 | 2016-12-14 | 昆山思拓机器有限公司 | The process equipment of Medical rack |
CN102729377A (en) * | 2012-07-05 | 2012-10-17 | 张家港市民扬塑胶科技有限公司 | PET thick plate width trimming device |
CN107570885A (en) * | 2015-11-09 | 2018-01-12 | 常州科乐为数控科技有限公司 | A kind of laser cutting machine |
CN107570885B (en) * | 2015-11-09 | 2019-11-22 | 常州科乐为数控科技有限公司 | A kind of laser cutting machine |
CN111299849A (en) * | 2015-11-09 | 2020-06-19 | 常州科乐为数控科技有限公司 | Laser cutting machine with double swinging heads |
CN111299848A (en) * | 2015-11-09 | 2020-06-19 | 常州科乐为数控科技有限公司 | Laser cutting machine capable of being heightened by follow-up |
CN107900513A (en) * | 2017-10-12 | 2018-04-13 | 北京航天控制仪器研究所 | A kind of laser machining head device that can realize high-quality cleaning |
CN110508943A (en) * | 2019-09-07 | 2019-11-29 | 济南镭曼数控设备有限公司 | A kind of laser cutting machine improving working efficiency |
CN110508943B (en) * | 2019-09-07 | 2021-11-02 | 济南镭曼数控设备有限公司 | Laser cutting machine capable of improving working efficiency |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102069298A (en) | Laser cutting system for plates and cutting processing method thereof | |
CN104475971B (en) | A kind of beam splitting laser multistation timesharing cutting machine and processing method | |
CN209520469U (en) | A kind of laser cutting head apparatus for adjusting position | |
CN105669015A (en) | Photoelectric glass cutting machine | |
CN201737838U (en) | Ultraviolet laser cutting device | |
CN102649198A (en) | Laser machining equipment | |
CN106737061A (en) | A kind of ray machine high with high accuracy and high stability | |
CN101586171A (en) | Leather cutting machine | |
CN103264426B (en) | Full automatic wood processor | |
CN202053021U (en) | Sheet material laser cutting system | |
CN202667926U (en) | Laser machining equipment | |
CN102151889B (en) | Upward cutting and energy-saving inner circle slicing machine with single tool bit | |
CN208132103U (en) | Combined type in length and breadth saw by reciprocal sawing sheet | |
CN101837518A (en) | External optical path aplanatic system of laser cutting machine | |
CN103753647A (en) | Water cutting system driven by linear motors | |
CN201471093U (en) | Numerical control laser and plasma cutting machine with on-board laser | |
CN104485290A (en) | Dynamic characteristic self-adapting matching micro structure array precise processing machine tool | |
CN207681945U (en) | Three axis workbenches | |
CN208067568U (en) | Laser cutting device | |
CN202169470U (en) | Piezoelectric processing device | |
CN103436882B (en) | The making method of wiring board laser filling perforation machine and wiring board | |
CN208147154U (en) | A kind of vertical wide cut multifunction laser machine | |
CN201446276U (en) | Five-blade end face milling machine | |
CN208961270U (en) | A kind of gantry-type laser cutting machine Cutting platform | |
CN208976939U (en) | It is a kind of for cutting the cutting machine of structure-wall pipe material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110525 |