CN102069298A - Laser cutting system for plates and cutting processing method thereof - Google Patents

Laser cutting system for plates and cutting processing method thereof Download PDF

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Publication number
CN102069298A
CN102069298A CN2010105958201A CN201010595820A CN102069298A CN 102069298 A CN102069298 A CN 102069298A CN 2010105958201 A CN2010105958201 A CN 2010105958201A CN 201010595820 A CN201010595820 A CN 201010595820A CN 102069298 A CN102069298 A CN 102069298A
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CN
China
Prior art keywords
laser
plate
diced system
plates
lifting
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Pending
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CN2010105958201A
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Chinese (zh)
Inventor
王纯
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ZHUHAI MY-LASER TECHNOLOGY Co Ltd
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ZHUHAI MY-LASER TECHNOLOGY Co Ltd
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Priority to CN2010105958201A priority Critical patent/CN102069298A/en
Publication of CN102069298A publication Critical patent/CN102069298A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a laser cutting system for plates and a cutting processing method thereof, wherein the laser cutting system for plates comprises an installation seat, a laser focusing component and a high-speed lifting driving device, and the laser cutting processing method for plates comprises the following steps: (a) placing the plates to be cut on a processing platform, wherein the laser cutting system for plates is arranged in the position above the processing platform; and (b) generating relative motion between the processing platform and the laser cutting system for plates in the horizontal direction according to setting, wherein at the same time, the laser focusing component of the laser cutting system for plates makes high-speed up and down lifting circulating motion under the driving action of the high-speed lifting driving device, thereby cutting the plates. The laser cutting system for plates provided by the invention has the advantages of simple composition and low manufacturing cost, the cutting efficiency of the cutting processing method can be greatly enhanced, the processing speed is high, and the obtained cut product has the advantages of better edge effect, level cut notch and high yield.

Description

A kind of plate with laser diced system and cutting process method thereof
Technical field
The present invention relates to used equipment of a kind of sheet material process and using method thereof, particularly a kind of plate with laser diced system and cutting process method thereof.
Background technology
Laser cutting system is a kind of equipment of often using in the sheet material process.This laser cutting system energy is very concentrated, the very little even not distortion of the distortion that during cutting sheet material is caused.Utilize laser cutting system can cut the sheet material of complicated shape very exactly, and do not need further processing procedure.But present laser cutting system generally only is suitable for the less sheet material of thickness is processed processing, for the bigger sheet material of thickness, is subjected to the influence of factors such as depth of focus, and the effect of cutting products obtained therefrom can be relatively poor.
With the glass product is the example explanation, because glass is especially responsive to the influence of depth of focus, therefore to obtain quality cutting products preferably, people generally need carry out the layering cutting to glass, concrete grammar is that the depth of cut of whenever finishing a certain size is just adjusted once the position of focusing, make the focal position move down one section less distance, and then cut, constantly circulation.The method efficient of this layering cutting is very low, waste time and energy, and because the repeatability of movement locus is had relatively high expectations, therefore higher to the required precision of position control assembly, cost of manufacture is bigger.If the control inaccuracy just can error as easy as rolling off a logly occur so, influences cutting effect.
In sum, also do not have a kind of suitable laser cutting system that the bigger sheet material of thickness is cut at present, do not have a kind of suitable Laser cutting method to make that the bigger sheet material cutting work of thickness is more convenient yet.
Summary of the invention
For addressing the above problem, the invention provides a kind of plate with laser diced system and cutting process method thereof, this diced system is formed simple, cost of manufacture is lower, cutting process method based on this diced system can cut the bigger sheet material of thickness quickly and easily, good cutting effect can disposablely be cut and be worn, and efficient gets a promotion.
An aspect according to the object of the invention, the invention provides a kind of plate with laser diced system, comprise mount pad, laser focusing block and high speed lifting drive, affiliated high speed lifting drive is fixedly installed on the mount pad, and the mobile lifting drive end of high speed lifting drive is fixedlyed connected with the laser focusing block.
Preferably, described mount pad is to comprise at least one top board and one and the structure of the affixed side plate of top board, described high speed lifting drive comprises a lifting limited device that is provided with the drive motors of mobile lifting drive end and is arranged at the drive motors below and is connected with the mobile lifting drive end of drive motors, described laser focusing block is fixedly installed in the below of lifting limited device, described side plate is provided with a line slide rail of vertically installing, described lifting limited device be provided with one with the corresponding chute of line slide rail, described lifting limited device is fastened on the line slide rail by chute, described drive motors, lifting limited device and the coaxial setting of laser focusing block are provided with a laser via that leads to the laser focusing block in described drive motors and the lifting limited device.
Further preferably, described mount pad also comprises affixed with side plate and parallel with a top board base plate that is oppositely arranged, the amasthenic lens that described laser focusing block comprises connecting duct and is fixed in the connecting duct below, described connecting duct is fixed in the below of lifting limited device and connects with laser via, the base plate of mount pad be provided with one with the big or small corresponding spacing hole of connecting duct, described connecting duct passes the below that spacing hole extends to base plate.
Described drive motors is a voice coil motor.
According to another aspect of the object of the invention, the invention provides a kind of plate with laser cutting process method, may further comprise the steps:
(a) sheet material to be cut is positioned on the processing platform, the plate with laser diced system is arranged at the top position of processing platform;
(b) processing platform and plate with laser diced system produce relative motion in the horizontal direction according to setting, simultaneously, the laser focusing block of plate with laser diced system carries out oscilaltion shuttling movement at a high speed under the driving effect of high speed lifting drive, the focus of laser along with the motion of laser part constantly up and down circulation move, realize cutting to sheet material.
Wherein, processing platform and the relative motion mode of plate with laser diced system are combining of processing platform horizontal movement mode or plate with laser diced system horizontal movement mode or the two in the step (b).
The invention has the beneficial effects as follows: the composition of plate with laser diced system of the present invention is simple, parts wherein can utilize existing parts to realize easily, cost of manufacture is low, during normal operation, laser focusing block wherein can be told the lifting do action with the high speed lifting drive, because the laser focusing block has determined the position of laser spot, therefore laser spot also can circulation variation back and forth in certain depth bounds constantly when laser focusing block Circularly liftable, motion frequency by the oscilaltion of control high speed lifting drive, the speed of related movement that cooperates sheet material to be processed and laser cutting system, so under the focus effect that constantly changes, even also can disposablely cutting, wears the sheet material that thickness is bigger, do not need the layering cutting, and then by controlling the relative motion path of sheet material and laser cutting system, just can once obtain the cutting finished product of required form, from above process as can be seen, cutting efficiency based on the cutting process method of laser cutting system of the present invention can get a promotion greatly, process velocity is fast, because it is once to cut the process of wearing, and the cutting work at sheet material different-thickness place is that the focus by different depth realizes, therefore the cutting products edge effect of gained is better, otch is smooth, the yield rate height.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples:
Fig. 1 is the overall structure schematic diagram of plate with laser diced system of the present invention;
Fig. 2 is the decomposition texture schematic diagram of plate with laser diced system of the present invention;
Fig. 3 is that cutting process method of the present invention is used schematic diagram.
The specific embodiment
See figures.1.and.2, a kind of plate with laser diced system of the present invention, comprise mount pad 1, laser focusing block 2 and high speed lifting drive 3, affiliated high speed lifting drive 3 is fixedly installed on the mount pad 1, and the mobile lifting drive end of high speed lifting drive 3 is fixedlyed connected with laser focusing block 2.The present invention is installed on the cutting machine by mount pad 1, mount pad 1 can play and support and spacing effect, the laser that the cutting machine other system is produced is transported on the native system, the control system of cutting machine control high speed lifting drive 3 actions then, constantly change the focal position of laser, make sheet material to cut fully and wear, thus the disposable cutting of realization sheet material.
Structures such as mount pad 1 of the present invention, high speed lifting drive 3 can adopt different forms to realize.As preferred embodiment, described mount pad 1 is to comprise at least one top board 11 and one and the structure of the affixed side plate 12 of top board 11, described high speed lifting drive 3 comprises a lifting limited device 32 that is provided with the drive motors 31 of mobile lifting drive end and is arranged at drive motors 31 belows and is connected with the mobile lifting drive end of drive motors 31, described laser focusing block 2 is fixedly installed in the below of lifting limited device 32, described side plate 12 is provided with a line slide rail 13 of vertically installing, described lifting limited device 32 be provided with one with line slide rail 13 corresponding chutes 33, described lifting limited device 32 is fastened on the line slide rail 13 by chute 33, described drive motors 31, lifting limited device 32 and the 2 coaxial settings of laser focusing block are provided with a laser via 34 that leads to laser focusing block 2 in described drive motors 31 and the lifting limited device 32.
During practical application, because the effect of drive motors 31 mainly is the vertical tremor function that realizes high frequency, therefore comparatively suitable drive motors is to adopt voice coil motor, utilize the driving effect laser focusing block 2 of voice coil motor can be in one second oscilaltion 100 times, certainly, the driving frequency of voice coil motor can be configured according to different situations, and the otch of sheet material can become more smooth along with the increase of voice coil motor driving frequency.
In addition, because laser focusing block 2 is to be connected on the mobile lifting drive end of drive motors 31 by lifting limited device 32, and lifting limited device 32 is to be fastened on the line slide rail 13 by chute 33, under the spacing guide effect of this chute 33 and line slide rail 13, the vertical tremor process of laser focusing block 2 can be stablized more reliable more.
Be provided with a laser via 34 that leads to laser focusing block 2 in drive motors 31 and the lifting limited device 32, laser can directly arrive in the laser focusing block 2 by this laser via 34, overall structure of the present invention is compact more, and the transmission path of laser also is easy to control more.
On the basis of above-mentioned preferred embodiment, the present invention can also be further improved: mount pad 1 also comprise one affixed with side plate 12 and with the top board 11 parallel base plates that are oppositely arranged 14, the amasthenic lens 22 that described laser focusing block 2 comprises connecting duct 21 and is fixed in connecting duct 21 belows, described connecting duct 21 is fixed in the below of lifting limited device 32 and connects with laser via 34, the base plate 14 of mount pad 1 be provided with one with the big or small corresponding spacing hole 15 of connecting duct 21, described connecting duct 21 passes the below that spacing hole 15 extends to base plate 14.Because connecting duct 21 is subjected to the restriction of spacing hole 15, so the course of action of laser focusing block 2 can be more reliable and more stable, in addition, the part transmission channel that laser focusing block 2 also can be used as connecting duct 21 uses.
Fig. 3 is for using the schematic diagram that diced system of the present invention is processed, the sheet material to be cut of A (can be products such as glass, stainless steel) wherein, the laser beam of B for bringing from the cutting machine other system.The plate with laser diced system carries out cutting processing according to following step:
(a) sheet material A to be cut is positioned on the processing platform (not drawing among the figure), the plate with laser diced system is arranged at the top position of processing platform;
(b) processing platform and plate with laser diced system produce relative motion in the horizontal direction according to setting, processing platform and the relative motion mode of plate with laser diced system are combining of processing platform horizontal movement mode or plate with laser diced system horizontal movement mode or the two, simultaneously, the laser focusing block of plate with laser diced system carries out oscilaltion shuttling movement at a high speed under the driving effect of high speed lifting drive, the focus of laser B is along with the motion of laser part constantly circulates mobile up and down, realization is to the cutting of sheet material, usually, when speed of related movement during at 500MM/S, laser cutting system up-down vibration 30 times, perhaps can satisfy the needs of cutting 50 times, both edge effects can be different certainly.
Utilize the cutting products edge effect of cutting process method gained of the present invention better, otch is smooth, the yield rate height.
Embodiments of the present invention are not restricted to the described embodiments, as long as it reaches technique effect of the present invention with essentially identical means, all should belong to protection scope of the present invention.

Claims (6)

1. plate with laser diced system, it is characterized in that comprising mount pad (1), laser focusing block (2) and high speed lifting drive (3), affiliated high speed lifting drive (3) is fixedly installed on the mount pad (1), and the mobile lifting drive end of high speed lifting drive (3) is fixedlyed connected with laser focusing block (2).
2. a kind of plate with laser diced system according to claim 1, it is characterized in that described mount pad (1) is to comprise at least one top board (11) and one and the structure of the affixed side plate (12) of top board (11), described high speed lifting drive (3) comprises a lifting limited device (32) that is provided with the drive motors (31) of mobile lifting drive end and is arranged at drive motors (31) below and is connected with the mobile lifting drive end of drive motors (31), described laser focusing block (2) is fixedly installed in the below of lifting limited device (32), described side plate (12) is provided with a line slide rail (13) of vertically installing, described lifting limited device (32) be provided with one with the corresponding chute of line slide rail (13) (33), described lifting limited device (32) is fastened on the line slide rail (13) by chute (33), described drive motors (31), lifting limited device (32) and the coaxial setting of laser focusing block (2) are provided with a laser via (34) that leads to laser focusing block (2) in described drive motors (31) and the lifting limited device (32).
3. a kind of plate with laser diced system according to claim 2, it is characterized in that described mount pad (1) also comprise one affixed with side plate (12) and with the parallel base plate that is oppositely arranged of top board (11) (14), the amasthenic lens (22) that described laser focusing block (2) comprises connecting duct (21) and is fixed in connecting duct (21) below, described connecting duct (21) is fixed in the below of lifting limited device (32) and connects with laser via (34), the base plate (14) of mount pad (1) be provided with one with the big or small corresponding spacing hole (15) of connecting duct (21), described connecting duct (21) passes the below that spacing hole (15) extends to base plate (14).
4. a kind of plate with laser diced system according to claim 2 is characterized in that described drive motors (31) is a voice coil motor.
5. plate with laser cutting process method is characterized in that may further comprise the steps:
(a) sheet material to be cut is positioned on the processing platform, the plate with laser diced system is arranged at the top position of processing platform;
(b) processing platform and plate with laser diced system produce relative motion in the horizontal direction according to setting, simultaneously, the laser focusing block of plate with laser diced system carries out oscilaltion shuttling movement at a high speed under the driving effect of high speed lifting drive, the focus of laser along with the motion of laser part constantly up and down circulation move, realize cutting to sheet material.
6. plate with laser cutting process method according to claim 5 is characterized in that processing platform and the relative motion mode of plate with laser diced system in the step (b) are combining of processing platform horizontal movement mode or plate with laser diced system horizontal movement mode or the two.
CN2010105958201A 2010-12-20 2010-12-20 Laser cutting system for plates and cutting processing method thereof Pending CN102069298A (en)

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CN2010105958201A CN102069298A (en) 2010-12-20 2010-12-20 Laser cutting system for plates and cutting processing method thereof

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Application Number Priority Date Filing Date Title
CN2010105958201A CN102069298A (en) 2010-12-20 2010-12-20 Laser cutting system for plates and cutting processing method thereof

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102729377A (en) * 2012-07-05 2012-10-17 张家港市民扬塑胶科技有限公司 PET thick plate width trimming device
CN103212832A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Medical bracket machining equipment
CN107570885A (en) * 2015-11-09 2018-01-12 常州科乐为数控科技有限公司 A kind of laser cutting machine
CN107900513A (en) * 2017-10-12 2018-04-13 北京航天控制仪器研究所 A kind of laser machining head device that can realize high-quality cleaning
CN110508943A (en) * 2019-09-07 2019-11-29 济南镭曼数控设备有限公司 A kind of laser cutting machine improving working efficiency

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CN1612793A (en) * 2002-01-11 2005-05-04 电子科学工业公司 Method for laser machining a workpiece with laser spot enlargement
CN1990153A (en) * 2005-12-27 2007-07-04 富士迈半导体精密工业(上海)有限公司 Laser cutting device
CN1996197A (en) * 2006-12-08 2007-07-11 王世有 Temperature indicating controller for use in transformer
US20080007737A1 (en) * 2006-07-05 2008-01-10 Kazuma Sekiya Wafer laser processing method
JP2008068308A (en) * 2006-09-15 2008-03-27 Keyence Corp Laser machining apparatus
DE102009038642A1 (en) * 2008-08-25 2010-03-25 Disco Corporation Laser processing device
CN202053021U (en) * 2010-12-20 2011-11-30 珠海市铭语自动化设备有限公司 Sheet material laser cutting system

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Publication number Priority date Publication date Assignee Title
CN1612793A (en) * 2002-01-11 2005-05-04 电子科学工业公司 Method for laser machining a workpiece with laser spot enlargement
CN1990153A (en) * 2005-12-27 2007-07-04 富士迈半导体精密工业(上海)有限公司 Laser cutting device
US20080007737A1 (en) * 2006-07-05 2008-01-10 Kazuma Sekiya Wafer laser processing method
JP2008068308A (en) * 2006-09-15 2008-03-27 Keyence Corp Laser machining apparatus
CN1996197A (en) * 2006-12-08 2007-07-11 王世有 Temperature indicating controller for use in transformer
DE102009038642A1 (en) * 2008-08-25 2010-03-25 Disco Corporation Laser processing device
CN202053021U (en) * 2010-12-20 2011-11-30 珠海市铭语自动化设备有限公司 Sheet material laser cutting system

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103212832A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Medical bracket machining equipment
CN103212832B (en) * 2012-01-19 2016-12-14 昆山思拓机器有限公司 The process equipment of Medical rack
CN102729377A (en) * 2012-07-05 2012-10-17 张家港市民扬塑胶科技有限公司 PET thick plate width trimming device
CN107570885A (en) * 2015-11-09 2018-01-12 常州科乐为数控科技有限公司 A kind of laser cutting machine
CN107570885B (en) * 2015-11-09 2019-11-22 常州科乐为数控科技有限公司 A kind of laser cutting machine
CN111299849A (en) * 2015-11-09 2020-06-19 常州科乐为数控科技有限公司 Laser cutting machine with double swinging heads
CN111299848A (en) * 2015-11-09 2020-06-19 常州科乐为数控科技有限公司 Laser cutting machine capable of being heightened by follow-up
CN107900513A (en) * 2017-10-12 2018-04-13 北京航天控制仪器研究所 A kind of laser machining head device that can realize high-quality cleaning
CN110508943A (en) * 2019-09-07 2019-11-29 济南镭曼数控设备有限公司 A kind of laser cutting machine improving working efficiency
CN110508943B (en) * 2019-09-07 2021-11-02 济南镭曼数控设备有限公司 Laser cutting machine capable of improving working efficiency

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Application publication date: 20110525