CA2468615A1 - Procede de fabrication de transistors non lithographiques a autoalignement avec des longueurs de canal ultracourtes - Google Patents
Procede de fabrication de transistors non lithographiques a autoalignement avec des longueurs de canal ultracourtes Download PDFInfo
- Publication number
- CA2468615A1 CA2468615A1 CA002468615A CA2468615A CA2468615A1 CA 2468615 A1 CA2468615 A1 CA 2468615A1 CA 002468615 A CA002468615 A CA 002468615A CA 2468615 A CA2468615 A CA 2468615A CA 2468615 A1 CA2468615 A1 CA 2468615A1
- Authority
- CA
- Canada
- Prior art keywords
- transistors
- adjusted
- channel lengths
- lithographic
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000005669 field effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
- H01L21/823456—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different shapes, lengths or dimensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823418—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
La présente invention concerne un procédé de fabrication de transistors à longueur de canal ultracourte dans lequel le dépôt des électrodes de source, de drain et de grille peut s'effectuer lors d'une première étape selon une technologie de l'état antérieur de la technique limitant les dimensions de l'électrode en fonction des règles de dessin applicables, tandis que les dimensions d'une de ces électrodes sur deux peuvent être ajustées selon les besoins lors des étapes de traitement subséquentes. Selon le procédé précité, on forme une zone de canal entre une électrode de source et une électrode de drain sans être limité par une quelconque règle de dessin, ce qui permet de former des canaux de transistor possédant des longueurs de canal L extrêmement courtes, bien inférieures à 10 nm, par exemple. On peut ajuster la largeur des électrodes de grille proportionnellement afin d'obtenir une grande largeur de canal W et obtenir de la sorte des transistors possédant des rapports de forme longueur/diamètre presque arbitrairement élevés et, partant, des caractéristiques de commutation et de courant désirées. Le procédé de l'invention peut être utilisé pour fabriquer n'importe quel type de transistor à effet de champ, même sur le même substrat et il peut également être adapté à la fabrication d'autres types de structures de transistors.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20015837 | 2001-11-29 | ||
NO20015837A NO314738B1 (no) | 2001-11-29 | 2001-11-29 | Fremgangsmåte til fremstilling av selvregistrerende ikke- litografiske transistorer med ultrakorte kanallengder |
PCT/NO2002/000397 WO2003046921A1 (fr) | 2001-11-29 | 2002-11-01 | Procede de fabrication de transistors non lithographiques a autoalignement avec des longueurs de canal ultracourtes |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2468615A1 true CA2468615A1 (fr) | 2003-06-05 |
CA2468615C CA2468615C (fr) | 2007-03-20 |
Family
ID=19913080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002468615A Expired - Fee Related CA2468615C (fr) | 2001-11-29 | 2002-11-01 | Procede de fabrication de transistors non lithographiques a autoalignement avec des longueurs de canal ultracourtes |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1449217A1 (fr) |
JP (1) | JP2005510864A (fr) |
KR (1) | KR100543076B1 (fr) |
CN (1) | CN1599936A (fr) |
AU (1) | AU2002365533A1 (fr) |
CA (1) | CA2468615C (fr) |
NO (1) | NO314738B1 (fr) |
RU (1) | RU2261499C2 (fr) |
WO (1) | WO2003046921A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6724028B2 (en) | 2001-12-10 | 2004-04-20 | Hans Gude Gudesen | Matrix-addressable array of integrated transistor/memory structures |
US6649504B2 (en) | 2001-12-14 | 2003-11-18 | Thin Film Electronics Asa | Method for fabricating high aspect ratio electrodes |
US9035281B2 (en) | 2009-06-30 | 2015-05-19 | Nokia Technologies Oy | Graphene device and method of fabricating a graphene device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4952031A (en) * | 1987-06-19 | 1990-08-28 | Victor Company Of Japan, Ltd. | Liquid crystal display device |
JPH07106450A (ja) * | 1993-10-08 | 1995-04-21 | Olympus Optical Co Ltd | 強誘電体ゲートトランジスタメモリ |
DE69739045D1 (de) * | 1997-08-27 | 2008-11-27 | St Microelectronics Srl | Herstellungsverfahren für elektronische Speicherbauelemente mit virtueller Masse |
US6072716A (en) * | 1999-04-14 | 2000-06-06 | Massachusetts Institute Of Technology | Memory structures and methods of making same |
US6473388B1 (en) * | 2000-08-31 | 2002-10-29 | Hewlett Packard Company | Ultra-high density information storage device based on modulated cathodoconductivity |
-
2001
- 2001-11-29 NO NO20015837A patent/NO314738B1/no unknown
-
2002
- 2002-11-01 KR KR1020047008231A patent/KR100543076B1/ko not_active IP Right Cessation
- 2002-11-01 WO PCT/NO2002/000397 patent/WO2003046921A1/fr not_active Application Discontinuation
- 2002-11-01 RU RU2004118416/28A patent/RU2261499C2/ru not_active IP Right Cessation
- 2002-11-01 JP JP2003548252A patent/JP2005510864A/ja not_active Abandoned
- 2002-11-01 EP EP02803936A patent/EP1449217A1/fr not_active Withdrawn
- 2002-11-01 CN CNA028239601A patent/CN1599936A/zh active Pending
- 2002-11-01 CA CA002468615A patent/CA2468615C/fr not_active Expired - Fee Related
- 2002-11-01 AU AU2002365533A patent/AU2002365533A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU2002365533A1 (en) | 2003-06-10 |
NO20015837A (no) | 2003-05-12 |
CN1599936A (zh) | 2005-03-23 |
JP2005510864A (ja) | 2005-04-21 |
NO20015837D0 (no) | 2001-11-29 |
RU2004118416A (ru) | 2005-04-10 |
KR100543076B1 (ko) | 2006-01-20 |
RU2261499C2 (ru) | 2005-09-27 |
WO2003046921A1 (fr) | 2003-06-05 |
CA2468615C (fr) | 2007-03-20 |
KR20040064290A (ko) | 2004-07-16 |
EP1449217A1 (fr) | 2004-08-25 |
NO314738B1 (no) | 2003-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed | ||
MKLA | Lapsed |
Effective date: 20081103 |
|
MKLA | Lapsed |
Effective date: 20081103 |