CA2106709A1 - Epoxy resin composition and copper-clad laminate - Google Patents

Epoxy resin composition and copper-clad laminate

Info

Publication number
CA2106709A1
CA2106709A1 CA002106709A CA2106709A CA2106709A1 CA 2106709 A1 CA2106709 A1 CA 2106709A1 CA 002106709 A CA002106709 A CA 002106709A CA 2106709 A CA2106709 A CA 2106709A CA 2106709 A1 CA2106709 A1 CA 2106709A1
Authority
CA
Canada
Prior art keywords
epoxy resin
resin composition
epoxy
halogen
different
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002106709A
Other languages
English (en)
French (fr)
Inventor
Yoichi Ueda
Yasuhiro Endo
Mitsuhiro Shibata
Kunimasa Kamio
Shinichiro Kitayama
Kaori Yamasaki
Toshiaki Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4252806A external-priority patent/JPH06100660A/ja
Priority claimed from JP29585892A external-priority patent/JPH06145296A/ja
Application filed by Individual filed Critical Individual
Publication of CA2106709A1 publication Critical patent/CA2106709A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
CA002106709A 1992-09-22 1993-09-22 Epoxy resin composition and copper-clad laminate Abandoned CA2106709A1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP4252806A JPH06100660A (ja) 1992-09-22 1992-09-22 エポキシ樹脂組成物および銅張り積層板
JP252806/92 1992-09-22
JP295859/92 1992-11-05
JP29585992 1992-11-05
JP29585892A JPH06145296A (ja) 1992-11-05 1992-11-05 エポキシ樹脂組成物および銅張り積層板
JP295858/92 1992-11-05

Publications (1)

Publication Number Publication Date
CA2106709A1 true CA2106709A1 (en) 1994-03-23

Family

ID=27334158

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002106709A Abandoned CA2106709A1 (en) 1992-09-22 1993-09-22 Epoxy resin composition and copper-clad laminate

Country Status (7)

Country Link
EP (1) EP0590463B1 (en:Method)
KR (1) KR100283882B1 (en:Method)
CA (1) CA2106709A1 (en:Method)
DE (1) DE69332098T2 (en:Method)
MY (1) MY115290A (en:Method)
SG (1) SG45134A1 (en:Method)
TW (1) TW243458B (en:Method)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5726257A (en) * 1994-08-30 1998-03-10 Sumitomo Chemical Company, Ltd. Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith
JPH11209456A (ja) * 1998-01-29 1999-08-03 Hitachi Chem Co Ltd 印刷配線板用難燃性エポキシ樹脂組成物及びこれを用いたプリプレグ、金属箔張り積層板
EP4039723A1 (en) * 2021-02-08 2022-08-10 Rain Carbon Germany GmbH Curable epoxy systems comprising a phenolic polymer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4529790A (en) * 1983-08-12 1985-07-16 Sumitomo Chemical Company, Limited Epoxy resin composition
JPS62135539A (ja) * 1985-12-09 1987-06-18 Sanyo Kokusaku Pulp Co Ltd エポキシ樹脂積層物
DE3786718T2 (de) * 1986-06-24 1993-11-18 Mitsui Petrochemical Ind Epoxyharz.
US4900801A (en) * 1987-05-29 1990-02-13 Mitsui Petrochemical Industries, Ltd. Epoxy compounds and epoxy resin compositions containing the same
JPH01163256A (ja) * 1987-12-21 1989-06-27 Nippon Oil Co Ltd 積層板用樹脂組成物
MY104894A (en) * 1988-12-08 1994-06-30 Sumitomo Bakelite Co Epoxy resin composition for semiconductor sealing.
JPH03192112A (ja) * 1989-12-22 1991-08-22 Mitsui Petrochem Ind Ltd 変性エポキシ樹脂組成物
JP3106407B2 (ja) * 1991-02-06 2000-11-06 油化シエルエポキシ株式会社 電気積層板用エポキシ樹脂組成物
JPH05125149A (ja) * 1991-11-07 1993-05-21 Sumitomo Chem Co Ltd 積層板用エポキシ樹脂組成物
JP3200124B2 (ja) * 1991-11-29 2001-08-20 住友化学工業株式会社 難燃性エポキシ樹脂組成物

Also Published As

Publication number Publication date
DE69332098T2 (de) 2003-03-13
KR940007080A (ko) 1994-04-26
SG45134A1 (en) 1998-01-16
KR100283882B1 (ko) 2001-03-02
EP0590463A3 (en) 1994-10-19
EP0590463B1 (en) 2002-07-10
MY115290A (en) 2003-05-31
DE69332098D1 (de) 2002-08-14
TW243458B (en:Method) 1995-03-21
EP0590463A2 (en) 1994-04-06

Similar Documents

Publication Publication Date Title
KR100607185B1 (ko) 프리프렉 및 이로부터 제조된 적층판
US20090321117A1 (en) A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom
CN103189418A (zh) 相容性树脂的制造方法、热固化性树脂组合物、预浸料及层叠板
EP0795570A1 (en) Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same
EP1970389A1 (en) Phenol resin composition, cured product thereof, resin composition for copper clad laminate, copper clad laminate and novel phenol resin
CA2157149A1 (en) Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition
KR20140086293A (ko) 알킬 설폰화된 테트라졸 화합물로 표면 개질된 실리카, 이의 제조방법 및 이를 함유하는 수지조성물
JP2014122339A (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板、及び実装基板、並びに熱硬化性樹脂組成物の製造方法
US4529790A (en) Epoxy resin composition
JP4915549B2 (ja) 印刷配線板用樹脂組成物、プリプレグおよびこれを用いた積層板
JP2003231762A (ja) プリプレグ及び積層板
JP3230025B2 (ja) エピスルフィド化合物、それを含む熱硬化性樹脂組成物
KR20230013056A (ko) 에폭시 수지 조성물 및 그 경화물
JPH06246871A (ja) エポキシ樹脂銅張り積層板
CA2106709A1 (en) Epoxy resin composition and copper-clad laminate
JP3067384B2 (ja) エポキシ樹脂銅張り積層板
JPH0834832A (ja) 熱硬化性樹脂組成物および銅張り積層板
JPH1160692A (ja) 印刷配線板用樹脂組成物及びそれを用いた印刷配線板
JP3147531B2 (ja) エポキシ樹脂銅張り積層板
EP0517337B1 (en) Epoxy resin composition for electrical laminates
JP3374317B2 (ja) エポキシ樹脂組成物および銅張り積層板
US5364925A (en) Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
JP3383709B2 (ja) エポキシ樹脂組成物および銅張り積層板
JPH09278882A (ja) 難燃性シアン酸エステル樹脂組成物および銅張り積層板
JP3147532B2 (ja) 難燃性エポキシ樹脂銅張り積層板

Legal Events

Date Code Title Description
FZDE Dead