BRPI0919042A2 - placa de circuito impresso e modulo de circuito - Google Patents
placa de circuito impresso e modulo de circuitoInfo
- Publication number
- BRPI0919042A2 BRPI0919042A2 BRPI0919042A BRPI0919042A BRPI0919042A2 BR PI0919042 A2 BRPI0919042 A2 BR PI0919042A2 BR PI0919042 A BRPI0919042 A BR PI0919042A BR PI0919042 A BRPI0919042 A BR PI0919042A BR PI0919042 A2 BRPI0919042 A2 BR PI0919042A2
- Authority
- BR
- Brazil
- Prior art keywords
- circuit board
- printed circuit
- module
- circuit module
- printed
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2924/10161—Shape being a cuboid with a rectangular active surface
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13062—Junction field-effect transistor [JFET]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H—ELECTRICITY
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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US10044208P | 2008-09-26 | 2008-09-26 | |
US12/327,348 US8076587B2 (en) | 2008-09-26 | 2008-12-03 | Printed circuit board for harsh environments |
PCT/US2009/055801 WO2010036496A1 (en) | 2008-09-26 | 2009-09-03 | Printed circuit board for harsh environments |
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BRPI0919042A2 true BRPI0919042A2 (pt) | 2015-12-08 |
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Family Applications (1)
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BRPI0919042A BRPI0919042A2 (pt) | 2008-09-26 | 2009-09-03 | placa de circuito impresso e modulo de circuito |
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US (1) | US8076587B2 (pt) |
EP (1) | EP2340694B1 (pt) |
KR (1) | KR101263312B1 (pt) |
CN (1) | CN102165851B (pt) |
BR (1) | BRPI0919042A2 (pt) |
CA (1) | CA2738433C (pt) |
WO (1) | WO2010036496A1 (pt) |
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US8220990B2 (en) * | 2008-08-15 | 2012-07-17 | Siemens Energy, Inc. | Wireless telemetry electronic circuit package for high temperature environments |
US8766720B2 (en) | 2012-06-29 | 2014-07-01 | Siemens Energy, Inc. | Hybrid load differential amplifier operable in a high temperature environment of a turbine engine |
US8072764B2 (en) * | 2009-03-09 | 2011-12-06 | Apple Inc. | Multi-part substrate assemblies for low profile portable electronic devices |
CN104508444B (zh) * | 2012-06-29 | 2016-09-21 | 西门子能量股份有限公司 | 用于高温环境的电子电路 |
US9420356B2 (en) | 2013-08-27 | 2016-08-16 | Siemens Energy, Inc. | Wireless power-receiving assembly for a telemetry system in a high-temperature environment of a combustion turbine engine |
US9194250B1 (en) * | 2014-05-07 | 2015-11-24 | General Electric Company | Embedded wireless sensors for turbomachine component defect monitoring |
CN105708030B (zh) * | 2014-06-01 | 2017-09-26 | 云朵网络有限公司 | 一种连接件以及包括该连接件的鞋 |
CN103976497B (zh) * | 2014-06-01 | 2016-07-06 | 云朵网络有限公司 | 一种连接件以及包括该连接件的鞋 |
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2009
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EP2340694A1 (en) | 2011-07-06 |
KR101263312B1 (ko) | 2013-05-16 |
KR20110063787A (ko) | 2011-06-14 |
US20100078202A1 (en) | 2010-04-01 |
CA2738433C (en) | 2014-05-20 |
WO2010036496A1 (en) | 2010-04-01 |
US8076587B2 (en) | 2011-12-13 |
CN102165851B (zh) | 2014-05-07 |
CN102165851A (zh) | 2011-08-24 |
CA2738433A1 (en) | 2010-04-01 |
EP2340694B1 (en) | 2014-12-17 |
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