CN102165851B - 用于恶劣环境的印刷电路板 - Google Patents

用于恶劣环境的印刷电路板 Download PDF

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CN102165851B
CN102165851B CN200980137789.2A CN200980137789A CN102165851B CN 102165851 B CN102165851 B CN 102165851B CN 200980137789 A CN200980137789 A CN 200980137789A CN 102165851 B CN102165851 B CN 102165851B
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pcb
assembly
cavity
plate
circuit
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CN102165851A (zh
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D·J·米切尔
A·A·库尔卡尼
A·J·伯恩斯
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Siemens Energy Inc
Wolfspeed Inc
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Siemens Energy Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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Abstract

一种能够耐受如燃气涡轮机（11）中的超高G力和超高温的印刷电路板（PCB22）。PCB包括具有在其中形成的、用于容纳电路的组件的多个腔体（30A、36A）的衬底和被嵌入PCB中以便将组件电连接在一起以闭合电路的导线。每个腔体具有在G力的上游的壁（36A'），其以直接接触的方式支承相应组件以避免拉伸载荷在接合层（37A）中发展。当组件是集成电路（50）时，钛导线（63）被耦合在嵌入导线的暴露末端与集成电路的接触焊盘之间。可以将金膏（51）插入集成电路与上游壁之间的裂缝间隙中。

Description

用于恶劣环境的印刷电路板
本申请要求提交日为2008年9月26日的、美国临时申请61/100,442的权益。
技术领域
本发明一般涉及印刷电路板（PCB）且尤其是涉及PCB结构，该PCB结构被设计为耐受诸如在燃气涡轮发动机的旋转热气路径组件上发生的超高G力（G-force）和超高温的恶劣环境。
背景技术
工作的燃气涡轮发动机内的温度是极高的，常常处于超过350℃的水平。当期望监视涡轮机组件、诸如暴露于几千G的旋转涡轮机叶片的内部温度或监视在操作期间施加于此类组件的应力时，要求特殊的感测、放大和传送电路。此问题的有效解决方案是使用无线遥测，诸如在题为SMART COMPONENT FOR USE IN AN OPERATING ENVIRONMENT的已公开的美国专利申请公开号US 2005/0198967 A1中公开的无线遥测。在该应用中，公开了在燃气涡轮发动机的运动组件上使用无线遥测电路的一般概念。本专利申请解决了在实现用于容纳和支承无线遥测电路的PCB时遇到的特定问题，该PCB必须适合于恶劣的燃气涡轮机环境。
在题为CIRCUIT BOARD WITH HIGH HEAT DISSIPATIONS CHARACTERISTIC的美国专利号5,081,562中公开了一种示例性现有技术器件。本专利讲授电路板的构造，该电路板具有用于容纳集成电路器件的腔体和从腔体的顶部边缘上的电路迹线至IC上的连接焊盘的连接引线。此布置允许连接引线平放。然而，当PCB被暴露于几千G的离心力时，器件到电路板的附着也被显著地施加应力。不存在对能够耐受高G力的结构的建议或讲授。
在题为IMBEDDED COMPONENT INTEGRATED CIRCUIT ASSEMBLY AND METHOD OF MAKING SAME的美国专利号7,1 16,557 B1中公开了另一示例性现有技术器件。本专利还讲授了具有用于容纳集成电路器件的腔体和从腔体的顶部边缘上的电路迹线至IC上的连接焊盘的连接引线的电路板。然而，在这种情况下，连接引线被拱起来以实现电连接。添加诸如硅胶的灌封材料以便填充腔体并灌封连接引线。此布置保证振动期间的结构完整性和在10G范围内的G力，但是在几千G的范围内将不起作用。此外，燃气涡轮机的高温环境超过诸如硅胶或环氧树脂材料的聚合灌封材料的温度能力。必须开发支持高温的灌封材料。陶瓷水泥（cement）提供了灌封电子器件以供高温使用的潜力。然而，必须仔细地将陶瓷水泥选择为在高温下、特别是在射频（其会使射频传送机电路短路）下不导电。
发明内容
本发明涉及 一种能够耐受如燃气涡轮机的旋转组件中的超高G力的印刷电路板，所述印刷电路板包括：衬底，限定形成于其中的腔体以便容纳电路的组件；导线，被嵌入所述衬底中以便电连接至所述组件以闭合所述电路；以及在所述G力的上游的所述腔体的壁，被靠着所述组件设置以在受压时直接抵抗所述G力。
附图说明
在以下说明中鉴于附图来解释本发明，附图示出：
图1是具有安装在其上面的高温电路封装（package）的涡轮机叶片的透视图，该高温电路封装容纳包括本发明的PCB的高温电路模块。
图2是示出包括本发明的PCB的、高温电路模块内的元件的分解图。
图3是全部根据本发明的、包括在其中形成以便容纳组件的腔体的高温PCB的平面图。
图4是附着在PCB的腔体中的无源组件的平面图。
图5是附着在PCB的腔体中的图4所示的无源组件的横截面图。
图6是附着在PCB的腔体中的有源组件的平面图。
图7是附着在PCB的腔体中的图6所示的有源组件的横截面图。
图8是在将有源组件的接触焊盘（contact pad）连接到PCB内的电路时使用的连接带的横截面。
具体实施方式
本发明已认识到现有技术的PCB不适合于燃气涡轮机的恶劣环境，并且尤其是不适合于PCB被附着到的涡轮机叶片的高G力。申请人还已认识到需要更好的几何结构以在经受极高G力时支承电路的组件。
由本文公开的PCB支承的电路的组件使得能够实现经由来自燃气涡轮机的区域（具有从环境温度变化至大于350℃的温度，并且可以包括高达至少450℃的温度）的无线遥测电路进行的数据传输。此类设计策略必须可用于在诸如经受超过1000G的G力的燃气涡轮机叶片的旋转高温段组件上结合仪表，因为PCB必须位于涡轮机叶片上，并因此在超过450℃的温度下工作。
在图1中示出将使得能够收集实时温度数据的一个此类装有仪表的移动高温段组件，其中，涡轮机11的叶片10具有安装在其上面的传感器12和通向高温电子器件封装16的导线（conductor）14，高温电子器件封装16处理从传感器12导出的数据并其传送至在涡轮机叶片10外部的接收机电路（未示出）。如从图1可以认识到的和上文所讨论的，封装16在被直接安装到涡轮机叶片10时经受极高的温度和来自涡轮机叶片旋转的极高G力，常常在几万的G内。
现在参考图2，分解图举例说明被固定在高温电子器件封装16内的高温电子器件模块18的元件。模块底部18A包括从其末端伸出以使得能够实现模块18内部的电子器件与外部传感器、源和天线之间的通信的电连接引脚20。为了在高达至少450℃的高度下运行，必须将封装设计并确定尺寸为包含电子电路和其衬底（在下文中为PCB 22）。一对金线23A和23B被焊接到底部18A的内壁以将PCB 22固定在适当位置。接下来，盖18B被固定于顶部以便完全封闭模块结构。
模块18必须能够耐受温度和离心加载要求并保护PCB 22上的电路。因此，模块18A和盖18B由镀金的Kovar?合金制成且电连接引脚20由金制成。模块腔体和盖上的镀金防止Kovar?合金在提高温度下的氧化。连接器20借助于各个绝缘套管（未示出）与腔体18A绝缘。如图2中所示，一对引脚20被耦合到与传感器12通信的电连接器14。其余引脚可以耦合到地电位、电源（两个，每个用于正和负ac）和天线（未示出）。
公开的PCB 22由能够在高温下操作的材料制成，例如支持高温的材料，诸如氧化铝、氧化锆、二氧化硅、氧化镁、二氧化钛、富铝红柱石、碳化硅、氮化硅、氮化铝等。PCB中的导线和电路迹线可以由金制成。连接引脚20可以由铂金属制成，其能够耐受高温而不熔化或在高G力下不过度弯曲。如下文将进一步讨论的，PCB 22内的组件的新型布置提供对PCB经受的高G力的反过来的抵抗。
现在参考图3，示出了PCB 22（未占用）的平面图。形成用于容纳电容器（图3中未示出）的腔体30A、30B、30C和30D。在腔体30A～30D的底部的两侧上沉积金膏31A、31B以便保证并实现与四个大电容器中的每一个的欧姆接触。每个金膏沉积物实现与被嵌入PCB 22中的导线（未示出）的欧姆接触。如下文将示出的，可以在每个电容器上沉积陶瓷水泥以便将其固定在适当位置。
在PCB 22中形成诸如腔体36A的附加腔体以便容纳有源组件，依照一个实施例，其为SiC JFET。可以在腔体36A中沉积金膏37A以便将有源组件固定在适当位置，并实现与嵌入PCB 22内的电路的欧姆接触。可以在PCB 22中以类似的方式形成多个腔体以便容纳电路的其余组件。
现在参考图4（平面图）和5（横截面图），示出了被固定在腔体30A内的典型无源组件40，例如电阻器或电容器。组件40具有金端子41和42，该端子实现与金膏焊盘31A和31B的欧姆接触，该焊盘又实现与被嵌入PCB 22内的导线43和44的欧姆接触。嵌入导线可以继续通过通孔45A和45B到达PCB表面并与其它电路（未示出）连接。最后，陶瓷水泥46（具有陶瓷填料粉末和粘结剂的支持高温的聚合材料）被放置在组件上以将其固定在适当位置。聚合材料可以是交联聚合物，包括采用粘结剂以将颗粒保持在一起的金属粘合剂或填料粉末和陶瓷；或者其可以是交联环氧树脂，包括采用粘结剂以将颗粒保持在一起的金属粘合剂或填料粉末和陶瓷。填料粉末可以选自包括以下各项的组：氧化铝、氧化锆、硅酸锆、氧化镁、二氧化硅、云母、石墨、碳化硅、氮化硅、氮化铝、铝、镍和不锈钢。
在以常规方式看时，图4和5中的G力载荷（load）的方向是从右至左。因此，在图中的腔体30A的右侧的壁30A'是将支承或支住组件40（当被掩盖在陶瓷水泥46中时）以抵抗施加的G力载荷的壁。壁30A'有时在本文中称为G力的上游（upstream of the G-force）的壁。还指出的是附图并不按比例描绘，并且壁30A'附近的陶瓷水泥的厚度比可能出现的薄得多。陶瓷水泥支承层的厚度可以小于2mm。
图6（平面图）和7（横截面图）举例说明被借助于金膏37A固定于腔体36A的底部的有源组件50。注意的是以常规方式看时，图6和7中的G力载荷的方向是从右至左。因此，在图中的腔体36A的右侧的壁36A'是将支承或支住组件50以抵抗施加的G力载荷的壁。壁36A'有时在本文中称为G力的上游的壁。邻近于壁36'的壁36''也通过抵抗不严格地垂直于壁36A'的G载荷来帮助支承组件50，因此也可将壁36A''视为G力上游的壁。因此，可以认识到组件50被固定于腔体36A的拐角。
以这种方式，可以在直接受压时抵抗极高的G载荷并载送至PCB 22的基底材料中，而不依赖于金膏37A与组件50之间的接合的强度。缺少此类直接接触支承的现有技术组件将由于基础接合表面的平面之上的组件的重心的垂直位移而在基础接合层中发展弯矩（上游侧的压缩和下游侧的拉伸）。甚至被装入适当位置的现有技术组件将由于支柱（posting）材料的固有柔性而在非常高的G载荷（诸如涡轮机叶片所经历的）下发展此类弯矩。本发明的布置通过直接抵抗作为压缩力（沿着在腔体壁36A'（和可选的36A''）上承载的组件50的侧边）的所有G载荷来避免基础金膏37A中的此类弯矩/拉伸载荷。
可以将金膏51涂敷在腔体36A的壁上并将组件50推入由壁36A'和36A''限定的拐角中。还可以将金膏51放入组件50和与壁36A''相对的壁之间的空间中。由于（一个或多个）上游壁直接针对极高的G载荷力支承组件50的事实，腔体36A的上游壁36A'（36A''）上的金膏51被保持在最小厚度。可以使组件50和与上游侧36A'相对的该侧之间的空间处于开放状态以允许组件50的任何膨胀/收缩。由于腔体36A的壁或组件50的边缘可能不是完美地平坦的，或者可能不是精确地与腔体对准，所以使用金膏51来填充器件与壁表面36A'和36A''之间的任何裂缝空隙或小缝隙。还注意的是PCB 22（和安装在其中的组件）经受极高的G力且腔体36A与组件50之间的任何间隙可能由于扭曲和结果产生的拉力而使组件移位。因此，金膏用于填充可能发生的任何间隙并牢固地将组件固定在适当位置。还应指出的是附图并不按比例且邻近于壁36A'或36A''的金膏的厚度比其在图中看起来的薄得多。金膏的厚度可以小于2mm。
如在图7的横截面图中可以看到的，金膏（小片附着）37A实现与嵌入导线53的欧姆接触。导线53可以借助于通孔54延续至PCB的表面。组件50的顶部表面上的接触焊盘55、56和57分别借助于接合导线或带63、64和65耦合到其它表面导线59、60和61。可以借助于热超声焊接分别将带63、64和65附接于接触焊盘55、56和57。同样地，借助于热超声焊接将带63、64和65的另一端附接于导线59、60和61。应注意的是图6和7中示出的组件仅仅是说明性的，并且在大多数情况下，有源组件包括比本文所示更多的接触焊盘和接合导线。
根据实施例，接合导线或带63、64和65由铂制成。应指出的是带63、64和65的对准平行于G载荷力。此布置使由于重G载荷而引起的带的任何翘曲最小化，该翘曲在带垂直于G载荷对准的情况下可能更严重。在图8中示出典型带的横截面图。带63、64和65通常被制成为具有大约大于1:1的纵横比（W/T），诸如5:1或1:1与5:1之间的纵横比。这是优选的，以便带耐受施加于PCB 22上的极高G力和组件50弯曲或翘曲。适合于带63、64和65的其它金属包括Ni、Pt、Pd、Ti、Ta、W等。
虽然本文已经示出并描述了本发明的各种实施例，但应显而易见的是仅以示例的方式提供了此类实施例。在不脱离本发明的情况下，可以进行许多变更、修改和替换。因此，意图在于仅由所附权利要求的精神和范围来限制本发明。

Claims (9)

1.一种能够耐受超过1000G的G力的印刷电路板（22），所述印刷电路板（22）包括：
衬底，限定形成于其中的腔体（30A，36A）以便容纳电路的组件（40，50）；
导线（43，44，53），被嵌入所述衬底中以便电连接至所述组件（40，50）以闭合所述电路；以及
在所述G力的上游的所述腔体（30A，36A）的壁（30A',36A',36A''），被靠着所述组件（40，50）设置以在受压时直接抵抗所述G力，
其中被嵌入所述衬底中的所述导线（43，44，53）继续通过所述衬底中的通孔（45A，45B，54）到达所述印刷电路板（22）的表面用以与所述电路连接。
2.如权利要求1所述的板（22），其中，所述衬底由选自包括以下各项的组的陶瓷制成：氧化铝、氧化锆、二氧化硅、氧化镁、二氧化钛、富铝红柱石、碳化硅、氮化硅和氮化铝。
3.如权利要求1所述的板（22），其中，所述导线（43，44，53）包括金。
4.如权利要求1所述的板（22），其中，所述组件（50）是集成电路，并且还包括在由金属制成的所述集成电路上的各接触焊盘（55，56，57）与所述被嵌入所述衬底中的导线（53）的暴露末端之间的接合导线（63，64，65），所述金属选自包括以下各项的组：铂、镍、钯、钛、钽和钨。
5.如权利要求4所述的板（22），还包括被插入所述集成电路与所述腔体（36A）的壁（36A',36A''）之间的裂缝间隙中的金膏（51）。
6.如权利要求4所述的板（22），其中，所述接合导线（63，64，65）在横截面上是矩形的，具有大于1：1的纵横比。
7.如权利要求4所述的板（22），其中，所述接合导线（63，64，65）在横截面上是矩形的，具有在1：1与5：1之间的纵横比。
8.如权利要求1所述的板（22），其中，所述组件（50）由金膏（37A）附着于所述腔体（36A）的底部。
9.如权利要求1所述的板（22），还包括围绕腔体（30A）内的组件（40）的陶瓷水泥（46）。
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KR20110063787A (ko) 2011-06-14
US8076587B2 (en) 2011-12-13
WO2010036496A1 (en) 2010-04-01
US20100078202A1 (en) 2010-04-01
KR101263312B1 (ko) 2013-05-16
CA2738433C (en) 2014-05-20
CA2738433A1 (en) 2010-04-01
EP2340694A1 (en) 2011-07-06
EP2340694B1 (en) 2014-12-17
BRPI0919042A2 (pt) 2015-12-08

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