BRPI1006859A2 - película de poliamida para placas de circuito impresso flexíveis - Google Patents

película de poliamida para placas de circuito impresso flexíveis

Info

Publication number
BRPI1006859A2
BRPI1006859A2 BRPI1006859A BRPI1006859A BRPI1006859A2 BR PI1006859 A2 BRPI1006859 A2 BR PI1006859A2 BR PI1006859 A BRPI1006859 A BR PI1006859A BR PI1006859 A BRPI1006859 A BR PI1006859A BR PI1006859 A2 BRPI1006859 A2 BR PI1006859A2
Authority
BR
Brazil
Prior art keywords
printed circuit
circuit boards
flexible printed
polyamide film
polyamide
Prior art date
Application number
BRPI1006859A
Other languages
English (en)
Inventor
Alexander Antonius Marie Stroeks
Guido Richard Struijk
Original Assignee
Dsm Ip Assets Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dsm Ip Assets Bv filed Critical Dsm Ip Assets Bv
Publication of BRPI1006859A2 publication Critical patent/BRPI1006859A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/005—Shaping by stretching, e.g. drawing through a die; Apparatus therefor characterised by the choice of materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • B29C55/10—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial
    • B29C55/12—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/88—Thermal treatment of the stream of extruded material, e.g. cooling
    • B29C48/911—Cooling
    • B29C48/9135—Cooling of flat articles, e.g. using specially adapted supporting means
    • B29C48/914—Cooling of flat articles, e.g. using specially adapted supporting means cooling drums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/91—Product with molecular orientation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Laminated Bodies (AREA)
  • Polyamides (AREA)
BRPI1006859A 2009-01-16 2010-01-15 película de poliamida para placas de circuito impresso flexíveis BRPI1006859A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09150776 2009-01-16
EP09179948 2009-12-18
PCT/EP2010/050451 WO2010081873A1 (en) 2009-01-16 2010-01-15 Polyamide films for flexible printed circuit boards

Publications (1)

Publication Number Publication Date
BRPI1006859A2 true BRPI1006859A2 (pt) 2016-03-15

Family

ID=41693531

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1006859A BRPI1006859A2 (pt) 2009-01-16 2010-01-15 película de poliamida para placas de circuito impresso flexíveis

Country Status (9)

Country Link
US (1) US8778247B2 (pt)
EP (1) EP2379645B1 (pt)
JP (1) JP5696332B2 (pt)
KR (1) KR101684713B1 (pt)
CN (2) CN102282213A (pt)
BR (1) BRPI1006859A2 (pt)
RU (1) RU2538870C2 (pt)
SG (1) SG172886A1 (pt)
WO (1) WO2010081873A1 (pt)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010139369A1 (de) * 2009-06-05 2010-12-09 Ems-Patent Ag Flammgeschützte, teilaromatische polyamidformmassen
EP2408277B1 (de) * 2010-07-16 2016-02-17 Schurter AG Sicherungselement
CN103328203B (zh) * 2010-10-29 2015-07-29 纳幕尔杜邦公司 具有改善的热老化和夹层粘结强度的复合结构
TWI563034B (en) * 2011-05-13 2016-12-21 Dsm Ip Assets Bv Flame retardant semi-aromatic polyamide composition and moulded products made therefrom
JP6146723B2 (ja) * 2012-04-27 2017-06-14 ディーエスエム アイピー アセッツ ビー．ブイ． 導電性ポリアミド基材
JP6069018B2 (ja) * 2013-02-18 2017-01-25 三菱樹脂株式会社 ポリアミド系樹脂組成物、及びそれからなるフィルム
CN103387667A (zh) * 2013-07-31 2013-11-13 上海凯赛生物技术研发中心有限公司 一种半芳香族尼龙及其制备方法
CN105452351B (zh) * 2013-08-06 2019-06-07 帝斯曼知识产权资产管理有限公司 聚酰胺膜及其制备方法
US20160007473A1 (en) * 2014-07-07 2016-01-07 Hamilton Sundstrand Corporation Method for fabricating printed electronics
EP3187322A1 (en) 2015-12-31 2017-07-05 Arjo Wiggins Fine Papers Limited Use of printed electronics on paper to embed a circuit into plastic moulded objects
WO2017134054A1 (de) * 2016-02-05 2017-08-10 Basf Se Polymerfilm enthaltend ein amorphes und ein teilkristallines polyamid
CN108503866B (zh) * 2017-02-23 2021-01-22 财团法人工业技术研究院 薄膜与其形成方法及铜箔基板
RU2019133041A (ru) * 2017-03-20 2021-04-21 Басф Се Многослойные материалы, содержащие металл и полиамидную композицию
KR102109152B1 (ko) * 2017-11-24 2020-05-11 영남대학교 산학협력단 열적 및 기계적 특성이 개선된 고분자 복합 블렌드 조성물 및 그 제조 방법
KR102109156B1 (ko) * 2018-11-23 2020-05-11 영남대학교 산학협력단 열적, 기계적 특성이 우수한 고분자 복합 블렌드 필름
WO2020203389A1 (ja) * 2019-03-29 2020-10-08 株式会社クラレ 延伸フィルム、積層体、カバーウィンドウ、及び延伸フィルムの製造方法
EP3760471A1 (en) 2019-07-02 2021-01-06 Polestar Performance AB Dual battery system for electric vehicle
KR20220145385A (ko) 2020-02-26 2022-10-28 티코나 엘엘씨 회로 구조체
US11702539B2 (en) 2020-02-26 2023-07-18 Ticona Llc Polymer composition for an electronic device
KR20220146567A (ko) * 2020-02-26 2022-11-01 티코나 엘엘씨 전자 디바이스
US11728065B2 (en) 2020-07-28 2023-08-15 Ticona Llc Molded interconnect device
KR102648548B1 (ko) 2021-03-31 2024-03-18 유니티카 가부시끼가이샤 반방향족 폴리아미드 필름 및 그것으로부터 얻어지는 적층체

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU595373B2 (en) * 1986-08-20 1990-03-29 Mitsui Petrochemical Industries, Ltd. Aromatic polyamide
US5504146A (en) * 1988-02-12 1996-04-02 Basf Aktiengesellschaft Toughened partly aromatic copolyamides
JPH02106319A (ja) * 1988-10-14 1990-04-18 Unitika Ltd ポリアミド系２軸配向フィルム
JPH02253924A (ja) * 1989-03-28 1990-10-12 Unitika Ltd 耐熱性フッ素系重合体２軸配向フィルムおよびその製造方法
US5324766A (en) * 1989-07-07 1994-06-28 Mitsui Petrochemical Industries, Ltd. Resin composition for forming plated layer and use thereof
AU649710B2 (en) * 1990-09-11 1994-06-02 Mitsubishi Gas Chemical Company, Inc. Polyamide resin composition and film therefrom
JP3472628B2 (ja) * 1994-08-12 2003-12-02 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂組成物及び二軸延伸フィルム
JP3458528B2 (ja) * 1995-05-26 2003-10-20 三菱化学株式会社 ポリアミド樹脂組成物、及びフィルム
JPH093215A (ja) * 1995-06-22 1997-01-07 Mitsui Petrochem Ind Ltd ポリアミドフィルム、その製法および用途
US5891987A (en) * 1995-11-15 1999-04-06 Industrial Technology Research Institute Copolyamide composition with a high glass transition temperature
US6376093B1 (en) * 1998-05-26 2002-04-23 Toyo Boseki Kabushiki Kaisha Polyamide film and polyamide laminate film
US20030134980A1 (en) 1998-10-23 2003-07-17 Ryuichi Hayashi Polyamide composition for molding
JP2000186141A (ja) 1998-12-22 2000-07-04 Kuraray Co Ltd ポリアミドおよびそれからなるポリアミドフィルム
IT1317870B1 (it) 2000-03-02 2003-07-15 Sinco Ricerche Spa Film soffiati da resina poliestere espansa.
CN1550326B (zh) * 2003-05-06 2010-08-25 三菱瓦斯化学株式会社 多层容器
EP1681313A1 (en) * 2005-01-17 2006-07-19 DSM IP Assets B.V. Heat stabilized moulding composition
RU2340195C2 (ru) * 2005-04-19 2008-12-10 Общество С Ограниченной Ответственностью Производственно-Коммерческая Фирма "Атлантис-Пак" Многослойная рукавная оболочка для пищевых продуктов с неоднородным по толщине внешним слоем, имеющим рельефную волокнисто-сетчатую структуру
RU2317709C2 (ru) * 2006-03-23 2008-02-27 Общество С Ограниченной Ответственностью Производственно-Коммерческая Фирма "Атлантис-Пак" Упаковочная рукавная пленка для пищевых продуктов, несущая жидкость на рельефной внутренней поверхности, и пищевой продукт, изготовленный в этой пленке
WO2009012936A1 (en) * 2007-07-23 2009-01-29 Dsm Ip Assets B.V. E/e connector and polymer composition used therein
JP5438944B2 (ja) * 2007-10-23 2014-03-12 富士フイルム株式会社 濃度算出装置、濃度設定装置、濃度算出プログラム、および濃度設定プログラム
EP2270098A1 (en) * 2008-03-27 2011-01-05 Ube Industries, Ltd. Polyamide resin composition for film

Also Published As

Publication number Publication date
EP2379645A1 (en) 2011-10-26
CN106928704A (zh) 2017-07-07
CN102282213A (zh) 2011-12-14
RU2011134243A (ru) 2013-02-27
RU2538870C2 (ru) 2015-01-10
EP2379645B1 (en) 2018-11-28
JP2012515244A (ja) 2012-07-05
KR101684713B1 (ko) 2016-12-08
KR20110116168A (ko) 2011-10-25
US8778247B2 (en) 2014-07-15
WO2010081873A1 (en) 2010-07-22
JP5696332B2 (ja) 2015-04-08
SG172886A1 (en) 2011-08-29
US20120024577A1 (en) 2012-02-02

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]