BRPI0418349A - portadora flexìvel com uma estrutura eletricamente condutiva - Google Patents
portadora flexìvel com uma estrutura eletricamente condutivaInfo
- Publication number
- BRPI0418349A BRPI0418349A BRPI0418349-5A BRPI0418349A BRPI0418349A BR PI0418349 A BRPI0418349 A BR PI0418349A BR PI0418349 A BRPI0418349 A BR PI0418349A BR PI0418349 A BRPI0418349 A BR PI0418349A
- Authority
- BR
- Brazil
- Prior art keywords
- electrically conductive
- flexible carrier
- conductive structure
- base layer
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0861—Flat or ribbon cables comprising one or more screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Conductors (AREA)
- Communication Cables (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
PORTADORA FLEXìVEL COM UMA ESTRUTURA ELETRICAMENTE CONDUTIVA. A presente invenção refere-se a uma portadora flexível (10) consistindo em uma camada de base feita pelo menos uma estrutura conutiva (20) que é impressa pelo menos na camada de base (12) com uma tinta eletricamente condutiva em um de seus lados.pelo menos uma camada eletricamente condutiva (20) é disposta entre a camada de base (12) e pelo menos uma camada de cobertura (14) feita de plástico e cada uma das opcionalmente outras estruturas eletricamente condutivas (22) é respectivamente disposta entre duas sucessivas outras camadas de cobertura.A camada de base 12 é conectada a pelo menos uma camada de cobertura (14) cada uma das opcionalmente outras camadas de cobertura é conectada às camadas de cobertura adjacentes.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04405004A EP1551037A1 (de) | 2004-01-05 | 2004-01-05 | Flexibler Träger mit elektrisch leitfähiger Struktur |
PCT/EP2004/014390 WO2006048041A1 (de) | 2004-01-05 | 2004-12-17 | Flexibler träger mit elektrisch leitfähiger struktur |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0418349A true BRPI0418349A (pt) | 2007-05-02 |
Family
ID=34560281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0418349-5A BRPI0418349A (pt) | 2004-01-05 | 2004-12-17 | portadora flexìvel com uma estrutura eletricamente condutiva |
Country Status (8)
Country | Link |
---|---|
US (1) | US20070151748A1 (pt) |
EP (2) | EP1551037A1 (pt) |
JP (1) | JP2007518222A (pt) |
BR (1) | BRPI0418349A (pt) |
CA (1) | CA2552217A1 (pt) |
RU (1) | RU2361377C2 (pt) |
TW (1) | TW200534759A (pt) |
WO (1) | WO2006048041A1 (pt) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4901141B2 (ja) * | 2005-06-22 | 2012-03-21 | 鷹羽産業株式会社 | ケーブル及びその製造方法 |
CN101507372B (zh) * | 2006-10-24 | 2011-02-09 | 松下电器产业株式会社 | 印刷电路板、印刷电路板的制造方法和电器 |
DE102007023935B4 (de) * | 2007-05-23 | 2009-05-20 | Sukalo, Drazenko, Dipl.-Ing. | Elektrokabel mit optimierter Propagationszeit zur Signalübertragung |
CA2736090A1 (en) * | 2008-09-03 | 2010-03-11 | Usg Interiors, Inc. | Electrically conductive tape for walls and ceilings |
MX2011002174A (es) * | 2008-09-03 | 2011-04-07 | Usg Interiors Inc | Elemento electricamente conductor, sistema y metodo de fabricacion. |
KR101130697B1 (ko) * | 2010-05-07 | 2012-04-02 | 삼성전자주식회사 | 복수 층의 신축성 배선 |
GB2482860A (en) * | 2010-07-28 | 2012-02-22 | In2Tec Ltd | Flexible twisted-pair wiring system |
CN102223752B (zh) * | 2011-06-02 | 2013-07-24 | 宝利时(深圳)胶粘制品有限公司 | 一种多层柔性线路板及其制作方法 |
RU2536861C1 (ru) * | 2013-09-10 | 2014-12-27 | Открытое акционерное общество "Научно-производственное объединение "СПЛАВ" | Гибкий печатный кабель и способ его изготовления |
RU2606392C2 (ru) * | 2015-05-13 | 2017-01-10 | Открытое акционерное общество "Научно-производственное объединение "СПЛАВ" | Печатный кабель |
JP7098394B2 (ja) * | 2018-04-13 | 2022-07-11 | 矢崎総業株式会社 | アンテナユニット |
CZ308701B6 (cs) * | 2019-05-14 | 2021-03-03 | Univerzita Pardubice | Velkoplošný senzor pro indikaci obsazenosti skladovacích, výstavních nebo prodejních polic |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3060062A (en) * | 1960-03-02 | 1962-10-23 | Rca Corp | Method of forming electrical conductors |
US3206541A (en) * | 1963-04-29 | 1965-09-14 | Gen Cable Corp | Sheathed electrical cable |
US3761842A (en) * | 1972-06-01 | 1973-09-25 | Bell Telephone Labor Inc | Twisted pair flat conductor cable with means to equalize impedance and propagation velocity |
FR2530874A1 (fr) * | 1982-07-20 | 1984-01-27 | Jaeger | Dispositif de connexion electrique souple antiparasite |
JPS61156260A (ja) * | 1984-12-28 | 1986-07-15 | Minolta Camera Co Ltd | 静電潜像現像用トナ− |
US4659872A (en) * | 1985-04-30 | 1987-04-21 | Amp Incorporated | Flexible flat multiconductor cable |
US5053583A (en) * | 1989-01-18 | 1991-10-01 | Amp Incorporated | Bundled hybrid ribbon electrical cable |
JPH02297805A (ja) * | 1989-05-11 | 1990-12-10 | Yokohama Rubber Co Ltd:The | フレキシブルフラットケーブル |
JP2518960B2 (ja) * | 1990-07-05 | 1996-07-31 | 株式会社クボタ | 苗移植機 |
US5238006A (en) * | 1991-06-24 | 1993-08-24 | Medtronic, Inc. | Apnea stimulation lead |
US5262590A (en) * | 1992-04-27 | 1993-11-16 | Sheldahl, Inc. | Impedance controlled flexible circuits with fold-over shields |
JP2857663B2 (ja) * | 1993-09-07 | 1999-02-17 | 矢崎総業株式会社 | 電気接続箱及び電気接続箱用帯状fpc |
JPH07106757A (ja) * | 1993-10-01 | 1995-04-21 | Matsushita Electric Ind Co Ltd | 薄膜多層回路基板及びその製造方法 |
JPH0997520A (ja) * | 1995-09-29 | 1997-04-08 | Fujitsu Takamizawa Component Kk | 多芯ケーブル及びその製造方法 |
CA2238470A1 (en) * | 1996-10-01 | 1998-04-09 | National Label Company | Apparatus and method for assembling electrochromic cells |
US6121676A (en) * | 1996-12-13 | 2000-09-19 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
US7149095B2 (en) * | 1996-12-13 | 2006-12-12 | Tessera, Inc. | Stacked microelectronic assemblies |
US6225688B1 (en) * | 1997-12-11 | 2001-05-01 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
JP2001093353A (ja) * | 1999-09-21 | 2001-04-06 | Daichu Denshi Co Ltd | 伝送シールドケーブル |
JP2002329424A (ja) * | 2001-04-27 | 2002-11-15 | Dainippon Printing Co Ltd | フラットケーブル用シールド材及びシールド付きフラットケーブル |
JP5043262B2 (ja) * | 2001-07-25 | 2012-10-10 | 株式会社フジクラ | 遮水テープ |
JP4063533B2 (ja) * | 2001-12-10 | 2008-03-19 | 日本碍子株式会社 | フレキシブル配線板 |
JP4061083B2 (ja) * | 2002-02-04 | 2008-03-12 | 大日本印刷株式会社 | 黒色フラットケーブル被覆材、及びそれを用いた黒色フラットケーブル |
-
2004
- 2004-01-05 EP EP04405004A patent/EP1551037A1/de not_active Withdrawn
- 2004-12-17 BR BRPI0418349-5A patent/BRPI0418349A/pt not_active Application Discontinuation
- 2004-12-17 US US10/584,906 patent/US20070151748A1/en not_active Abandoned
- 2004-12-17 JP JP2006546010A patent/JP2007518222A/ja active Pending
- 2004-12-17 WO PCT/EP2004/014390 patent/WO2006048041A1/de active Application Filing
- 2004-12-17 RU RU2006128425/09A patent/RU2361377C2/ru not_active IP Right Cessation
- 2004-12-17 EP EP04822317A patent/EP1704572A1/de not_active Withdrawn
- 2004-12-17 CA CA002552217A patent/CA2552217A1/en not_active Abandoned
- 2004-12-21 TW TW093139873A patent/TW200534759A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP1551037A1 (de) | 2005-07-06 |
CA2552217A1 (en) | 2006-05-11 |
EP1704572A1 (de) | 2006-09-27 |
TW200534759A (en) | 2005-10-16 |
WO2006048041A1 (de) | 2006-05-11 |
JP2007518222A (ja) | 2007-07-05 |
RU2361377C2 (ru) | 2009-07-10 |
RU2006128425A (ru) | 2008-02-27 |
US20070151748A1 (en) | 2007-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BRPI0418349A (pt) | portadora flexìvel com uma estrutura eletricamente condutiva | |
KR940010623B1 (ko) | 차량외부 부착용 문자 또는 도형 | |
ATE470571T1 (de) | Biegsame druckkopfleiterplatte | |
TW200638811A (en) | Flexible printed wiring board | |
DE602005023977D1 (de) | Elektronische Taucheruhr mit einer analogen redundanten Anzeige der momentanen Tiefe | |
TW200637453A (en) | Duble-sided flexible printed circuit board | |
JP2018093197A5 (pt) | ||
TW200719198A (en) | Housing component with illuminated switch and method of producing the same | |
SG141415A1 (en) | Flexible printed circuit board | |
BRPI0401752A (pt) | Aberturas terminais de conjunto de alvéolos preenchidos | |
ATE506636T1 (de) | Tintenentwicklerfolie | |
EP2040347A4 (en) | OMNIBUS BAR DEVICE AND PRINTED CIRCUIT BOARD MOUNTED THEREWITH | |
BRPI0511720A (pt) | conjunto de bobina de transformador | |
BRPI0409808A (pt) | aparelho de conexão eletromecánico | |
BRPI0409702A (pt) | substrato com múltiplas camadas condutivas e métodos para a fabricação e o uso do mesmo | |
JP2017501592A5 (pt) | ||
TW200706088A (en) | Electronic device | |
ES2195856T3 (es) | Placa de circuitos impresos para señales electricas y opticas asi como procedimiento para su fabricacion. | |
TWI656994B (zh) | 具備自上方開蓋結構更換電池之發光踏板 | |
MX170095B (es) | Soluciones de resina de policicloolefina curable, su empleo para producir tableros de circuitos impresos y tableros asi producidos | |
DE602005011222D1 (de) | Wärmeableitung für mehrere integrierte Schaltkreise montiert auf einer Leiterplatte | |
TWM502941U (zh) | 防水薄膜電路板結構及其防水鍵盤 | |
TW200509746A (en) | Organic electronic device | |
DK1144752T3 (da) | Fleksibel flerelags-fladestruktur med forstærket dæklag | |
NO20080611L (no) | Gulvplate for en farkost |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |