DE602005011222D1 - Wärmeableitung für mehrere integrierte Schaltkreise montiert auf einer Leiterplatte - Google Patents

Wärmeableitung für mehrere integrierte Schaltkreise montiert auf einer Leiterplatte

Info

Publication number
DE602005011222D1
DE602005011222D1 DE602005011222T DE602005011222T DE602005011222D1 DE 602005011222 D1 DE602005011222 D1 DE 602005011222D1 DE 602005011222 T DE602005011222 T DE 602005011222T DE 602005011222 T DE602005011222 T DE 602005011222T DE 602005011222 D1 DE602005011222 D1 DE 602005011222D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
heat dissipation
integrated circuits
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005011222T
Other languages
English (en)
Inventor
Peter Carl Bordiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel Lucent SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent SAS filed Critical Alcatel Lucent SAS
Publication of DE602005011222D1 publication Critical patent/DE602005011222D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
DE602005011222T 2004-10-15 2005-10-10 Wärmeableitung für mehrere integrierte Schaltkreise montiert auf einer Leiterplatte Active DE602005011222D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61951504P 2004-10-15 2004-10-15
US11/157,667 US7502229B2 (en) 2004-10-15 2005-06-21 Heat dissipation system for multiple integrated circuits mounted on a printed circuit board

Publications (1)

Publication Number Publication Date
DE602005011222D1 true DE602005011222D1 (de) 2009-01-08

Family

ID=35788129

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005011222T Active DE602005011222D1 (de) 2004-10-15 2005-10-10 Wärmeableitung für mehrere integrierte Schaltkreise montiert auf einer Leiterplatte

Country Status (5)

Country Link
US (1) US7502229B2 (de)
EP (1) EP1648213B1 (de)
CN (1) CN1783464B (de)
AT (1) ATE415805T1 (de)
DE (1) DE602005011222D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2269429B1 (de) * 2008-04-17 2011-11-02 Koninklijke Philips Electronics N.V. Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper
US9219022B2 (en) 2012-03-08 2015-12-22 International Business Machines Corporation Cold plate with combined inclined impingement and ribbed channels
US9509092B2 (en) * 2013-11-06 2016-11-29 Cisco Technology, Inc. System and apparatus for network device heat management
US9480149B2 (en) 2013-12-10 2016-10-25 Brocade Communications Systems, Inc. Printed circuit board with fluid flow channels
CN105338783B (zh) * 2014-07-01 2018-08-31 联想(北京)有限公司 一种电子设备以及用于电子设备的散热装置
CN105324018B (zh) * 2015-12-05 2017-08-25 重庆元创自动化设备有限公司 集成电路专用散热装置
US11416429B1 (en) * 2016-08-05 2022-08-16 ZT Group Int'l, Inc. Multi-functional PCI dummy card design

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992002117A1 (en) * 1990-07-26 1992-02-06 Fujitsu Limited Heat dissipating structure of semiconductor device
FR2679929B1 (fr) 1991-08-01 1993-10-22 Alcatel Alsthom Cie Gle Electric Procede et cellule d'effusion pour la formation de jets moleculaires.
DE69227522T2 (de) * 1992-05-20 1999-05-06 Seiko Epson Corp Kassette für eine elektronische vorrichtung
US5270902A (en) * 1992-12-16 1993-12-14 International Business Machines Corporation Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip
WO1997045425A1 (en) * 1996-05-27 1997-12-04 Fujisawa Pharmaceutical Co., Ltd. New indolyl and benzofuranyl carboxamides as inhibitors of nitric oxide production
US6134112A (en) 1997-06-27 2000-10-17 Sun Microsystems, Inc. Heat sink attachment
WO2000041448A1 (fr) 1998-12-30 2000-07-13 Acqiris Sa Module electronique comportant des elements de refroidissement de composants electroniques
US6181561B1 (en) * 1999-02-04 2001-01-30 Lucent Technologies Inc. Heat sink having standoff buttons and a method of manufacturing therefor
US6518292B1 (en) * 1999-03-12 2003-02-11 Bristol-Myers Squibb Co. Heterocyclic aromatic compounds usefuls as growth hormone secretagogues
US6534860B2 (en) * 1999-12-06 2003-03-18 Intel Corporation Thermal transfer plate
AR035026A1 (es) * 2000-01-19 2004-04-14 Baker Norton Pharma Uso de pentosan polisulfato en el tratamiento de ciertas condiciones de la prostata
US6868217B1 (en) * 2000-07-31 2005-03-15 Cisco Technology, Inc. Long reach unamplified optical SONET/SDH card
JP2004031627A (ja) * 2002-06-26 2004-01-29 Jmnet Inc 電子機器用筐体及びそれを用いた電子機器
US6680532B1 (en) * 2002-10-07 2004-01-20 Lsi Logic Corporation Multi chip module
US7138412B2 (en) * 2003-03-11 2006-11-21 Bristol-Myers Squibb Company Tetrahydroquinoline derivatives useful as serine protease inhibitors
US7129264B2 (en) * 2003-04-16 2006-10-31 Bristol-Myers Squibb Company Biarylmethyl indolines and indoles as antithromboembolic agents

Also Published As

Publication number Publication date
CN1783464B (zh) 2010-11-10
US7502229B2 (en) 2009-03-10
ATE415805T1 (de) 2008-12-15
EP1648213B1 (de) 2008-11-26
EP1648213A2 (de) 2006-04-19
CN1783464A (zh) 2006-06-07
US20060082974A1 (en) 2006-04-20
EP1648213A3 (de) 2007-04-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition