BR9805985A - Redistribuicão de polifenileno éteres e polifenileno éteres com nova estrutura. - Google Patents
Redistribuicão de polifenileno éteres e polifenileno éteres com nova estrutura.Info
- Publication number
- BR9805985A BR9805985A BR9805985-8A BR9805985A BR9805985A BR 9805985 A BR9805985 A BR 9805985A BR 9805985 A BR9805985 A BR 9805985A BR 9805985 A BR9805985 A BR 9805985A
- Authority
- BR
- Brazil
- Prior art keywords
- phenolic compound
- redistribution
- phenolic
- toluene
- polyphenylene
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Polyethers (AREA)
- Laminated Bodies (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Patente de Invenção: <B>"REDISTRIBUIçãO DE POLIFENILENO éTERES E POLIFENILENO éTERES COM NOVA ESTRUTURA"<D>. A presente invenção refere-se à distribuição de polifenileno éteres por reação do polifenileno éter em solução com um composto fenólico, onde são usados compostos fenólicos especiais. A reação de redistribuição pode ser realizada em tolueno ou em misturas de tolueno/álcool. A reação pode ser realizada na presença ou ausência de um catalisador. Usando-se um processo para a redistribuição de polifenileno éteres por reação do polifenileno éter em solução com um composto fenólico, onde o polifenileno éter é reagido com um composto fenólico de fórmula 3, onde os anéis fenólicos são distribuídos com grupos metila ou grupos etila nas posições orto, e o grupo X é separado do anel fenólico através de pelo menos dois átomos de carbono, e o composto fenólico tem um peso molecular não-superior a 400 g/mo, de preferência não superior a 300 g/mol, e a redistribuição é realizada em uma mistura de tolueno e metanol com 1 - 30% em volume ou em tolueno na presença de um catalisador de transferência de fase, tal como cloreto de tri(alquil C8 - C10) metil amónio como promotor, e um difenoquinona, de preferência 3,3',5,5'-tetrametil-4,4'-difenoquinona, é usada como catalisador e a concentração molar do composto fenólico é escolhida entre 0,9 e 1,1 vezes a quantidade molar de unidades monoméricas no polifenileno éter na solução reacional, mais de 90% de composto fenólico podem ser incorporados no polifenileno.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/800,694 US5880221A (en) | 1997-02-14 | 1997-02-14 | Redistribution of polyphenylene ethers and polyphenylene ethers with novel structure |
PCT/US1998/000351 WO1998036015A1 (en) | 1997-02-14 | 1998-01-08 | Redistribution of polyphenylene ethers and polyphenylene ethers with novel structure |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9805985A true BR9805985A (pt) | 1999-08-31 |
Family
ID=25179123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9805985-8A BR9805985A (pt) | 1997-02-14 | 1998-01-08 | Redistribuicão de polifenileno éteres e polifenileno éteres com nova estrutura. |
Country Status (14)
Country | Link |
---|---|
US (1) | US5880221A (pt) |
EP (1) | EP0895519B1 (pt) |
JP (1) | JP4113261B2 (pt) |
KR (1) | KR20000064906A (pt) |
CN (1) | CN1188450C (pt) |
AT (1) | ATE226223T1 (pt) |
AU (1) | AU734335B2 (pt) |
BR (1) | BR9805985A (pt) |
CA (1) | CA2250841A1 (pt) |
CZ (1) | CZ325898A3 (pt) |
DE (1) | DE69808707T2 (pt) |
TR (1) | TR199802062T1 (pt) |
TW (1) | TW438837B (pt) |
WO (1) | WO1998036015A1 (pt) |
Families Citing this family (49)
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US6063875A (en) | 1998-06-11 | 2000-05-16 | General Electric Company | Carboxy-functionalized polyphenylene ethers and blends containing them |
US6307010B1 (en) | 1999-02-05 | 2001-10-23 | General Electric Company | Process for the manufacture of low molecular weight polyphenylene ether resins through redistribution |
US7235192B2 (en) | 1999-12-01 | 2007-06-26 | General Electric Company | Capped poly(arylene ether) composition and method |
US6576700B2 (en) * | 2000-04-12 | 2003-06-10 | General Electric Company | High flow polyphenylene ether formulations |
EP1176172B1 (en) * | 2000-07-26 | 2004-12-15 | Matsushita Electric Works, Ltd. | Epoxy resin composition, prepreg and metal-clad laminate |
JP2002265777A (ja) * | 2001-03-12 | 2002-09-18 | Matsushita Electric Works Ltd | ポリフェニレンオキサイド樹脂組成物、プリプレグ、積層板、プリント配線板、多層プリント配線板 |
TW574313B (en) * | 2001-12-12 | 2004-02-01 | Ind Tech Res Inst | Resin composition for circuit boards |
ES2307901T3 (es) * | 2002-02-21 | 2008-12-01 | Stichting Dutch Polymer Institute | Copolimero que contiene uno o mas segmentos amida. |
US7183350B2 (en) * | 2003-02-28 | 2007-02-27 | General Electric Company | Poly(arylene ether) blends having low melt viscosity in the absence of plasticizer |
US7148296B2 (en) * | 2003-10-03 | 2006-12-12 | General Electric Company | Capped poly(arylene ether) composition and process |
US7067608B2 (en) * | 2003-11-25 | 2006-06-27 | Xerox Corporation | Process for preparing branched polyarylene ethers |
US7396895B2 (en) * | 2003-11-25 | 2008-07-08 | Xerox Corporation | Branched polyarylene ethers and processes for the preparation thereof |
US7329708B2 (en) * | 2004-08-18 | 2008-02-12 | General Electric Company | Functionalized poly(arylene ether) composition and method |
US20070004871A1 (en) * | 2005-06-30 | 2007-01-04 | Qiwei Lu | Curable composition and method |
US7378455B2 (en) * | 2005-06-30 | 2008-05-27 | General Electric Company | Molding composition and method, and molded article |
WO2007097231A1 (ja) * | 2006-02-21 | 2007-08-30 | Asahi Kasei Chemicals Corporation | 低分子量ポリフェニレンエーテルの製造方法 |
US20080076885A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
US20080085989A1 (en) * | 2006-10-05 | 2008-04-10 | Gary William Yeager | Poly(arylene ether) copolymer |
US20080076884A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
US7638566B2 (en) * | 2006-10-30 | 2009-12-29 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether) compositions |
EP2118201B1 (en) * | 2007-01-10 | 2015-09-30 | SABIC Innovative Plastics IP B.V. | Low smoke density poly(arylene ether) compositions, methods, and articles |
US7655278B2 (en) | 2007-01-30 | 2010-02-02 | Sabic Innovative Plastics Ip B.V. | Composite-forming method, composites formed thereby, and printed circuit boards incorporating them |
US7595367B2 (en) * | 2007-08-28 | 2009-09-29 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether) preparation method |
JP5469320B2 (ja) * | 2008-08-26 | 2014-04-16 | パナソニック株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
US8058359B2 (en) * | 2008-11-10 | 2011-11-15 | Sabic Innovative Plastics Ip B.V. | Varnish compositions for electrical insulation and method of using the same |
CN101735562B (zh) * | 2009-12-11 | 2012-09-26 | 广东生益科技股份有限公司 | 环氧树脂组合物及其制备方法及采用其制作的层压材料及覆铜箔层压板 |
WO2013097128A1 (zh) * | 2011-12-29 | 2013-07-04 | 广东生益科技股份有限公司 | 含磷低分子量聚苯醚树脂的制备方法 |
US8466253B1 (en) | 2012-06-29 | 2013-06-18 | Sabic Innovative Plastics Ip B.V. | Poly(phenylene ether) process |
WO2014197458A1 (en) | 2013-06-03 | 2014-12-11 | Polyone Corporation | Low molecular weight polyphenylene ether prepared without solvents |
US9422394B2 (en) | 2013-06-28 | 2016-08-23 | Sabic Global Technologies B.V. | Thermoplastic polyurethane and associated method and article |
US9169368B2 (en) | 2013-07-30 | 2015-10-27 | Sabic Global Technologies B.V. | Rigid foam and associated article |
US9296916B2 (en) | 2013-08-09 | 2016-03-29 | Sabic Global Technologies B.V. | Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same |
US9266997B2 (en) | 2013-09-20 | 2016-02-23 | Sabic Global Technologies B.V. | Polyurethane foam and associated method and article |
JP5793641B2 (ja) * | 2014-01-30 | 2015-10-14 | パナソニックIpマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
WO2015152427A1 (ja) | 2014-04-04 | 2015-10-08 | 日立化成株式会社 | N-置換マレイミド基を有するポリフェニレンエーテル誘導体、並びにそれを用いた熱硬化性樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及び多層プリント配線板 |
KR102455920B1 (ko) | 2015-01-13 | 2022-10-17 | 쇼와덴코머티리얼즈가부시끼가이샤 | 수지 조성물, 수지층 부착 지지체, 프리프레그, 적층판, 다층 프린트 배선판 및 밀리미터파 레이더용 프린트 배선판 |
WO2016200791A1 (en) | 2015-06-09 | 2016-12-15 | Sabic Global Technologies B.V. | Method for poly(phenylene ether) manufacture and associated poly(phenylene ether) |
WO2017105782A1 (en) | 2015-12-17 | 2017-06-22 | Sabic Global Technologies B.V. | Method of forming high molecular weight poly(phenylene ether), poly(phenylene ether) formed thereby, and fiber and article comprising the poly(phenylene ether) |
EP3778709A4 (en) * | 2018-03-29 | 2021-05-12 | Asahi Kasei Kabushiki Kaisha | POLYPHENYLENE ETHER, COMPOSITION THEREOF AND METHOD FOR MANUFACTURING THEREOF |
JP2020132716A (ja) * | 2019-02-15 | 2020-08-31 | 旭化成株式会社 | ポリフェニレンエーテル含有樹脂組成物 |
JP7355110B2 (ja) * | 2019-09-24 | 2023-10-03 | 東洋紡エムシー株式会社 | ポリフェニレンエーテル溶融押出成形体、及び、ポリフェニレンエーテル溶融押出成形体の製造方法 |
WO2021065964A1 (ja) * | 2019-09-30 | 2021-04-08 | 太陽ホールディングス株式会社 | ポリフェニレンエーテルを含む硬化性組成物、ドライフィルム、プリプレグ、硬化物、積層板、および電子部品 |
WO2021065275A1 (ja) | 2019-10-02 | 2021-04-08 | 旭化成株式会社 | ポリフェニレンエーテル組成物 |
WO2022158180A1 (ja) | 2021-01-25 | 2022-07-28 | 旭化成株式会社 | ポリフェニレンエーテル、その製造方法、熱硬化組成物、プリプレグ、及び積層体 |
CN116888186A (zh) | 2021-03-10 | 2023-10-13 | 旭化成株式会社 | 聚苯醚、其制造方法、热固化组合物、预浸料和层积体 |
CN115322365B (zh) * | 2021-05-10 | 2023-12-08 | 南通星辰合成材料有限公司 | 低分子量聚亚芳基醚及其制备方法 |
JPWO2022244817A1 (pt) | 2021-05-21 | 2022-11-24 | ||
CN113683772B (zh) * | 2021-08-30 | 2022-10-04 | 浙江大学 | 一种低分子量官能化星型聚苯醚及其制备方法 |
CN116769298B (zh) * | 2023-05-26 | 2024-04-26 | 湖南恒屹新材料有限公司 | 一种车用高强度改性聚苯醚工程材料及其制备方法 |
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DE4023232A1 (de) * | 1990-07-21 | 1992-01-23 | Huels Chemische Werke Ag | Thermoplastische formmassen auf basis modifizierter polyphenylether |
EP0530442B1 (en) * | 1991-09-03 | 1996-09-04 | Mitsubishi Chemical Corporation | Process for producing a hydroxy-substituted poly (phenylene ether) resin |
CA2082695A1 (en) * | 1991-12-31 | 1993-07-01 | David F. Aycock | Polyphenylene ether capping process, polyphenylene resins obtained thereby and compositions thereof |
US5315042A (en) * | 1993-03-22 | 1994-05-24 | General Electric Company | Use of partial acetone conversion for capacity increase and quality/yield improvement in the bisphenol-A reaction |
JPH07278293A (ja) * | 1994-04-11 | 1995-10-24 | Asahi Chem Ind Co Ltd | ポリフェニレンエーテルの改質方法 |
WO1996001865A1 (en) * | 1994-07-11 | 1996-01-25 | Dsm N.V. | Multihydroxy-functional oligophenylene oxide |
-
1997
- 1997-02-14 US US08/800,694 patent/US5880221A/en not_active Expired - Lifetime
-
1998
- 1998-01-08 CA CA002250841A patent/CA2250841A1/en not_active Abandoned
- 1998-01-08 BR BR9805985-8A patent/BR9805985A/pt unknown
- 1998-01-08 AU AU58191/98A patent/AU734335B2/en not_active Ceased
- 1998-01-08 KR KR1019980708169A patent/KR20000064906A/ko not_active Application Discontinuation
- 1998-01-08 TR TR1998/02062T patent/TR199802062T1/xx unknown
- 1998-01-08 CZ CZ983258A patent/CZ325898A3/cs unknown
- 1998-01-08 EP EP98901740A patent/EP0895519B1/en not_active Expired - Lifetime
- 1998-01-08 CN CNB988004372A patent/CN1188450C/zh not_active Expired - Lifetime
- 1998-01-08 WO PCT/US1998/000351 patent/WO1998036015A1/en not_active Application Discontinuation
- 1998-01-08 JP JP53572398A patent/JP4113261B2/ja not_active Expired - Lifetime
- 1998-01-08 DE DE69808707T patent/DE69808707T2/de not_active Expired - Lifetime
- 1998-01-08 AT AT98901740T patent/ATE226223T1/de not_active IP Right Cessation
- 1998-02-02 TW TW087101183A patent/TW438837B/zh active
Also Published As
Publication number | Publication date |
---|---|
DE69808707D1 (de) | 2002-11-21 |
ATE226223T1 (de) | 2002-11-15 |
TR199802062T1 (xx) | 1999-05-21 |
EP0895519B1 (en) | 2002-10-16 |
CA2250841A1 (en) | 1998-08-20 |
CZ325898A3 (cs) | 1999-08-11 |
JP4113261B2 (ja) | 2008-07-09 |
AU734335B2 (en) | 2001-06-14 |
WO1998036015A1 (en) | 1998-08-20 |
DE69808707T2 (de) | 2003-06-12 |
AU5819198A (en) | 1998-09-08 |
US5880221A (en) | 1999-03-09 |
TW438837B (en) | 2001-06-07 |
CN1222921A (zh) | 1999-07-14 |
JP2000509097A (ja) | 2000-07-18 |
EP0895519A1 (en) | 1999-02-10 |
KR20000064906A (ko) | 2000-11-06 |
CN1188450C (zh) | 2005-02-09 |
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Legal Events
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B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |