BR8601873A - Liga a base de cobre e processo para sua fabricacao - Google Patents

Liga a base de cobre e processo para sua fabricacao

Info

Publication number
BR8601873A
BR8601873A BR8601873A BR8601873A BR8601873A BR 8601873 A BR8601873 A BR 8601873A BR 8601873 A BR8601873 A BR 8601873A BR 8601873 A BR8601873 A BR 8601873A BR 8601873 A BR8601873 A BR 8601873A
Authority
BR
Brazil
Prior art keywords
connect
manufacturing
copper base
copper
base
Prior art date
Application number
BR8601873A
Other languages
English (en)
Inventor
Ronald N Caron
John F Breedis
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24922769&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BR8601873(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Olin Corp filed Critical Olin Corp
Publication of BR8601873A publication Critical patent/BR8601873A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
BR8601873A 1985-04-26 1986-04-25 Liga a base de cobre e processo para sua fabricacao BR8601873A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/727,463 US4594221A (en) 1985-04-26 1985-04-26 Multipurpose copper alloys with moderate conductivity and high strength

Publications (1)

Publication Number Publication Date
BR8601873A true BR8601873A (pt) 1986-12-30

Family

ID=24922769

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8601873A BR8601873A (pt) 1985-04-26 1986-04-25 Liga a base de cobre e processo para sua fabricacao

Country Status (11)

Country Link
US (1) US4594221A (pt)
EP (2) EP0203389B1 (pt)
JP (2) JP2572042B2 (pt)
KR (1) KR910006017B1 (pt)
CN (1) CN1007909B (pt)
AU (1) AU586674B2 (pt)
BR (1) BR8601873A (pt)
CA (1) CA1266388A (pt)
DE (2) DE3650726T2 (pt)
HK (1) HK145394A (pt)
MX (1) MX166144B (pt)

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US5043222A (en) * 1988-03-17 1991-08-27 Olin Corporation Metal sealing glass composite with matched coefficients of thermal expansion
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JP2597773B2 (ja) * 1991-08-30 1997-04-09 株式会社神戸製鋼所 異方性が少ない高強度銅合金の製造方法
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US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
US5306465A (en) * 1992-11-04 1994-04-26 Olin Corporation Copper alloy having high strength and high electrical conductivity
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JP3362479B2 (ja) * 1993-11-05 2003-01-07 株式会社日立製作所 回転電機の回転子
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US6351348B1 (en) 1994-03-15 2002-02-26 International Business Machines Corporation Minimal stiffness conductors for a head gimbal assembly
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US6539609B2 (en) 1994-07-05 2003-04-01 International Business Machines Corporation Method of forming a head gimbal assembly
US5681662A (en) * 1995-09-15 1997-10-28 Olin Corporation Copper alloy foils for flexible circuits
KR0157258B1 (ko) * 1995-12-08 1998-11-16 정훈보 석출 경화형 동합금의 제조방법
US6001196A (en) * 1996-10-28 1999-12-14 Brush Wellman, Inc. Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
JPH1116465A (ja) * 1997-06-25 1999-01-22 Matsushita Electric Ind Co Ltd サーマルプロテクタ
US6049469A (en) * 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
JP3739214B2 (ja) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
US6251199B1 (en) 1999-05-04 2001-06-26 Olin Corporation Copper alloy having improved resistance to cracking due to localized stress
JP3520034B2 (ja) * 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
US7090732B2 (en) * 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy
JP3520046B2 (ja) 2000-12-15 2004-04-19 古河電気工業株式会社 高強度銅合金
DE20117689U1 (de) * 2001-11-01 2002-02-14 Daume Karin Einrichtung zum elektrisch leitenden Kontaktieren eines elektrisch leitenden Teiles eines länglichen Körpers, insbesondere eines Rohres oder Kabels
US7182823B2 (en) * 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
US6845996B2 (en) * 2003-03-05 2005-01-25 Merits Health Products Co., Ltd. Shock absorber for a power wheelchair
JP4255330B2 (ja) * 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系合金部材
JP4664584B2 (ja) * 2003-09-18 2011-04-06 株式会社神戸製鋼所 高強度銅合金板および高強度銅合金板の製造方法
JP3731600B2 (ja) 2003-09-19 2006-01-05 住友金属工業株式会社 銅合金およびその製造方法
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
EP2111932B1 (en) * 2004-01-16 2012-06-27 Sumitomo Metal Industries, Ltd. Method for manufacturing seamless pipes or tubes
EP1731624A4 (en) * 2004-03-12 2007-06-13 Sumitomo Metal Ind COPPER ALLOY AND PRODUCTION METHOD THEREOF
JP4100629B2 (ja) * 2004-04-16 2008-06-11 日鉱金属株式会社 高強度高導電性銅合金
JP3946709B2 (ja) * 2004-05-13 2007-07-18 日鉱金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条
JP4809602B2 (ja) * 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP4166196B2 (ja) * 2004-06-28 2008-10-15 日鉱金属株式会社 曲げ加工性が優れたＣｕ−Ｎｉ−Ｓｉ系銅合金条
WO2006101172A1 (ja) * 2005-03-24 2006-09-28 Nippon Mining & Metals Co., Ltd. 電子材料用銅合金
JP4068626B2 (ja) * 2005-03-31 2008-03-26 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP4655834B2 (ja) * 2005-09-02 2011-03-23 日立電線株式会社 電気部品用銅合金材とその製造方法
JP4501818B2 (ja) * 2005-09-02 2010-07-14 日立電線株式会社 銅合金材およびその製造方法
CN100345988C (zh) * 2005-12-13 2007-10-31 江苏科技大学 高强度铜合金导电丝材及生产方法
KR101049655B1 (ko) 2006-05-26 2011-07-14 가부시키가이샤 고베 세이코쇼 고강도, 고도전율 및 굽힘 가공성이 뛰어난 구리 합금
JP4247922B2 (ja) * 2006-09-12 2009-04-02 古河電気工業株式会社 電気・電子機器用銅合金板材およびその製造方法
US20080175746A1 (en) * 2007-01-18 2008-07-24 Nippon Mining & Metals Co., Ltd. Cu-Ni-Si system copper alloy for electronic materials
US8287669B2 (en) * 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
WO2009016706A1 (ja) 2007-07-27 2009-02-05 Materials Solution Inc. Ｃｕ合金材
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
CN101812612B (zh) * 2010-05-13 2011-10-05 中铝洛阳铜业有限公司 一种cy状态高速电气化铁路用镍硅铜合金棒材或型材
KR101031293B1 (ko) * 2010-06-16 2011-04-29 이구산업 주식회사 고온에서도 우수한 강도, 전기전도도를 갖는 전기, 전자부품용 고기능성 동합금 및 그 제조방법
CN102925746B (zh) * 2012-11-29 2014-09-17 宁波兴业鑫泰新型电子材料有限公司 高性能Cu-Ni-Si系铜合金及其制备和加工方法
JP6294766B2 (ja) * 2014-05-30 2018-03-14 古河電気工業株式会社 銅合金材およびその製造方法
CN104480346A (zh) * 2014-12-25 2015-04-01 春焱电子科技（苏州）有限公司 一种含有钽元素的电子材料用铜合金
CN104726744B (zh) * 2015-03-17 2016-10-05 太原晋西春雷铜业有限公司 一种蚀刻用铜合金框架材料带材及其制备方法
JP6385383B2 (ja) * 2016-03-31 2018-09-05 Ｊｘ金属株式会社 銅合金板材および銅合金板材の製造方法
CN106711721A (zh) * 2016-12-29 2017-05-24 宁波市胜源技术转移有限公司 一种手机数据线
JP6811199B2 (ja) * 2018-03-26 2021-01-13 Ｊｘ金属株式会社 耐金型摩耗性およびプレス打ち抜き性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金条
CN108642419A (zh) * 2018-05-31 2018-10-12 太原晋西春雷铜业有限公司 一种折弯性优良的铜镍硅合金带材及其制备方法
CN110205515B (zh) * 2019-04-15 2020-07-10 南阳裕泰隆粉体材料有限公司 一种耐腐蚀Cu-Ni合金的制备方法

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Also Published As

Publication number Publication date
KR910006017B1 (ko) 1991-08-09
DE3650726T2 (de) 2000-03-16
JP2572042B2 (ja) 1997-01-16
EP0579278A3 (pt) 1994-04-06
CA1266388A (en) 1990-03-06
JPH08325681A (ja) 1996-12-10
MX166144B (es) 1992-12-22
EP0203389A1 (en) 1986-12-03
DE3689777D1 (de) 1994-05-19
JP2617703B2 (ja) 1997-06-04
CN86102885A (zh) 1986-11-19
KR860008295A (ko) 1986-11-14
AU5598986A (en) 1986-10-30
HK145394A (en) 1994-12-30
JPS61250134A (ja) 1986-11-07
EP0203389B1 (en) 1994-04-13
DE3650726D1 (de) 1999-09-23
US4594221A (en) 1986-06-10
EP0579278B1 (en) 1999-08-18
CN1007909B (zh) 1990-05-09
EP0579278A2 (en) 1994-01-19
DE3689777T2 (de) 1994-11-24
AU586674B2 (en) 1989-07-20

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Legal Events

Date Code Title Description
B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 25/04/2001