BR112017007630A2 - aparelho de galvanoplastia. - Google Patents

aparelho de galvanoplastia.

Info

Publication number
BR112017007630A2
BR112017007630A2 BR112017007630-6A BR112017007630A BR112017007630A2 BR 112017007630 A2 BR112017007630 A2 BR 112017007630A2 BR 112017007630 A BR112017007630 A BR 112017007630A BR 112017007630 A2 BR112017007630 A2 BR 112017007630A2
Authority
BR
Brazil
Prior art keywords
copper
anode
chamber
redox potential
electroplating device
Prior art date
Application number
BR112017007630-6A
Other languages
English (en)
Japanese (ja)
Inventor
Sakurai Hitoshi
Ono Kazunori
Hashimoto Akira
Yuasa Satoshi
Original Assignee
Dipsol Chemicals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chemicals Co., Ltd. filed Critical Dipsol Chemicals Co., Ltd.
Publication of BR112017007630A2 publication Critical patent/BR112017007630A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/002—Alloys based on nickel or cobalt with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

o propósito da presente invenção é fornecer um dispositivo de galvanoplastia de cobre e níquel que é capaz de formar estavelmente uma película de galvanização de cobre e níquel tendo uma composição homogênea em um objeto a ser galvanizado, e permite o uso de um banho de galvanização durante um longo período de tempo. a presente invenção fornece um dispositivo de galvanoplastia de liga de cobre-níquel (1), distinguido por compreender: uma câmara do catodo (4) na qual um objeto (5) a ser galvanizado é colocado; uma câmara do anodo (6); um anodo (7) disposto na câmara do anodo; um diafragma energizável (14) arranjado para separar a câmara do catodo e a câmara do anodo; um tanque de ajuste de potencial redox na câmara do catodo (8) para ajustar o potencial redox de uma solução de galvanização na câmara do catodo; um tanque de ajuste de potencial redox na câmara do anodo (10) para ajustar o potencial redox de uma solução de galvanização na câmara do anodo; e uma unidade de fonte de energia (36) para passar uma corrente entre o objeto a ser galvanizado e o anodo.
BR112017007630-6A 2014-10-17 2015-06-25 aparelho de galvanoplastia. BR112017007630A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-212524 2014-10-17
JP2014212524A JP6435546B2 (ja) 2014-10-17 2014-10-17 銅−ニッケル合金電気めっき装置
PCT/JP2015/068332 WO2016059833A1 (ja) 2014-10-17 2015-06-25 銅－ニッケル合金電気めっき装置

Publications (1)

Publication Number Publication Date
BR112017007630A2 true BR112017007630A2 (pt) 2018-01-30

Family

ID=55746382

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112017007630-6A BR112017007630A2 (pt) 2014-10-17 2015-06-25 aparelho de galvanoplastia.

Country Status (13)

Country Link
US (1) US10538854B2 (pt)
EP (1) EP3208364B1 (pt)
JP (1) JP6435546B2 (pt)
KR (1) KR101916614B1 (pt)
CN (1) CN107075713B (pt)
BR (1) BR112017007630A2 (pt)
MX (1) MX2017004574A (pt)
MY (1) MY190427A (pt)
PH (1) PH12017500597A1 (pt)
RU (1) RU2648811C1 (pt)
SG (1) SG11201703049XA (pt)
TW (1) TWI651438B (pt)
WO (1) WO2016059833A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法
KR101872734B1 (ko) * 2017-07-20 2018-06-29 주식회사 익스톨 니켈 전기 도금액 및 이를 이용한 전기 도금 방법
JP2020097764A (ja) * 2018-12-18 2020-06-25 トヨタ自動車株式会社 成膜装置、及びそれを用いた金属膜の形成方法
CN110387573B (zh) * 2019-07-04 2021-01-05 广州兴森快捷电路科技有限公司 多废液分流方法及电镀生产系统
CA3109026A1 (en) * 2020-02-18 2021-08-18 Magna Exteriors Inc. Tailgate accessibility
CN112126953A (zh) * 2020-09-10 2020-12-25 芜湖数之宇电子科技有限公司 一种铜-镍合金电镀工艺

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SU1019027A1 (ru) * 1982-02-16 1983-05-23 Проектно-конструкторский технологический институт машиностроения Ванна дл гальванической обработки деталей
JPH04198499A (ja) * 1990-07-20 1992-07-17 Asahi Glass Co Ltd 電位調節機構を有する銅溶解槽
USRE39123E1 (en) 1998-11-30 2006-06-13 Ebara Corporation Plating apparatus
WO2001068952A1 (fr) 2000-03-17 2001-09-20 Ebara Corporation Procede et appareil de plaquage electrolytique
KR20020092444A (ko) * 2001-02-23 2002-12-11 가부시키 가이샤 에바라 세이사꾸쇼 구리-도금 용액, 도금 방법 및 도금 장치
JP2003183898A (ja) * 2001-12-20 2003-07-03 Toho Kako Kensetsu Kk めっき液濃度自動調整装置及び方法
US20040007473A1 (en) 2002-07-11 2004-01-15 Applied Materials, Inc. Electrolyte/organic additive separation in electroplating processes
IES20030443A2 (en) * 2003-06-16 2004-12-01 Fraudhalt Ltd A method and apparatus for determining if an optical disk originated from a valid source
US8128791B1 (en) * 2006-10-30 2012-03-06 Novellus Systems, Inc. Control of electrolyte composition in a copper electroplating apparatus
US8762914B2 (en) * 2010-07-24 2014-06-24 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for constraint verification for implementing electronic circuit designs with electrical awareness
JP5631775B2 (ja) * 2011-02-24 2014-11-26 新光電気工業株式会社 複合めっき液
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JP6047711B2 (ja) * 2012-02-08 2016-12-21 石原ケミカル株式会社 無電解ニッケル及びニッケル合金メッキ方法、並びに当該メッキ用の前処理液
RU2588894C2 (ru) 2012-04-19 2016-07-10 Дипсол Кемикалз Ко., Лтд. Ванна для нанесения гальванического покрытия из медно-никелевого сплава и способ нанесения гальванического покрытия

Also Published As

Publication number Publication date
EP3208364B1 (en) 2019-08-07
JP6435546B2 (ja) 2018-12-12
CN107075713B (zh) 2019-09-24
PH12017500597A1 (en) 2017-08-30
KR101916614B1 (ko) 2018-11-07
SG11201703049XA (en) 2017-05-30
WO2016059833A1 (ja) 2016-04-21
CN107075713A (zh) 2017-08-18
TWI651438B (zh) 2019-02-21
KR20170053675A (ko) 2017-05-16
MY190427A (en) 2022-04-21
JP2016079460A (ja) 2016-05-16
TW201615900A (zh) 2016-05-01
RU2648811C1 (ru) 2018-03-28
US10538854B2 (en) 2020-01-21
MX2017004574A (es) 2017-07-17
US20170241040A1 (en) 2017-08-24
EP3208364A4 (en) 2018-05-30
EP3208364A1 (en) 2017-08-23

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Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2625 DE 27-04-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.