BR112015006787A2 - componentes elétricos e métodos e sistemas de fabricação de componentes elétricos - Google Patents

componentes elétricos e métodos e sistemas de fabricação de componentes elétricos

Info

Publication number
BR112015006787A2
BR112015006787A2 BR112015006787A BR112015006787A BR112015006787A2 BR 112015006787 A2 BR112015006787 A2 BR 112015006787A2 BR 112015006787 A BR112015006787 A BR 112015006787A BR 112015006787 A BR112015006787 A BR 112015006787A BR 112015006787 A2 BR112015006787 A2 BR 112015006787A2
Authority
BR
Brazil
Prior art keywords
insulating layer
layer
substrate
circuit layer
electrical
Prior art date
Application number
BR112015006787A
Other languages
English (en)
Inventor
Marie M Freckmann Dominique
Henschel Eva
Schmidt Helge
Kay Myers Marjorie
Leidner Michael
Sachs Soenke
Original Assignee
Tyco Electronics Amp Gmbh
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Amp Gmbh, Tyco Electronics Corp filed Critical Tyco Electronics Amp Gmbh
Publication of BR112015006787A2 publication Critical patent/BR112015006787A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/0006—Electron-beam welding or cutting specially adapted for particular articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

resumo “componentes elétricos e métodos e sistemas de fabricação de componentes elétricos” trata-se de um método de fabricação de um componente elétrico (100) que inclui proporcionar um substrato (104, aplicar uma camada isolante (110) sobre o substrato, aplicar uma camada de circuito (112) sobre a camada isolante, irradiar a camada isolante com um feixe de elétrons (114) para transformar a camada isolante, e irradiar a camada de circuito com um feixe de elétrons para transformar a camada de circuito. o substrato pode ser um substrato metálico que é altamente termicamen-te condutor. a camada isolante proporciona isolamento elétrico e transferência de calor eficaz entre a camada de circuito e o substrato. o método pode incluir acoplar um módulo de diodo emissor de luz (102) ou outros circuitos ativos que necessitem de gerenciamento térmico à camada de circuito residente na camada eletricamente isolante/termicamente condutora.
BR112015006787A 2012-10-05 2013-09-23 componentes elétricos e métodos e sistemas de fabricação de componentes elétricos BR112015006787A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261710395P 2012-10-05 2012-10-05
US13/838,008 US20140097003A1 (en) 2012-10-05 2013-03-15 Electrical components and methods and systems of manufacturing electrical components
PCT/US2013/061102 WO2014055270A1 (en) 2012-10-05 2013-09-23 Electrical components and methods and systems of manufacturing electrical components

Publications (1)

Publication Number Publication Date
BR112015006787A2 true BR112015006787A2 (pt) 2017-07-04

Family

ID=50431850

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015006787A BR112015006787A2 (pt) 2012-10-05 2013-09-23 componentes elétricos e métodos e sistemas de fabricação de componentes elétricos

Country Status (8)

Country Link
US (2) US20140097003A1 (pt)
EP (1) EP2904882A1 (pt)
JP (1) JP2015532533A (pt)
KR (1) KR20150052280A (pt)
CN (1) CN104704931B (pt)
BR (1) BR112015006787A2 (pt)
MX (1) MX346728B (pt)
WO (1) WO2014055270A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013217068A1 (de) * 2013-08-27 2015-03-19 Tyco Electronics Amp Gmbh Elektronenstrahlunterstützte Herstellung von elektrischen Bauelementen
DE102015210460B4 (de) * 2015-06-08 2021-10-07 Te Connectivity Germany Gmbh Verfahren zur Veränderung mechanischer und/oder elektrischer Eigenschaften zumindest eines Bereichs eines elektrischen Kontaktelements
US20170100916A1 (en) * 2015-10-12 2017-04-13 Tyco Electronics Corporation Electronic Component and Process of Producing Electronic Component
CN108031836B (zh) * 2018-01-22 2019-12-03 北京大学 一种金属-金属氧化物纳米复合材料的制备方法
TWI662872B (zh) * 2018-01-26 2019-06-11 謝孟修 陶瓷電路板及其製法
US20220324025A1 (en) * 2020-04-30 2022-10-13 Hitachi Energy Switzerland Ag Method and system for additive manufacturing of electrical devices

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Also Published As

Publication number Publication date
JP2015532533A (ja) 2015-11-09
KR20150052280A (ko) 2015-05-13
US20150126026A1 (en) 2015-05-07
MX346728B (es) 2017-03-30
EP2904882A1 (en) 2015-08-12
WO2014055270A1 (en) 2014-04-10
CN104704931A (zh) 2015-06-10
CN104704931B (zh) 2019-01-08
MX2015004040A (es) 2015-07-06
US20140097003A1 (en) 2014-04-10

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