JPS6484792A - Manufacture of ceramic multilayer substrate - Google Patents

Manufacture of ceramic multilayer substrate

Info

Publication number
JPS6484792A
JPS6484792A JP24322487A JP24322487A JPS6484792A JP S6484792 A JPS6484792 A JP S6484792A JP 24322487 A JP24322487 A JP 24322487A JP 24322487 A JP24322487 A JP 24322487A JP S6484792 A JPS6484792 A JP S6484792A
Authority
JP
Japan
Prior art keywords
executed
during
steam
atmosphere
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24322487A
Other languages
Japanese (ja)
Inventor
Kiichi Yoshiara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP24322487A priority Critical patent/JPS6484792A/en
Publication of JPS6484792A publication Critical patent/JPS6484792A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To effectively bake a ceramic multilayer substrate and to bake it under optimum conditions by a method wherein a partial pressure of steam in an atmosphere is controlled by means ot concentration of a specific gas component in exhaust fumes during a process to remove a binder. CONSTITUTION:A specimen 9 is baked in an electric furnace 3, and this process is constituted by three steps. During a first step, an organic binding agent is decomposed thermally and removed. During a second step, residual carbon is removed; during a third step, a sintering operation and a cooling operation are executed. The first step is executed within a range between a and b; a temperature is raised at a speed of 2-6 deg.C/min; an atmosphere is composed of dry nitrogen. The second step is executed within a range between b and c by using steam; this step is held for an X hour until concentration of CO, CO2 and CnHn is exhaust fumes reaches 5ppm or less. X is to be set at a value of 0-5 for a methacrylate-based organic compound. An atmosphere is composed of wet nitrogen; a partial pressure of steam is controlled by means of concentration of CO, CO2 and CnHn. The third step is executed within a range between c and f in Figure 2. Because a softening point of glass used is 810 deg.C, a sintering operation is executed at 900 deg.C for one hour.
JP24322487A 1987-09-28 1987-09-28 Manufacture of ceramic multilayer substrate Pending JPS6484792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24322487A JPS6484792A (en) 1987-09-28 1987-09-28 Manufacture of ceramic multilayer substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24322487A JPS6484792A (en) 1987-09-28 1987-09-28 Manufacture of ceramic multilayer substrate

Publications (1)

Publication Number Publication Date
JPS6484792A true JPS6484792A (en) 1989-03-30

Family

ID=17100680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24322487A Pending JPS6484792A (en) 1987-09-28 1987-09-28 Manufacture of ceramic multilayer substrate

Country Status (1)

Country Link
JP (1) JPS6484792A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186126A (en) * 2004-12-28 2006-07-13 Ngk Spark Plug Co Ltd Wiring board manufacturing method
JP2015532533A (en) * 2012-10-05 2015-11-09 タイコ・エレクトロニクス・コーポレイションTyco Electronics Corporation Electrical component and method and system for manufacturing electrical component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186126A (en) * 2004-12-28 2006-07-13 Ngk Spark Plug Co Ltd Wiring board manufacturing method
JP2015532533A (en) * 2012-10-05 2015-11-09 タイコ・エレクトロニクス・コーポレイションTyco Electronics Corporation Electrical component and method and system for manufacturing electrical component

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