BR112014002699A8 - composto adesivo termicamente ativado condutor de eletricidade - Google Patents

composto adesivo termicamente ativado condutor de eletricidade

Info

Publication number
BR112014002699A8
BR112014002699A8 BR112014002699A BR112014002699A BR112014002699A8 BR 112014002699 A8 BR112014002699 A8 BR 112014002699A8 BR 112014002699 A BR112014002699 A BR 112014002699A BR 112014002699 A BR112014002699 A BR 112014002699A BR 112014002699 A8 BR112014002699 A8 BR 112014002699A8
Authority
BR
Brazil
Prior art keywords
thermally activated
adhesive compound
activated adhesive
electricity conductor
compound electricity
Prior art date
Application number
BR112014002699A
Other languages
English (en)
Other versions
BR112014002699A2 (pt
Inventor
Keitetelgenbüscher Klaus
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of BR112014002699A2 publication Critical patent/BR112014002699A2/pt
Publication of BR112014002699A8 publication Critical patent/BR112014002699A8/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer

Abstract

resumo patente de invenção: "composto adesivo termicamente ativado condutor de eletricidade". a presente invenção refere-se a películas adesivas, que podem ser ligadas quando termicamente ativadas, compreendendo: a) uma mistura de polímero-metal compreendendo pelo menos um composto adesivo que possa ser ligado quando termicamente ativado, pelo menos um componente metálico que derreta dentro da faixa de temperaturas de 50ºc a 400ºc, e b) pelo menos um material de carga fibrosa condutor de eletricidade, em que o material de carga está presente, pelo menos em parte, como uma rede de fibras interconectadas compreendendo o componente metálico.
BR112014002699A 2011-08-10 2012-07-10 composto adesivo termicamente ativado condutor de eletricidade BR112014002699A8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011080724A DE102011080724A1 (de) 2011-08-10 2011-08-10 Elektrisch leitfähige hitzeaktivierbare Klebemasse
PCT/EP2012/063465 WO2013020765A1 (de) 2011-08-10 2012-07-10 Elektrisch leitfähige hitzeaktivierbare klebemasse

Publications (2)

Publication Number Publication Date
BR112014002699A2 BR112014002699A2 (pt) 2017-06-13
BR112014002699A8 true BR112014002699A8 (pt) 2017-06-20

Family

ID=46508345

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014002699A BR112014002699A8 (pt) 2011-08-10 2012-07-10 composto adesivo termicamente ativado condutor de eletricidade

Country Status (9)

Country Link
US (1) US9593264B2 (pt)
EP (1) EP2742104B1 (pt)
JP (1) JP5940154B2 (pt)
KR (1) KR101927474B1 (pt)
CN (1) CN103890115B (pt)
BR (1) BR112014002699A8 (pt)
DE (1) DE102011080724A1 (pt)
PL (1) PL2742104T3 (pt)
WO (1) WO2013020765A1 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9278187B2 (en) * 2013-03-13 2016-03-08 Biosense Webster (Israel) Ltd. Method for making a low OHMIC pressure-contact electrical connection between split ring electrode and lead wire
US20160012934A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Composite Formulation and Composite Product
TWI673337B (zh) * 2014-09-30 2019-10-01 日商琳得科股份有限公司 導電性黏著薄片
JP6682235B2 (ja) * 2014-12-24 2020-04-15 日東電工株式会社 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
WO2016104188A1 (ja) * 2014-12-24 2016-06-30 日東電工株式会社 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
US20160300636A1 (en) * 2015-04-10 2016-10-13 Tyco Electronics Corporation Conductive Composite Formulation and Article At Least Partially Formed From a Conductive Composite Formulation
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
US10611913B2 (en) 2016-02-12 2020-04-07 Delphi Technologies, Llc Method of enhancing surface electrical conductivity of conductive plastics and conductive plastic films produced thereby
FR3062958B1 (fr) * 2017-02-10 2019-04-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Module elementaire d'une pile a combustible
FR3062960B1 (fr) 2017-02-10 2021-05-21 Commissariat Energie Atomique Pile a combustible
CN109233652B (zh) * 2017-05-26 2021-06-25 宁德新能源科技有限公司 导电胶带、使用该导电胶带的极片、电芯和二次电池
US11240916B2 (en) * 2017-05-31 2022-02-01 Cryovac, Llc Electronic device, method and apparatus for producing an electronic device, and composition therefor
CN112318961A (zh) * 2020-12-10 2021-02-05 山东非金属材料研究所 一种新型电磁屏蔽材料的制备方法
EP4315466A1 (en) * 2021-03-31 2024-02-07 Enovix Corporation Electrode assemblies including current limiters, secondary batteries having such electrode assemblies, and methods of testing

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980186A (ja) 1982-10-26 1984-05-09 Fanuc Ltd モ−タのロ−タ位置検出回路
US4533685A (en) 1983-07-26 1985-08-06 Hudgin Donald E Polymer-metal blend
JPH0749491B2 (ja) * 1987-04-07 1995-05-31 東芝ケミカル株式会社 導電性樹脂組成物
KR880011821A (ko) 1987-03-09 1988-10-31 오오자와 히데오 도전성 수지 조성물 및 그 성형품
AU612771B2 (en) 1988-02-26 1991-07-18 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
JPH03138808A (ja) * 1989-10-23 1991-06-13 Toshiba Chem Corp 導電性樹脂組成物及びその成形品
US5082595A (en) 1990-01-31 1992-01-21 Adhesives Research, Inc. Method of making an electrically conductive pressure sensitive adhesive
US5948533A (en) * 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
DE4039780C1 (pt) 1990-12-13 1992-08-06 Lohmann Gmbh & Co Kg, 5450 Neuwied, De
US5463190A (en) 1994-04-04 1995-10-31 Motorola, Inc. Electrically conductive adhesive
JP2956875B2 (ja) 1994-05-19 1999-10-04 矢崎総業株式会社 電磁遮蔽用成形材料
US6013376A (en) * 1997-12-09 2000-01-11 3M Innovative Properties Company Metal fibermat/polymer composite
DE69902957T2 (de) * 1998-03-10 2003-09-11 Togo Seisakusho Kk Leitfähige Harzzusammensetzung
JP2000273317A (ja) * 1999-02-12 2000-10-03 Natl Starch & Chem Investment Holding Corp エレクトロニクスデバイス用の電気的安定性をもつ導電性および抵抗性材料
US6344157B1 (en) * 1999-02-12 2002-02-05 National Starch And Chemical Investment Holding Corporation Conductive and resistive materials with electrical stability for use in electronics devices
JP2001200225A (ja) * 2000-01-18 2001-07-24 Mitsubishi Plastics Ind Ltd 接着用導電性樹脂組成物
JP2001291431A (ja) * 2000-04-10 2001-10-19 Jsr Corp 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造
JP2004511585A (ja) * 2000-09-22 2004-04-15 ギルバート・ブロック 熱活性化テープ
US20050178496A1 (en) * 2001-02-15 2005-08-18 Integral Technologies, Inc. Low cost electrically conductive tapes and films manufactured from conductive loaded resin-based materials
US20050031823A1 (en) * 2001-02-15 2005-02-10 Integral Technologies, Inc. Low cost conductive labels manufactured from conductive loaded resin-based materials
DE10162613A1 (de) * 2001-08-23 2003-06-12 Tesa Ag Elektrisch leitfähiges, permanent vollflächig haftklebriges, vorzugsweise trägerloses Klebeband bestehend aus einer vorzugsweise auf ein antiadhäsives Medium beschichteten Schicht eines Haftklebstoffs mit alkalisch reagierender Haftklebeoberfläche
WO2004022663A1 (ja) * 2002-09-04 2004-03-18 Namics Corporation 導電性接着剤およびそれを用いた回路
JP2004143357A (ja) * 2002-10-28 2004-05-20 Toyo Ink Mfg Co Ltd 導電性接着シート及び該シートの製造方法
DE10259549A1 (de) * 2002-12-19 2004-07-08 Tesa Ag Haftklebeartikel mit wenigstens einer Schicht aus einer elektrisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung
DE10310722A1 (de) * 2003-03-10 2004-09-23 Tesa Ag Elektrisch erwärmbare Haftklebemasse
DE50313308D1 (de) 2003-05-07 2011-01-20 Sika Technology Ag Stapelbares Modul
JP2004352926A (ja) * 2003-05-30 2004-12-16 Three M Innovative Properties Co 電磁波シールド用粘着性複合材料
PT1695358E (pt) * 2003-12-12 2008-02-15 Siemens Ag Híbrido metal-plástico e corpos moldados fabricados com o mesmo
DE102004029589A1 (de) 2004-06-18 2005-12-29 Tesa Ag Elektrisch anisotrop leitfähiger Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper
US20060247352A1 (en) * 2005-04-29 2006-11-02 Ariel - University Research And Development Ltd. EMI shielding material
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
US20100044088A1 (en) 2006-07-05 2010-02-25 Ablestik (Japan) Co. Ltd. Conductive adhesive
JP2009544815A (ja) 2006-07-24 2009-12-17 スリーエム イノベイティブ プロパティズ カンパニー 導電性感圧性接着剤
US7554793B2 (en) * 2006-11-16 2009-06-30 Kemet Electronics Corporation Low temperature curable conductive adhesive and capacitors formed thereby
JP2008186590A (ja) * 2007-01-26 2008-08-14 Teijin Ltd 高熱伝導性導電性組成物、導電性ペースト、導電性接着剤
DE102007006881A1 (de) 2007-02-07 2008-08-21 Henkel Ag & Co. Kgaa Verfahren zum Verkleben eines ersten Bauteils mit einem zweiten Bauteil
DE102007007617A1 (de) 2007-02-13 2008-08-14 Tesa Ag Intrinsisch erwärmbare heißschmelzklebrige Flächengebilde
US7722786B2 (en) * 2007-02-23 2010-05-25 Henkel Ag & Co. Kgaa Conductive materials
KR101658328B1 (ko) * 2007-12-18 2016-09-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전도성 접착제 전구체, 그 사용 방법, 및 용품
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
CA2766859A1 (en) 2009-07-08 2011-01-13 Henkel Ag & Co. Kgaa Electrically conductive adhesives
KR101225497B1 (ko) * 2009-11-05 2013-01-23 (주)덕산테코피아 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치
US20110132537A1 (en) * 2009-12-03 2011-06-09 3M Innovative Properties Company Composition, tape, and use thereof
CN101942287A (zh) * 2010-09-27 2011-01-12 彩虹集团公司 一种低温导电胶及其制备方法
US20120228013A1 (en) 2011-03-07 2012-09-13 Endicott Interconnect Technologies, Inc. Defective conductive surface pad repair for microelectronic circuit cards
JP5777376B2 (ja) * 2011-03-31 2015-09-09 内浜化成株式会社 導電性樹脂と金属部品との導通方法
JP2018006590A (ja) * 2016-07-04 2018-01-11 日本電信電話株式会社 光半導体素子

Also Published As

Publication number Publication date
BR112014002699A2 (pt) 2017-06-13
US9593264B2 (en) 2017-03-14
US20140216644A1 (en) 2014-08-07
CN103890115B (zh) 2017-10-24
CN103890115A (zh) 2014-06-25
PL2742104T3 (pl) 2018-04-30
WO2013020765A1 (de) 2013-02-14
KR20140068956A (ko) 2014-06-09
KR101927474B1 (ko) 2018-12-11
EP2742104A1 (de) 2014-06-18
JP2014529638A (ja) 2014-11-13
DE102011080724A1 (de) 2013-02-14
JP5940154B2 (ja) 2016-06-29
EP2742104B1 (de) 2017-12-27

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]