BR112014002699A2 - composto adesivo termicamente ativado condutor de eletricidade - Google Patents
composto adesivo termicamente ativado condutor de eletricidadeInfo
- Publication number
- BR112014002699A2 BR112014002699A2 BR112014002699A BR112014002699A BR112014002699A2 BR 112014002699 A2 BR112014002699 A2 BR 112014002699A2 BR 112014002699 A BR112014002699 A BR 112014002699A BR 112014002699 A BR112014002699 A BR 112014002699A BR 112014002699 A2 BR112014002699 A2 BR 112014002699A2
- Authority
- BR
- Brazil
- Prior art keywords
- thermally activated
- adhesive compound
- activated adhesive
- electricity conductor
- compound electricity
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Conductive Materials (AREA)
Abstract
resumo patente de invenção: "composto adesivo termicamente ativado condutor de eletricidade". a presente invenção refere-se a películas adesivas, que podem ser ligadas quando termicamente ativadas, compreendendo: a) uma mistura de polímero-metal compreendendo pelo menos um composto adesivo que possa ser ligado quando termicamente ativado, pelo menos um componente metálico que derreta dentro da faixa de temperaturas de 50ºc a 400ºc, e b) pelo menos um material de carga fibrosa condutor de eletricidade, em que o material de carga está presente, pelo menos em parte, como uma rede de fibras interconectadas compreendendo o componente metálico.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011080724A DE102011080724A1 (de) | 2011-08-10 | 2011-08-10 | Elektrisch leitfähige hitzeaktivierbare Klebemasse |
PCT/EP2012/063465 WO2013020765A1 (de) | 2011-08-10 | 2012-07-10 | Elektrisch leitfähige hitzeaktivierbare klebemasse |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112014002699A2 true BR112014002699A2 (pt) | 2017-06-13 |
BR112014002699A8 BR112014002699A8 (pt) | 2017-06-20 |
Family
ID=46508345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112014002699A BR112014002699A8 (pt) | 2011-08-10 | 2012-07-10 | composto adesivo termicamente ativado condutor de eletricidade |
Country Status (9)
Country | Link |
---|---|
US (1) | US9593264B2 (pt) |
EP (1) | EP2742104B1 (pt) |
JP (1) | JP5940154B2 (pt) |
KR (1) | KR101927474B1 (pt) |
CN (1) | CN103890115B (pt) |
BR (1) | BR112014002699A8 (pt) |
DE (1) | DE102011080724A1 (pt) |
PL (1) | PL2742104T3 (pt) |
WO (1) | WO2013020765A1 (pt) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9278187B2 (en) * | 2013-03-13 | 2016-03-08 | Biosense Webster (Israel) Ltd. | Method for making a low OHMIC pressure-contact electrical connection between split ring electrode and lead wire |
US20160012934A1 (en) * | 2014-07-11 | 2016-01-14 | Tyco Electronics Corporation | Composite Formulation and Composite Product |
TWI673337B (zh) * | 2014-09-30 | 2019-10-01 | 日商琳得科股份有限公司 | 導電性黏著薄片 |
WO2016104188A1 (ja) * | 2014-12-24 | 2016-06-30 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
JP6682235B2 (ja) * | 2014-12-24 | 2020-04-15 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
US20160300636A1 (en) * | 2015-04-10 | 2016-10-13 | Tyco Electronics Corporation | Conductive Composite Formulation and Article At Least Partially Formed From a Conductive Composite Formulation |
JP2018522954A (ja) | 2015-05-01 | 2018-08-16 | ロード コーポレイション | ゴム接合用接着剤 |
US10611913B2 (en) | 2016-02-12 | 2020-04-07 | Delphi Technologies, Llc | Method of enhancing surface electrical conductivity of conductive plastics and conductive plastic films produced thereby |
FR3062958B1 (fr) * | 2017-02-10 | 2019-04-05 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Module elementaire d'une pile a combustible |
FR3062960B1 (fr) | 2017-02-10 | 2021-05-21 | Commissariat Energie Atomique | Pile a combustible |
CN109233652B (zh) * | 2017-05-26 | 2021-06-25 | 宁德新能源科技有限公司 | 导电胶带、使用该导电胶带的极片、电芯和二次电池 |
US11240916B2 (en) * | 2017-05-31 | 2022-02-01 | Cryovac, Llc | Electronic device, method and apparatus for producing an electronic device, and composition therefor |
US20210307163A1 (en) * | 2018-08-03 | 2021-09-30 | Electroninks Incorporated | Conductive materials and their methods of preparation by metallization with metal complex conductive ink compositions |
CN112318961A (zh) * | 2020-12-10 | 2021-02-05 | 山东非金属材料研究所 | 一种新型电磁屏蔽材料的制备方法 |
WO2022212132A1 (en) * | 2021-03-31 | 2022-10-06 | Enovix Operations Inc. | Electrode assemblies including current limiters, secondary batteries having such electrode assemblies, and methods of testing |
WO2024077132A2 (en) * | 2022-10-05 | 2024-04-11 | Enovix Corporation | Electrode assemblies for secondary batteries that include current limiters |
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DE102008047964A1 (de) | 2008-09-18 | 2010-03-25 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
DE102008060113A1 (de) | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
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-
2011
- 2011-08-10 DE DE102011080724A patent/DE102011080724A1/de not_active Withdrawn
-
2012
- 2012-07-10 KR KR1020147006370A patent/KR101927474B1/ko active IP Right Grant
- 2012-07-10 BR BR112014002699A patent/BR112014002699A8/pt not_active Application Discontinuation
- 2012-07-10 US US14/236,269 patent/US9593264B2/en active Active
- 2012-07-10 JP JP2014524315A patent/JP5940154B2/ja not_active Expired - Fee Related
- 2012-07-10 CN CN201280049583.6A patent/CN103890115B/zh active Active
- 2012-07-10 PL PL12735131T patent/PL2742104T3/pl unknown
- 2012-07-10 EP EP12735131.0A patent/EP2742104B1/de active Active
- 2012-07-10 WO PCT/EP2012/063465 patent/WO2013020765A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2742104A1 (de) | 2014-06-18 |
DE102011080724A1 (de) | 2013-02-14 |
KR20140068956A (ko) | 2014-06-09 |
CN103890115B (zh) | 2017-10-24 |
JP2014529638A (ja) | 2014-11-13 |
EP2742104B1 (de) | 2017-12-27 |
KR101927474B1 (ko) | 2018-12-11 |
US9593264B2 (en) | 2017-03-14 |
WO2013020765A1 (de) | 2013-02-14 |
US20140216644A1 (en) | 2014-08-07 |
BR112014002699A8 (pt) | 2017-06-20 |
PL2742104T3 (pl) | 2018-04-30 |
CN103890115A (zh) | 2014-06-25 |
JP5940154B2 (ja) | 2016-06-29 |
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