BR0214724B1 - composições de resina e seu uso, circuito impresso, processo para produção de uma camada e unidade de embalagem. - Google Patents

composições de resina e seu uso, circuito impresso, processo para produção de uma camada e unidade de embalagem.

Info

Publication number
BR0214724B1
BR0214724B1 BRPI0214724-6A BR0214724A BR0214724B1 BR 0214724 B1 BR0214724 B1 BR 0214724B1 BR 0214724 A BR0214724 A BR 0214724A BR 0214724 B1 BR0214724 B1 BR 0214724B1
Authority
BR
Brazil
Prior art keywords
printed circuit
production process
single layer
resin compositions
packaging unit
Prior art date
Application number
BRPI0214724-6A
Other languages
English (en)
Portuguese (pt)
Other versions
BR0214724A (pt
Inventor
Roger Pierre-Elie Salvin
Martin Roth
Masato Hoshino
Yasuharu Nojima
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BR0214724A publication Critical patent/BR0214724A/pt
Publication of BR0214724B1 publication Critical patent/BR0214724B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/04—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C08F291/02—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to elastomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L19/00—Compositions of rubbers not provided for in groups C08L7/00 - C08L17/00
    • C08L19/006—Rubber characterised by functional groups, e.g. telechelic diene polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Graft Or Block Polymers (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
BRPI0214724-6A 2001-12-06 2002-11-21 composições de resina e seu uso, circuito impresso, processo para produção de uma camada e unidade de embalagem. BR0214724B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH22292001 2001-12-06
PCT/EP2002/013047 WO2003048235A1 (en) 2001-12-06 2002-11-21 Heat-curable resin composition

Publications (2)

Publication Number Publication Date
BR0214724A BR0214724A (pt) 2004-08-31
BR0214724B1 true BR0214724B1 (pt) 2012-09-04

Family

ID=4568114

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0214724-6A BR0214724B1 (pt) 2001-12-06 2002-11-21 composições de resina e seu uso, circuito impresso, processo para produção de uma camada e unidade de embalagem.

Country Status (11)

Country Link
US (1) US7387812B2 (enExample)
EP (1) EP1458794B1 (enExample)
JP (1) JP4509561B2 (enExample)
KR (1) KR100902339B1 (enExample)
CN (1) CN1267478C (enExample)
AT (1) ATE302231T1 (enExample)
AU (1) AU2002352080A1 (enExample)
BR (1) BR0214724B1 (enExample)
CA (1) CA2466611C (enExample)
DE (1) DE60205664T2 (enExample)
WO (1) WO2003048235A1 (enExample)

Families Citing this family (24)

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WO2006033439A1 (en) * 2004-09-21 2006-03-30 Showa Denko K.K. Heat-curable urethane resin composition
US7649060B2 (en) * 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
WO2007125806A1 (ja) * 2006-04-28 2007-11-08 Showa Denko K.K. 熱硬化性樹脂組成物およびその用途
TWI419949B (zh) * 2006-09-28 2013-12-21 Jsr Corp 黏著劑組成物及撓性印刷電路板用基板
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
CN101828434A (zh) * 2007-10-18 2010-09-08 日立化成工业株式会社 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体
JP2009192632A (ja) * 2008-02-12 2009-08-27 Fujifilm Corp 絶縁材料用樹脂組成物、感光性フィルム、及び感光性積層体
JP5239446B2 (ja) * 2008-03-26 2013-07-17 日立化成株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品
DE102008023076A1 (de) 2008-05-09 2009-11-12 Henkel Ag & Co. Kgaa Polymerisierbare Zusammensetzung
JP5270994B2 (ja) * 2008-07-25 2013-08-21 パナソニック株式会社 ミクロフィブリル化セルロース／エラストマー／樹脂複合材の製造方法および成形品の製造方法
KR20120044969A (ko) * 2009-07-10 2012-05-08 다우 글로벌 테크놀로지스 엘엘씨 전기 라미네이트 조성물에 사용하기 위한 코어/쉘 고무
TW201213433A (en) * 2010-09-28 2012-04-01 Dow Global Technologies Llc Epoxy composition with crystallization inhibition
DE102012200855A1 (de) * 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
KR101545724B1 (ko) 2012-08-01 2015-08-19 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
JP6075763B2 (ja) * 2013-03-22 2017-02-08 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用着色スペーサー及び／またはブラックマトリックス
JP2015031849A (ja) * 2013-08-02 2015-02-16 日立化成株式会社 感光性樹脂組成物
JP5700166B1 (ja) 2014-08-01 2015-04-15 東洋インキＳｃホールディングス株式会社 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス
TWI664495B (zh) * 2015-11-06 2019-07-01 日商鐘化股份有限公司 黑色樹脂組合物、附有黑色樹脂硬化膜之聚醯亞胺及其製造方法、以及使用黑色樹脂硬化膜之可撓式印刷配線基板
JP6456313B2 (ja) * 2016-01-26 2019-01-23 株式会社タムラ製作所 感光性樹脂組成物
KR102040225B1 (ko) * 2016-11-11 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
JP6944073B2 (ja) * 2020-01-27 2021-10-06 株式会社タムラ製作所 感光性樹脂組成物
CN113176705B (zh) * 2020-01-27 2024-11-12 株式会社田村制作所 感光性树脂组合物
JP7229304B2 (ja) * 2020-08-06 2023-02-27 株式会社タムラ製作所 感光性樹脂組成物及び感光性樹脂組成物を塗布したプリント配線板

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Also Published As

Publication number Publication date
ATE302231T1 (de) 2005-09-15
CN1599770A (zh) 2005-03-23
KR100902339B1 (ko) 2009-06-12
EP1458794A1 (en) 2004-09-22
EP1458794B1 (en) 2005-08-17
DE60205664D1 (de) 2005-09-22
US20050032935A1 (en) 2005-02-10
CA2466611A1 (en) 2003-06-12
US7387812B2 (en) 2008-06-17
CN1267478C (zh) 2006-08-02
JP2005512117A (ja) 2005-04-28
BR0214724A (pt) 2004-08-31
JP4509561B2 (ja) 2010-07-21
KR20040068192A (ko) 2004-07-30
DE60205664T2 (de) 2006-03-02
CA2466611C (en) 2011-09-27
AU2002352080A1 (en) 2003-06-17
WO2003048235A1 (en) 2003-06-12

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 21/11/2002, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 12A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2281 DE 23-09-2014 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.