JP4509561B2 - 熱硬化性樹脂組成物 - Google Patents
熱硬化性樹脂組成物 Download PDFInfo
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- JP4509561B2 JP4509561B2 JP2003549420A JP2003549420A JP4509561B2 JP 4509561 B2 JP4509561 B2 JP 4509561B2 JP 2003549420 A JP2003549420 A JP 2003549420A JP 2003549420 A JP2003549420 A JP 2003549420A JP 4509561 B2 JP4509561 B2 JP 4509561B2
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- PMOIAJVKYNVHQE-UHFFFAOYSA-N phosphanium;bromide Chemical compound [PH4+].[Br-] PMOIAJVKYNVHQE-UHFFFAOYSA-N 0.000 description 1
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- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
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- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000010420 shell particle Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
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- 239000001488 sodium phosphate Substances 0.000 description 1
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- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- NNENFOSYDBTCBO-UHFFFAOYSA-M tributyl(hexadecyl)phosphanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[P+](CCCC)(CCCC)CCCC NNENFOSYDBTCBO-UHFFFAOYSA-M 0.000 description 1
- QEXITCCVENILJI-UHFFFAOYSA-M tributyl(phenyl)azanium;chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)C1=CC=CC=C1 QEXITCCVENILJI-UHFFFAOYSA-M 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
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- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
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Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
- C08F291/02—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to elastomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
- C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
- C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L19/00—Compositions of rubbers not provided for in groups C08L7/00 - C08L17/00
- C08L19/006—Rubber characterised by functional groups, e.g. telechelic diene polymers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Graft Or Block Polymers (AREA)
- Laminated Bodies (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH22292001 | 2001-12-06 | ||
| PCT/EP2002/013047 WO2003048235A1 (en) | 2001-12-06 | 2002-11-21 | Heat-curable resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005512117A JP2005512117A (ja) | 2005-04-28 |
| JP2005512117A5 JP2005512117A5 (enExample) | 2006-01-19 |
| JP4509561B2 true JP4509561B2 (ja) | 2010-07-21 |
Family
ID=4568114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003549420A Expired - Lifetime JP4509561B2 (ja) | 2001-12-06 | 2002-11-21 | 熱硬化性樹脂組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7387812B2 (enExample) |
| EP (1) | EP1458794B1 (enExample) |
| JP (1) | JP4509561B2 (enExample) |
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| WO2006033439A1 (en) * | 2004-09-21 | 2006-03-30 | Showa Denko K.K. | Heat-curable urethane resin composition |
| US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
| US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
| WO2007125806A1 (ja) * | 2006-04-28 | 2007-11-08 | Showa Denko K.K. | 熱硬化性樹脂組成物およびその用途 |
| TWI419949B (zh) * | 2006-09-28 | 2013-12-21 | Jsr Corp | 黏著劑組成物及撓性印刷電路板用基板 |
| US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
| CN101828434A (zh) * | 2007-10-18 | 2010-09-08 | 日立化成工业株式会社 | 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体 |
| JP2009192632A (ja) * | 2008-02-12 | 2009-08-27 | Fujifilm Corp | 絶縁材料用樹脂組成物、感光性フィルム、及び感光性積層体 |
| JP5239446B2 (ja) * | 2008-03-26 | 2013-07-17 | 日立化成株式会社 | ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品 |
| DE102008023076A1 (de) | 2008-05-09 | 2009-11-12 | Henkel Ag & Co. Kgaa | Polymerisierbare Zusammensetzung |
| JP5270994B2 (ja) * | 2008-07-25 | 2013-08-21 | パナソニック株式会社 | ミクロフィブリル化セルロース／エラストマー／樹脂複合材の製造方法および成形品の製造方法 |
| KR20120044969A (ko) * | 2009-07-10 | 2012-05-08 | 다우 글로벌 테크놀로지스 엘엘씨 | 전기 라미네이트 조성물에 사용하기 위한 코어/쉘 고무 |
| TW201213433A (en) * | 2010-09-28 | 2012-04-01 | Dow Global Technologies Llc | Epoxy composition with crystallization inhibition |
| DE102012200855A1 (de) * | 2012-01-20 | 2013-07-25 | Tesa Se | Vernetzer-Beschleuniger-System für Polyacrylate |
| KR101545724B1 (ko) | 2012-08-01 | 2015-08-19 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트 |
| JP6075763B2 (ja) * | 2013-03-22 | 2017-02-08 | 日本化薬株式会社 | 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用着色スペーサー及び／またはブラックマトリックス |
| JP2015031849A (ja) * | 2013-08-02 | 2015-02-16 | 日立化成株式会社 | 感光性樹脂組成物 |
| JP5700166B1 (ja) | 2014-08-01 | 2015-04-15 | 東洋インキＳｃホールディングス株式会社 | 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス |
| TWI664495B (zh) * | 2015-11-06 | 2019-07-01 | 日商鐘化股份有限公司 | 黑色樹脂組合物、附有黑色樹脂硬化膜之聚醯亞胺及其製造方法、以及使用黑色樹脂硬化膜之可撓式印刷配線基板 |
| JP6456313B2 (ja) * | 2016-01-26 | 2019-01-23 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
| KR102040225B1 (ko) * | 2016-11-11 | 2019-11-06 | 주식회사 엘지화학 | 절연층 제조방법 및 다층인쇄회로기판 제조방법 |
| JP6944073B2 (ja) * | 2020-01-27 | 2021-10-06 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
| CN113176705B (zh) * | 2020-01-27 | 2024-11-12 | 株式会社田村制作所 | 感光性树脂组合物 |
| JP7229304B2 (ja) * | 2020-08-06 | 2023-02-27 | 株式会社タムラ製作所 | 感光性樹脂組成物及び感光性樹脂組成物を塗布したプリント配線板 |
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| JPS63258975A (ja) * | 1986-12-26 | 1988-10-26 | Toshiba Corp | ソルダーレジストインキ組成物 |
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| US5576388A (en) * | 1994-10-11 | 1996-11-19 | Shell Oil Company | Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems |
| DE19631170A1 (de) * | 1996-08-01 | 1998-02-05 | Basf Ag | Schlagzähe thermoplastische Formmassen |
| US6127094A (en) * | 1997-10-02 | 2000-10-03 | Napp Systems Inc. | Acrylate copolymer-containing water-developable photosensitive resins and printing plates prepared therefrom |
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2002
- 2002-11-21 BR BRPI0214724-6A patent/BR0214724B1/pt not_active IP Right Cessation
- 2002-11-21 AT AT02787752T patent/ATE302231T1/de not_active IP Right Cessation
- 2002-11-21 EP EP02787752A patent/EP1458794B1/en not_active Expired - Lifetime
- 2002-11-21 JP JP2003549420A patent/JP4509561B2/ja not_active Expired - Lifetime
- 2002-11-21 KR KR1020047008660A patent/KR100902339B1/ko not_active Expired - Lifetime
- 2002-11-21 DE DE60205664T patent/DE60205664T2/de not_active Expired - Lifetime
- 2002-11-21 AU AU2002352080A patent/AU2002352080A1/en not_active Abandoned
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Also Published As
| Publication number | Publication date |
|---|---|
| ATE302231T1 (de) | 2005-09-15 |
| CN1599770A (zh) | 2005-03-23 |
| KR100902339B1 (ko) | 2009-06-12 |
| EP1458794A1 (en) | 2004-09-22 |
| EP1458794B1 (en) | 2005-08-17 |
| DE60205664D1 (de) | 2005-09-22 |
| US20050032935A1 (en) | 2005-02-10 |
| BR0214724B1 (pt) | 2012-09-04 |
| CA2466611A1 (en) | 2003-06-12 |
| US7387812B2 (en) | 2008-06-17 |
| CN1267478C (zh) | 2006-08-02 |
| JP2005512117A (ja) | 2005-04-28 |
| BR0214724A (pt) | 2004-08-31 |
| KR20040068192A (ko) | 2004-07-30 |
| DE60205664T2 (de) | 2006-03-02 |
| CA2466611C (en) | 2011-09-27 |
| AU2002352080A1 (en) | 2003-06-17 |
| WO2003048235A1 (en) | 2003-06-12 |
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