BR0007214A - Dispositivo de fabricação de dissipador de calor e método de fabricação de dissipador de calor - Google Patents

Dispositivo de fabricação de dissipador de calor e método de fabricação de dissipador de calor

Info

Publication number
BR0007214A
BR0007214A BR0007214-1A BR0007214A BR0007214A BR 0007214 A BR0007214 A BR 0007214A BR 0007214 A BR0007214 A BR 0007214A BR 0007214 A BR0007214 A BR 0007214A
Authority
BR
Brazil
Prior art keywords
heatsink
heat
fins
fabrication
heat radiation
Prior art date
Application number
BR0007214-1A
Other languages
English (en)
Inventor
Yasuhiro Ootori
Chiyoshi Sasaki
Original Assignee
Sony Comp Entertaiment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Comp Entertaiment Inc filed Critical Sony Comp Entertaiment Inc
Publication of BR0007214A publication Critical patent/BR0007214A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/002—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20—Accessories: Details
    • B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

"DISPOSITIVO DE FABRICAçãO DE DISSIPADOR DE CALOR E MéTODO DE FABRICAçãO DE DISSIPADOR DE CALOR" que tem uma base e aletas de irradiação de calor de várias formas e tem a resistência prescrita, alta eficácia de radiação de calor e cuja base e aletas de irradiação de calor são formadas integralmente. Um dispositivo de fabricação de dissipador de calor, de acordo com a presente invenção, inclui uma máquina de fundição de matriz que tem a cavidade para uma base e aletas de irradiação de calor, e que inclui um molde fixo, um molde móvel que pode se mover na direção vertical ou para cima e para baixo, e um molde de deslizamento que pode se mover na direção horizontal.
BR0007214-1A 1999-09-10 2000-09-06 Dispositivo de fabricação de dissipador de calor e método de fabricação de dissipador de calor BR0007214A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25693499A JP3350900B2 (ja) 1999-09-10 1999-09-10 ヒートシンクの製造装置および製造方法
PCT/JP2000/006069 WO2001020657A1 (en) 1999-09-10 2000-09-06 Heat sink manufacturing device and manufacturing method

Publications (1)

Publication Number Publication Date
BR0007214A true BR0007214A (pt) 2001-07-31

Family

ID=17299409

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0007214-1A BR0007214A (pt) 1999-09-10 2000-09-06 Dispositivo de fabricação de dissipador de calor e método de fabricação de dissipador de calor

Country Status (11)

Country Link
US (2) US6516867B1 (pt)
EP (1) EP1133791A1 (pt)
JP (1) JP3350900B2 (pt)
KR (1) KR20010080979A (pt)
CN (1) CN1162898C (pt)
AU (1) AU6872800A (pt)
BR (1) BR0007214A (pt)
CA (1) CA2350199A1 (pt)
NZ (1) NZ511320A (pt)
TW (1) TW462902B (pt)
WO (1) WO2001020657A1 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040021769A (ko) * 2002-09-04 2004-03-11 (주)대영정공 히트싱크의 제조방법
US7114256B2 (en) * 2002-12-27 2006-10-03 Fu Zhun Precision Industrial (Shenzhen) Co., Ltd. Cooling device and apparatus and method for making the same
JP3904539B2 (ja) * 2003-07-18 2007-04-11 株式会社マカベアルミ ダイキャスト鋳物製造用のダイキャスト成形装置
JP4485835B2 (ja) * 2004-04-09 2010-06-23 古河スカイ株式会社 放熱器
CN101209490B (zh) 2006-12-29 2011-03-30 富准精密工业(深圳)有限公司 成型散热构件的压铸模具及用该压铸模具制造散热构件的方法
KR100879395B1 (ko) * 2007-08-01 2009-01-20 한국생산기술연구원 히트 싱크 발포 성형장치
EP2412215A1 (en) * 2009-03-25 2012-02-01 Hewlett-Packard Development Company, L.P. Grid heat sink
US8869876B2 (en) * 2009-03-31 2014-10-28 Denso International America, Inc. HVAC module interior wall insert
KR101419636B1 (ko) * 2010-06-07 2014-07-15 미쓰비시덴키 가부시키가이샤 히트 싱크 및 그 제조 방법
JP2013145834A (ja) * 2012-01-16 2013-07-25 Mitsubishi Electric Corp ヒートシンク
CN103495716A (zh) * 2013-10-10 2014-01-08 昆山纯柏精密五金有限公司 一种工业散热器加工方法
CN104930404A (zh) * 2015-06-12 2015-09-23 固态照明张家口有限公司 一种散热效果好的led洗墙灯
JP6521918B2 (ja) * 2016-08-24 2019-05-29 トヨタ自動車株式会社 ヒートシンクの製造方法
CN112074113A (zh) * 2020-08-17 2020-12-11 珠海格力电器股份有限公司 一种驱动器安装支架、驱动器及其电子设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1963102A1 (de) * 1968-12-26 1970-07-09 Nat Lead Co Verfahren zur Herstellung von komplizierten Spritzgussstuecken
US3575233A (en) * 1968-10-07 1971-04-20 Joachim Mahle Diecasting mold
US4824351A (en) * 1987-10-14 1989-04-25 Matrix Technologies, Incorporated Molding and gauging system
US5215140A (en) * 1990-11-05 1993-06-01 Mi Propruetart Method of making a heat sink
US5562146A (en) * 1995-02-24 1996-10-08 Wakefield Engineering, Inc. Method of and apparatus for forming a unitary heat sink body
JP3229543B2 (ja) * 1996-03-29 2001-11-19 三菱電機株式会社 車両用交流発電機のブラケットの鋳造型
US6085830A (en) * 1997-03-24 2000-07-11 Fujikura Ltd. Heat sink, and process and apparatus for manufacturing the same
JP2000263210A (ja) * 1999-03-12 2000-09-26 Makabe Aluminum:Kk 着脱可能なブロックを使用した鋳造金型および着脱可能なブロックを使用した鋳造方法
US6257314B1 (en) * 1999-05-27 2001-07-10 Chaun-Choung Industrial Corp. Radiator shaping device

Also Published As

Publication number Publication date
JP3350900B2 (ja) 2002-11-25
KR20010080979A (ko) 2001-08-25
CN1321335A (zh) 2001-11-07
JP2001085579A (ja) 2001-03-30
CA2350199A1 (en) 2001-03-22
CN1162898C (zh) 2004-08-18
WO2001020657A1 (en) 2001-03-22
EP1133791A1 (en) 2001-09-19
TW462902B (en) 2001-11-11
AU6872800A (en) 2001-04-17
US20020050333A1 (en) 2002-05-02
NZ511320A (en) 2002-12-20
US6516867B1 (en) 2003-02-11

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired