BE842673A - Compositions durcissables a base d'un silicone et d'un compose epoxy - Google Patents

Compositions durcissables a base d'un silicone et d'un compose epoxy

Info

Publication number
BE842673A
BE842673A BE167691A BE167691A BE842673A BE 842673 A BE842673 A BE 842673A BE 167691 A BE167691 A BE 167691A BE 167691 A BE167691 A BE 167691A BE 842673 A BE842673 A BE 842673A
Authority
BE
Belgium
Prior art keywords
silicone
epoxy compound
compositions based
curing compositions
curing
Prior art date
Application number
BE167691A
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE842673A publication Critical patent/BE842673A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
BE167691A 1976-02-23 1976-06-08 Compositions durcissables a base d'un silicone et d'un compose epoxy BE842673A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/660,572 US4082719A (en) 1976-02-23 1976-02-23 Silicone epoxy curable compositions

Publications (1)

Publication Number Publication Date
BE842673A true BE842673A (fr) 1976-12-08

Family

ID=24650073

Family Applications (1)

Application Number Title Priority Date Filing Date
BE167691A BE842673A (fr) 1976-02-23 1976-06-08 Compositions durcissables a base d'un silicone et d'un compose epoxy

Country Status (14)

Country Link
US (1) US4082719A (pt)
JP (1) JPS52107049A (pt)
AU (1) AU499421B2 (pt)
BE (1) BE842673A (pt)
BR (1) BR7608786A (pt)
CA (1) CA1051586A (pt)
CH (1) CH628915A5 (pt)
DE (1) DE2615689C3 (pt)
FR (1) FR2343025A1 (pt)
GB (1) GB1538619A (pt)
IT (1) IT1059211B (pt)
MX (1) MX143291A (pt)
NL (1) NL160582C (pt)
SE (1) SE7603729L (pt)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52147657A (en) * 1976-06-02 1977-12-08 Toray Silicone Co Ltd Curable organopolysiloxane compositions
US4125510A (en) * 1977-03-01 1978-11-14 Dow Corning Corporation Method of improving crack resistance of siloxane molding compositions
JPS53111336A (en) * 1977-03-11 1978-09-28 Toray Ind Inc Coating composition
US4202811A (en) * 1978-06-21 1980-05-13 Dow Corning Corporation Siloxane-epoxy molding compound with improved crack resistance
JPS55145725A (en) * 1979-05-04 1980-11-13 Toshiba Corp Heat-resistant resin composition
JPS5817537B2 (ja) * 1979-06-25 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
JPS5817536B2 (ja) * 1979-06-21 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
US4335367A (en) * 1979-08-17 1982-06-15 Tokyo Shibaura Denki Kabushiki Kaisha Electrically insulated coil
JPS5681906A (en) * 1979-12-07 1981-07-04 Toshiba Corp Heat resisting electrical insulated coil
US4283513A (en) * 1980-03-03 1981-08-11 Toray Silicone Company, Ltd. Siloxane-modified epoxy resin composition
US4287326A (en) * 1980-03-03 1981-09-01 Toray Silicone Company, Ltd. Siloxane-modified epoxy resin compositions
JPS6056171B2 (ja) * 1980-03-17 1985-12-09 信越化学工業株式会社 エポキシ樹脂組成物
DE3010995A1 (de) * 1980-03-21 1981-10-01 Toray Silicone Co., Ltd., Tokyo Siloxanmodifizierte epoxyharzmasse
DE3010994A1 (de) * 1980-03-21 1981-10-01 Toray Silicone Co., Ltd., Tokyo Siloxanmodifizierte epoxyharzmasse
JPS588701B2 (ja) * 1980-04-03 1983-02-17 株式会社東芝 エポキシ系樹脂組成物
JPS5718754A (en) * 1980-07-08 1982-01-30 Shin Etsu Chem Co Ltd Epoxy-silicone resin composition
JPS5734150A (en) * 1980-08-08 1982-02-24 Toray Silicone Co Ltd Organopolysiloxane resin composition
US4332923A (en) * 1980-10-23 1982-06-01 Dow Corning Corporation Composition for coating heat sensitive substrates
JPS57501730A (pt) * 1980-11-10 1982-09-24
US4518631A (en) * 1983-11-14 1985-05-21 Dow Corning Corporation Thixotropic curable coating compositions
USRE32958E (en) * 1983-11-28 1989-06-20 Toray Silicone Co., Ltd. Thermosetting epoxy resin compositions
JPS60115619A (ja) * 1983-11-28 1985-06-22 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JPS60166327A (ja) * 1984-02-09 1985-08-29 Toshiba Silicone Co Ltd 新規な共重合体の製造方法
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JP2791438B2 (ja) * 1988-09-09 1998-08-27 関西ペイント株式会社 樹脂組成物及びその硬化方法
JPH0368478A (ja) * 1989-08-07 1991-03-25 Kansai Paint Co Ltd 塗膜形成法
US5102960A (en) * 1989-09-11 1992-04-07 Bayer Aktiengesellschaft Silicon-epoxy resin composition
US5057550A (en) * 1989-12-04 1991-10-15 Dow Corning Corporation Epoxy-silanol functional uv curable polymers
US5292827A (en) * 1993-02-25 1994-03-08 General Electric Company Epoxy-capped branched silicones and copolymers thereof
TW343218B (en) * 1994-03-25 1998-10-21 Shinetsu Chem Ind Co Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same
JP3011617B2 (ja) * 1994-08-11 2000-02-21 信越化学工業株式会社 シリコーン−エポキシ樹脂組成物
KR970053283A (ko) * 1995-12-26 1997-07-31 윌리엄 이. 힐러 반도체 패키지 윤곽 측정용 측정 유니트
US5866261A (en) * 1996-12-20 1999-02-02 Rhodia Inc. Release composition
JP4803339B2 (ja) * 2003-11-20 2011-10-26 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP4300418B2 (ja) * 2004-04-30 2009-07-22 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
US20060270808A1 (en) * 2005-05-24 2006-11-30 Shin-Etsu Chemical Co., Ltd. Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device
JP4844732B2 (ja) * 2005-05-24 2011-12-28 信越化学工業株式会社 発光半導体装置
US7588967B2 (en) * 2005-05-27 2009-09-15 Shin-Etsu Chemical Co., Ltd. Curable silicone rubber composition and semiconductor device
US8524841B2 (en) * 2006-09-29 2013-09-03 Nippon Shokubai Co., Ltd. Curable resin composition, optical material, and method for controlling optical material
JP5480469B2 (ja) * 2006-10-31 2014-04-23 株式会社日本触媒 樹脂組成物、光学材料、及び、該光学材料の制御方法
JP5170765B2 (ja) * 2008-09-22 2013-03-27 日東電工株式会社 熱硬化性組成物及び光半導体装置
JP5305452B2 (ja) 2009-06-12 2013-10-02 信越化学工業株式会社 光半導体素子封止用樹脂組成物
TWI408174B (zh) * 2010-02-09 2013-09-11 Nanya Plastics Corp 應用在光學封裝及塗佈之環氧矽氧烷樹脂組成物
JP5489280B2 (ja) 2010-04-07 2014-05-14 信越化学工業株式会社 光半導体封止用エポキシ組成物
CN102234426B (zh) * 2010-05-05 2013-10-30 南亚塑胶工业股份有限公司 用于光学镜片与光学封装的树脂组合物
WO2014113323A1 (en) * 2013-01-15 2014-07-24 Basf Se A method of encapsulating an electronic component
JP2016526069A (ja) 2013-05-17 2016-09-01 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 硬化性組成物、硬化された物品の調製方法、及び該方法により形成された硬化物品
EP3460959A1 (de) * 2017-09-20 2019-03-27 Siemens Aktiengesellschaft Elektrisches isolationsmaterial und/oder imprägnierharz für die wickelbandisolierung einer mittel- und/oder hochspannungsmaschine sowie ein isolationssystem daraus
CN115449228B (zh) * 2022-09-28 2023-11-10 汇涌进光电(浙江)有限公司 耐高温高湿及光老化的光电封装材料及其制备方法、应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3070559A (en) * 1958-09-12 1962-12-25 Wacker Chemie Gmbh Silicone rubber stocks
US3131161A (en) * 1960-02-25 1964-04-28 Wacker Chemie Gmbh Silicone rubber containing an epoxide compound
US3842141A (en) * 1972-02-22 1974-10-15 Dexter Corp Silicone-epoxy copolymers and molding powders obtained therefrom

Also Published As

Publication number Publication date
DE2615689C3 (de) 1978-08-31
FR2343025B1 (pt) 1978-08-25
NL160582B (nl) 1979-06-15
FR2343025A1 (fr) 1977-09-30
JPS5329720B2 (pt) 1978-08-22
JPS52107049A (en) 1977-09-08
DE2615689A1 (de) 1977-08-25
IT1059211B (it) 1982-05-31
MX143291A (es) 1981-04-13
NL7603853A (nl) 1977-08-25
AU1252876A (en) 1977-10-20
GB1538619A (en) 1979-01-24
SE7603729L (sv) 1977-08-24
DE2615689B2 (de) 1978-01-05
AU499421B2 (en) 1979-04-12
NL160582C (nl) 1979-11-15
BR7608786A (pt) 1977-10-25
CH628915A5 (de) 1982-03-31
US4082719A (en) 1978-04-04
CA1051586A (en) 1979-03-27

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: DOW CORNING CORP.

Effective date: 19860630