AU600785B2 - A method of making memory cards, and cards obtained by implementing said method - Google Patents

A method of making memory cards, and cards obtained by implementing said method Download PDF

Info

Publication number
AU600785B2
AU600785B2 AU10160/88A AU1016088A AU600785B2 AU 600785 B2 AU600785 B2 AU 600785B2 AU 10160/88 A AU10160/88 A AU 10160/88A AU 1016088 A AU1016088 A AU 1016088A AU 600785 B2 AU600785 B2 AU 600785B2
Authority
AU
Australia
Prior art keywords
card
module
mold
memory card
card body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU10160/88A
Other languages
English (en)
Other versions
AU1016088A (en
Inventor
Marc Brignet
Emile Droche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCHLUMBERGER INDUSTRIES
Original Assignee
Schlumberger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9346968&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU600785(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schlumberger SA filed Critical Schlumberger SA
Publication of AU1016088A publication Critical patent/AU1016088A/en
Application granted granted Critical
Publication of AU600785B2 publication Critical patent/AU600785B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H10W74/016—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Holo Graphy (AREA)
  • Electrically Operated Instructional Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Packaging For Recording Disks (AREA)
  • External Artificial Organs (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Non-Volatile Memory (AREA)
  • Collating Specific Patterns (AREA)
  • Compression, Expansion, Code Conversion, And Decoders (AREA)
AU10160/88A 1987-01-16 1988-01-11 A method of making memory cards, and cards obtained by implementing said method Ceased AU600785B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8700446 1987-01-16
FR8700446A FR2609821B1 (fr) 1987-01-16 1987-01-16 Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede

Publications (2)

Publication Number Publication Date
AU1016088A AU1016088A (en) 1988-07-21
AU600785B2 true AU600785B2 (en) 1990-08-23

Family

ID=9346968

Family Applications (1)

Application Number Title Priority Date Filing Date
AU10160/88A Ceased AU600785B2 (en) 1987-01-16 1988-01-11 A method of making memory cards, and cards obtained by implementing said method

Country Status (18)

Country Link
EP (1) EP0277854B1 (cg-RX-API-DMAC10.html)
JP (1) JPS63239097A (cg-RX-API-DMAC10.html)
KR (1) KR880009317A (cg-RX-API-DMAC10.html)
AT (1) ATE74456T1 (cg-RX-API-DMAC10.html)
AU (1) AU600785B2 (cg-RX-API-DMAC10.html)
BR (1) BR8800135A (cg-RX-API-DMAC10.html)
CA (1) CA1306058C (cg-RX-API-DMAC10.html)
DE (1) DE3869635D1 (cg-RX-API-DMAC10.html)
DK (1) DK16988A (cg-RX-API-DMAC10.html)
ES (1) ES2031248T3 (cg-RX-API-DMAC10.html)
FI (1) FI93156C (cg-RX-API-DMAC10.html)
FR (1) FR2609821B1 (cg-RX-API-DMAC10.html)
GR (1) GR3004900T3 (cg-RX-API-DMAC10.html)
IN (1) IN170183B (cg-RX-API-DMAC10.html)
NO (1) NO178089C (cg-RX-API-DMAC10.html)
NZ (1) NZ223192A (cg-RX-API-DMAC10.html)
PT (1) PT86557A (cg-RX-API-DMAC10.html)
ZA (1) ZA88279B (cg-RX-API-DMAC10.html)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825349B2 (ja) * 1987-10-22 1996-03-13 日本ユーロテック株式会社 カードの製造法
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
FR2636755B1 (fr) * 1988-09-16 1992-05-22 Schlumberger Ind Sa Procede de realisation de cartes a memoire et cartes obtenues par ledit procede
US5030407A (en) * 1988-04-28 1991-07-09 Schlumberger Industries Method of making cards having graphics elements thereon
EP0361194A3 (de) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen
JP2559834B2 (ja) * 1989-01-12 1996-12-04 三菱電機株式会社 Ｉｃカード
JPH0687484B2 (ja) * 1989-04-06 1994-11-02 三菱電機株式会社 Ｉｃカード用モジュール
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
FR2647571B1 (fr) * 1989-05-26 1994-07-22 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
FR2666687A1 (fr) * 1990-09-06 1992-03-13 Sgs Thomson Microelectronics Circuit integre a boitier moule comprenant un dissipateur thermique et procede de fabrication.
IT1243817B (it) * 1990-10-09 1994-06-28 Sgs Thomson Microelectronics Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato
DE4038126C2 (de) * 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
FI913357L (fi) * 1991-07-10 1993-01-11 Valtion Teknillinen Foerfarande och form foer framstaellning av en straengsprutad elektronikmodul
US5286426A (en) * 1992-04-01 1994-02-15 Allegro Microsystems, Inc. Assembling a lead frame between a pair of molding cavity plates
DE4401588C2 (de) * 1994-01-20 2003-02-20 Gemplus Gmbh Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul
DE4403513A1 (de) * 1994-02-04 1995-08-10 Giesecke & Devrient Gmbh Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte
JPH0890600A (ja) * 1994-09-22 1996-04-09 Rhythm Watch Co Ltd Ｉｃカード製造金型
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
JP3409943B2 (ja) * 1995-05-25 2003-05-26 昭和電工株式会社 輸液容器用口栓体及びその製法
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
DE19625228C2 (de) 1996-06-24 1998-05-14 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
EP0890928A3 (en) * 1997-07-10 2001-06-13 Sarnoff Corporation Transmission apparatus and remotely identifying an electronically coded article
EP0938060A1 (de) * 1998-02-20 1999-08-25 ESEC Management SA Verfahren zur Herstellung eines Chipobjektes und Chipobjekt
EP1118111A1 (de) * 1998-09-29 2001-07-25 Tyco Electronics Logistics AG Verfahren zum eingiessen eines flachen elektronikmoduls in einen kunststoffkartenkörper durch thermoplastisches spritzgiessen
FR2895547B1 (fr) * 2005-12-26 2008-06-06 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit
EP1923821B1 (en) 2006-11-17 2012-03-28 Oberthur Technologies Method of fabricating an entity and corresponding device
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
WO2018022755A1 (en) * 2016-07-27 2018-02-01 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
WO2019051191A1 (en) 2017-09-07 2019-03-14 Composecure, Llc TRANSACTION CARD WITH INTEGRATED ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
FI4109337T3 (fi) 2017-10-18 2024-11-29 Composecure Llc Metallinen, keraaminen tai keraamisesti pinnoitettu maksukortti, jossa on ikkuna tai ikkunakuvio ja taustavalaistus
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
CN116852632A (zh) * 2023-07-04 2023-10-10 中国银行股份有限公司 卡片制作装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2081974A (en) * 1980-08-05 1982-02-24 Gao Ges Automation Org Carrier element for an ic module
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6086850A (ja) * 1983-10-18 1985-05-16 Dainippon Printing Co Ltd Ｉｃカ−ド
JPS60146383A (ja) * 1984-01-10 1985-08-02 Dainippon Printing Co Ltd Ｉｃカ−ド
JPS61222712A (ja) * 1985-03-28 1986-10-03 Mitsubishi Electric Corp 樹脂封止成形体の製造方法
JPS6232094A (ja) * 1985-08-05 1987-02-12 カシオ計算機株式会社 Ｉｃカ−ド

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2081974A (en) * 1980-08-05 1982-02-24 Gao Ges Automation Org Carrier element for an ic module
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede

Also Published As

Publication number Publication date
FI880152A0 (fi) 1988-01-14
NO178089C (no) 1996-01-17
FI880152L (fi) 1988-07-17
DK16988D0 (da) 1988-01-14
ATE74456T1 (de) 1992-04-15
NO178089B (no) 1995-10-09
EP0277854B1 (fr) 1992-04-01
NO880166L (no) 1988-07-18
IN170183B (cg-RX-API-DMAC10.html) 1992-02-22
FR2609821B1 (fr) 1989-03-31
JPS63239097A (ja) 1988-10-05
NZ223192A (en) 1989-09-27
NO880166D0 (no) 1988-01-15
PT86557A (pt) 1989-01-30
ZA88279B (en) 1988-07-01
FI93156B (fi) 1994-11-15
KR880009317A (ko) 1988-09-14
DK16988A (da) 1988-07-17
BR8800135A (pt) 1988-08-23
GR3004900T3 (cg-RX-API-DMAC10.html) 1993-04-28
DE3869635D1 (de) 1992-05-07
EP0277854A1 (fr) 1988-08-10
ES2031248T3 (es) 1992-12-01
FR2609821A1 (fr) 1988-07-22
AU1016088A (en) 1988-07-21
FI93156C (fi) 1995-02-27
CA1306058C (en) 1992-08-04

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Legal Events

Date Code Title Description
MK14 Patent ceased section 143(a) (annual fees not paid) or expired