AU546818B2 - Method of forming a wire bond - Google Patents

Method of forming a wire bond

Info

Publication number
AU546818B2
AU546818B2 AU76893/81A AU7689381A AU546818B2 AU 546818 B2 AU546818 B2 AU 546818B2 AU 76893/81 A AU76893/81 A AU 76893/81A AU 7689381 A AU7689381 A AU 7689381A AU 546818 B2 AU546818 B2 AU 546818B2
Authority
AU
Australia
Prior art keywords
forming
wire bond
bond
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU76893/81A
Other languages
English (en)
Other versions
AU7689381A (en
Inventor
Johannes B.P. Janssen
Wilhelmus J.J. Lorenz
Hermanus A. Van De Pas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of AU7689381A publication Critical patent/AU7689381A/en
Application granted granted Critical
Publication of AU546818B2 publication Critical patent/AU546818B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

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    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
AU76893/81A 1980-10-29 1981-10-28 Method of forming a wire bond Ceased AU546818B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8005922A NL8005922A (nl) 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding.
NL8005922 1980-10-29

Publications (2)

Publication Number Publication Date
AU7689381A AU7689381A (en) 1982-05-06
AU546818B2 true AU546818B2 (en) 1985-09-19

Family

ID=19836074

Family Applications (1)

Application Number Title Priority Date Filing Date
AU76893/81A Ceased AU546818B2 (en) 1980-10-29 1981-10-28 Method of forming a wire bond

Country Status (18)

Country Link
JP (1) JPS5916409B2 (pt)
KR (1) KR890000585B1 (pt)
AU (1) AU546818B2 (pt)
BE (1) BE890887A (pt)
BR (1) BR8106902A (pt)
CA (1) CA1178664A (pt)
CH (1) CH654142A5 (pt)
DD (1) DD205294A5 (pt)
DE (1) DE3141842A1 (pt)
ES (1) ES506580A0 (pt)
FR (1) FR2493044B1 (pt)
GB (1) GB2086297B (pt)
HK (1) HK40885A (pt)
IT (1) IT1139570B (pt)
MY (1) MY8500623A (pt)
NL (1) NL8005922A (pt)
PL (1) PL133893B1 (pt)
SG (1) SG21984G (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4476366A (en) * 1983-02-01 1984-10-09 Fairchild Camera & Instrument Corp. Controlled bonding wire ball formation
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US5628922A (en) * 1995-07-14 1997-05-13 Motorola, Inc. Electrical flame-off wand
DE29608277U1 (de) * 1996-04-30 1996-09-19 F&K Delvotec Bondtechnik GmbH, 85521 Ottobrunn Vorrichtung zum Ball-Bonden
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
TWI229022B (en) * 2002-06-20 2005-03-11 Esec Trading Sa Device with electrodes for the formation of a ball at the end of a wire
CN104335338B (zh) * 2012-10-05 2017-09-26 株式会社新川 氧化防止气体吹出单元

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH568656A5 (en) * 1974-03-20 1975-10-31 Transistor Ag Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
NL7406783A (nl) * 1974-05-21 1975-11-25 Philips Nv Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1468974A (en) * 1975-05-23 1977-03-30 Ferranti Ltd Manufacture of semiconductor devices
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus

Also Published As

Publication number Publication date
BR8106902A (pt) 1982-07-13
ES8301390A1 (es) 1982-11-16
JPS57102036A (en) 1982-06-24
IT1139570B (it) 1986-09-24
IT8124731A0 (it) 1981-10-27
KR890000585B1 (ko) 1989-03-21
KR830008394A (ko) 1983-11-18
DD205294A5 (de) 1983-12-21
ES506580A0 (es) 1982-11-16
AU7689381A (en) 1982-05-06
CH654142A5 (de) 1986-01-31
SG21984G (en) 1985-01-04
GB2086297A (en) 1982-05-12
MY8500623A (en) 1985-12-31
PL233586A1 (pt) 1982-05-10
FR2493044A1 (fr) 1982-04-30
BE890887A (fr) 1982-04-27
JPS5916409B2 (ja) 1984-04-16
DE3141842C2 (pt) 1990-09-20
HK40885A (en) 1985-05-31
GB2086297B (en) 1983-12-21
FR2493044B1 (fr) 1986-03-28
DE3141842A1 (de) 1982-10-21
PL133893B1 (en) 1985-07-31
CA1178664A (en) 1984-11-27
NL8005922A (nl) 1982-05-17

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