AU2008272285B2 - Electrical equipment unit - Google Patents

Electrical equipment unit Download PDF

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Publication number
AU2008272285B2
AU2008272285B2 AU2008272285A AU2008272285A AU2008272285B2 AU 2008272285 B2 AU2008272285 B2 AU 2008272285B2 AU 2008272285 A AU2008272285 A AU 2008272285A AU 2008272285 A AU2008272285 A AU 2008272285A AU 2008272285 B2 AU2008272285 B2 AU 2008272285B2
Authority
AU
Australia
Prior art keywords
substrate
electrical equipment
equipment unit
electronic components
surface part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
AU2008272285A
Other languages
English (en)
Other versions
AU2008272285A1 (en
Inventor
Mitsuhiro Tanaka
Akio Yoshimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Publication of AU2008272285A1 publication Critical patent/AU2008272285A1/en
Application granted granted Critical
Publication of AU2008272285B2 publication Critical patent/AU2008272285B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AU2008272285A 2007-06-29 2008-05-29 Electrical equipment unit Active AU2008272285B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007172473 2007-06-29
JP2007-172473 2007-06-29
JP2008-104949 2008-04-14
JP2008104949A JP5098772B2 (ja) 2007-06-29 2008-04-14 電装品ユニット
PCT/JP2008/059899 WO2009004875A1 (ja) 2007-06-29 2008-05-29 電装品ユニット

Publications (2)

Publication Number Publication Date
AU2008272285A1 AU2008272285A1 (en) 2009-01-08
AU2008272285B2 true AU2008272285B2 (en) 2011-05-19

Family

ID=40225931

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2008272285A Active AU2008272285B2 (en) 2007-06-29 2008-05-29 Electrical equipment unit

Country Status (7)

Country Link
US (1) US8107242B2 (zh)
EP (1) EP2164312B1 (zh)
JP (1) JP5098772B2 (zh)
KR (1) KR101065543B1 (zh)
CN (1) CN101690438B (zh)
AU (1) AU2008272285B2 (zh)
WO (1) WO2009004875A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM378573U (en) * 2009-09-15 2010-04-11 Microelectronics Tech Inc Low noise block converter
KR101395358B1 (ko) * 2011-09-02 2014-05-14 주식회사 팬택 방수시트가 설치되는 이동통신 단말기 및 그 제조방법
DE102011089474A1 (de) * 2011-12-21 2013-06-27 Robert Bosch Gmbh Elektronikmodul für ein Fahrzeug
JP2015018971A (ja) * 2013-07-11 2015-01-29 富士通株式会社 放熱板、及び海中機器
DE102013215149A1 (de) * 2013-08-01 2015-02-19 Conti Temic Microelectronic Gmbh Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät
KR101518965B1 (ko) * 2014-05-15 2015-05-11 (주)엑스엠더블유 방열 특성을 향상시킨 소형화된 주파수 상향 변환기
JP6312527B2 (ja) * 2014-05-23 2018-04-18 新日本無線株式会社 放熱板を備えた電子部品の実装構造
DE102015207310A1 (de) * 2015-04-22 2016-10-27 Zf Friedrichshafen Ag Elektronikmodul und Verfahren zum Umkapseln desselben
EP3232751B1 (de) * 2016-04-12 2018-07-18 MD Elektronik GmbH Elektrische steckkupplungsvorrichtung
JP2019102485A (ja) * 2017-11-28 2019-06-24 株式会社村田製作所 電子装置
JP7134819B2 (ja) * 2018-10-03 2022-09-12 川崎重工業株式会社 制御装置
JP6880128B2 (ja) * 2019-09-04 2021-06-02 三菱電機株式会社 電子機器ユニット
JP6930617B2 (ja) * 2020-02-10 2021-09-01 ダイキン工業株式会社 電装品、および電装品の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321472A (ja) * 1994-05-30 1995-12-08 Inax Corp 便器用コントロールボックス
JPH0918176A (ja) * 1995-06-29 1997-01-17 Toyota Autom Loom Works Ltd 回路基板内蔵筐体
JP2004111502A (ja) * 2002-09-17 2004-04-08 Matsushita Electric Ind Co Ltd 外装部品および携帯型電子機器
JP2004111435A (ja) * 2002-09-13 2004-04-08 Hitachi Ltd コネクタと電子部品の一体モールド構造を有する電気・電子モジュールとその成形方法
JP2006190726A (ja) * 2005-01-04 2006-07-20 Hitachi Ltd 電子制御装置及びその製造方法
JP2007184507A (ja) * 2006-01-10 2007-07-19 Furukawa Electric Co Ltd:The 回路モジュール及びその製造方法並びに電気接続箱

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6380597A (ja) * 1986-09-25 1988-04-11 古河電気工業株式会社 回路付き射出成形体の製造方法
JPH04326797A (ja) * 1991-04-26 1992-11-16 Mitsubishi Electric Corp プリント配線板の一体成形法
JPH053390A (ja) * 1991-06-24 1993-01-08 Mitsubishi Electric Corp 電子機器およびその製造方法
JP3142398B2 (ja) * 1992-11-06 2001-03-07 三菱電機株式会社 携帯用半導体装置及びその製造方法
GB2297654B (en) * 1995-02-03 1998-09-09 Cliff Electron Components Ltd A circuit board assembly and a method of manufacturing such an assembly
JPH10242664A (ja) * 1997-03-03 1998-09-11 Murata Mfg Co Ltd 防水ケース
DE19838266A1 (de) * 1998-08-22 2000-02-24 Mannesmann Vdo Ag Einrichtung und Verfahren zum Vergießen elektrischer Schaltungen mittels Spritzguß
DE19910500A1 (de) * 1999-03-10 2000-10-05 Bosch Gmbh Robert Elektrisches Gerät
JP2001211529A (ja) * 2000-01-20 2001-08-03 Auto Network Gijutsu Kenkyusho:Kk 電気接続箱
US6958535B2 (en) * 2000-09-22 2005-10-25 Matsushita Electric Industrial Co., Ltd. Thermal conductive substrate and semiconductor module using the same
JP4801274B2 (ja) * 2001-03-29 2011-10-26 本田技研工業株式会社 圧力センサを内蔵した制御箱
JP2002374075A (ja) * 2001-06-13 2002-12-26 Fujitsu Ten Ltd 配線接続方法及び配線接続構造
FR2839417B1 (fr) * 2002-05-03 2004-07-16 Dav Dispositif de commutation de puissance refroidi
JP3864873B2 (ja) * 2002-08-09 2007-01-10 株式会社デンソー 電子制御装置
JPWO2005004563A1 (ja) * 2003-07-03 2006-08-24 株式会社日立製作所 モジュール装置及びその製造方法
JP4029822B2 (ja) * 2003-10-27 2008-01-09 三菱電機株式会社 電子回路装置
JP4428199B2 (ja) * 2004-01-14 2010-03-10 株式会社デンソー 電子制御装置
US7448909B2 (en) * 2004-02-13 2008-11-11 Molex Incorporated Preferential via exit structures with triad configuration for printed circuit boards
JP2006032490A (ja) * 2004-07-13 2006-02-02 Hitachi Ltd エンジン制御回路装置
JP4404726B2 (ja) * 2004-08-31 2010-01-27 三菱電機株式会社 車載用電力変換装置
JP4585828B2 (ja) * 2004-10-06 2010-11-24 日立オートモティブシステムズ株式会社 制御装置およびその製造方法
ES2655254T3 (es) * 2006-01-16 2018-02-19 Mitsubishi Electric Corporation Circuito de control de motor y unidad exterior de aparato de aire acondicionado
CN1873973B (zh) * 2006-06-19 2011-08-17 达进精电能源管理(深圳)有限公司 一种大功率半导体发光元件的封装

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321472A (ja) * 1994-05-30 1995-12-08 Inax Corp 便器用コントロールボックス
JPH0918176A (ja) * 1995-06-29 1997-01-17 Toyota Autom Loom Works Ltd 回路基板内蔵筐体
JP2004111435A (ja) * 2002-09-13 2004-04-08 Hitachi Ltd コネクタと電子部品の一体モールド構造を有する電気・電子モジュールとその成形方法
JP2004111502A (ja) * 2002-09-17 2004-04-08 Matsushita Electric Ind Co Ltd 外装部品および携帯型電子機器
JP2006190726A (ja) * 2005-01-04 2006-07-20 Hitachi Ltd 電子制御装置及びその製造方法
JP2007184507A (ja) * 2006-01-10 2007-07-19 Furukawa Electric Co Ltd:The 回路モジュール及びその製造方法並びに電気接続箱

Also Published As

Publication number Publication date
AU2008272285A1 (en) 2009-01-08
CN101690438B (zh) 2012-06-20
WO2009004875A1 (ja) 2009-01-08
US8107242B2 (en) 2012-01-31
KR101065543B1 (ko) 2011-09-19
EP2164312A4 (en) 2016-11-30
EP2164312A1 (en) 2010-03-17
CN101690438A (zh) 2010-03-31
EP2164312B1 (en) 2021-02-24
JP2009033104A (ja) 2009-02-12
KR20090130875A (ko) 2009-12-24
US20100177483A1 (en) 2010-07-15
JP5098772B2 (ja) 2012-12-12

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DA3 Amendments made section 104

Free format text: THE NATURE OF THE AMENDMENT IS: AMEND THE INVENTION TITLE TO READ ELECTRICAL EQUIPMENT UNIT

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