AU2003295783A1 - Semiconductor device having clips for connecting to external elements - Google Patents

Semiconductor device having clips for connecting to external elements

Info

Publication number
AU2003295783A1
AU2003295783A1 AU2003295783A AU2003295783A AU2003295783A1 AU 2003295783 A1 AU2003295783 A1 AU 2003295783A1 AU 2003295783 A AU2003295783 A AU 2003295783A AU 2003295783 A AU2003295783 A AU 2003295783A AU 2003295783 A1 AU2003295783 A1 AU 2003295783A1
Authority
AU
Australia
Prior art keywords
clips
semiconductor device
external elements
external
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003295783A
Other languages
English (en)
Inventor
Martin Standing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of AU2003295783A1 publication Critical patent/AU2003295783A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07637—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/881—Bump connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL
AU2003295783A 2002-11-22 2003-11-21 Semiconductor device having clips for connecting to external elements Abandoned AU2003295783A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/303,523 US6841865B2 (en) 2002-11-22 2002-11-22 Semiconductor device having clips for connecting to external elements
US10/303,523 2002-11-22
PCT/US2003/037314 WO2004049435A1 (en) 2002-11-22 2003-11-21 Semiconductor device having clips for connecting to external elements

Publications (1)

Publication Number Publication Date
AU2003295783A1 true AU2003295783A1 (en) 2004-06-18

Family

ID=32325025

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003295783A Abandoned AU2003295783A1 (en) 2002-11-22 2003-11-21 Semiconductor device having clips for connecting to external elements

Country Status (7)

Country Link
US (1) US6841865B2 (enExample)
JP (1) JP4327096B2 (enExample)
CN (1) CN100421240C (enExample)
AU (1) AU2003295783A1 (enExample)
DE (1) DE10393769B4 (enExample)
TW (1) TWI228317B (enExample)
WO (1) WO2004049435A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6930397B2 (en) * 2001-03-28 2005-08-16 International Rectifier Corporation Surface mounted package with die bottom spaced from support board
WO2004077548A2 (de) * 2003-02-28 2004-09-10 Siemens Aktiengesellschaft Verbindungstechnik für leistungshalbleiter
US7692316B2 (en) 2004-10-01 2010-04-06 International Rectifier Corporation Audio amplifier assembly
US20060145319A1 (en) * 2004-12-31 2006-07-06 Ming Sun Flip chip contact (FCC) power package
US7755179B2 (en) * 2004-12-20 2010-07-13 Semiconductor Components Industries, Llc Semiconductor package structure having enhanced thermal dissipation characteristics
JP4917296B2 (ja) * 2005-10-28 2012-04-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2009514242A (ja) * 2005-11-01 2009-04-02 エヌエックスピー ビー ヴィ 半導体ダイの実装方法および半導体パッケージ
DE102005061015B4 (de) * 2005-12-19 2008-03-13 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiterbauteils mit einem vertikalen Halbleiterbauelement
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
US7663212B2 (en) * 2006-03-21 2010-02-16 Infineon Technologies Ag Electronic component having exposed surfaces
US7733659B2 (en) * 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
DE102007009521B4 (de) * 2007-02-27 2011-12-15 Infineon Technologies Ag Bauteil und Verfahren zu dessen Herstellung
US8222078B2 (en) * 2009-07-22 2012-07-17 Alpha And Omega Semiconductor Incorporated Chip scale surface mounted semiconductor device package and process of manufacture
CN201629397U (zh) * 2009-11-30 2010-11-10 鸿富锦精密工业（深圳）有限公司 集成电路组合
US20120175688A1 (en) * 2011-01-10 2012-07-12 International Rectifier Corporation Semiconductor Package with Reduced On-Resistance and Top Metal Spreading Resistance with Application to Power Transistor Packaging
US9536800B2 (en) 2013-12-07 2017-01-03 Fairchild Semiconductor Corporation Packaged semiconductor devices and methods of manufacturing
US10064287B2 (en) 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
US10553557B2 (en) * 2014-11-05 2020-02-04 Infineon Technologies Austria Ag Electronic component, system and method
US10192846B2 (en) 2014-11-05 2019-01-29 Infineon Technologies Austria Ag Method of inserting an electronic component into a slot in a circuit board
CN109979825A (zh) * 2017-12-15 2019-07-05 胡志良 阵列批次式封装元件晶粒的电路元件制作方法
DE102023135840A1 (de) * 2023-12-19 2025-06-26 Infineon Technologies Ag Halbleiterbauelement mit einem träger, einem halbleiterdie und einem c-förmigen clip, der zwischen ihnen verbunden ist

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403438A (en) * 1964-12-02 1968-10-01 Corning Glass Works Process for joining transistor chip to printed circuit
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
US3972062A (en) * 1973-10-04 1976-07-27 Motorola, Inc. Mounting assemblies for a plurality of transistor integrated circuit chips
GB1487945A (en) * 1974-11-20 1977-10-05 Ibm Semiconductor integrated circuit devices
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
JPS63281451A (ja) * 1987-05-13 1988-11-17 Hitachi Ltd 半導体装置
JPH01161707A (ja) * 1987-12-17 1989-06-26 Nec Corp チップ部品
JPH0357251A (ja) * 1989-07-26 1991-03-12 Hitachi Ltd 半導体装置
JPH04159704A (ja) * 1990-10-23 1992-06-02 Nec Corp 電気二重層コンデンサ
JP2984068B2 (ja) * 1991-01-31 1999-11-29 株式会社日立製作所 半導体装置の製造方法
JPH05129516A (ja) 1991-11-01 1993-05-25 Hitachi Ltd 半導体装置
US5311402A (en) * 1992-02-14 1994-05-10 Nec Corporation Semiconductor device package having locating mechanism for properly positioning semiconductor device within package
JP2833326B2 (ja) * 1992-03-03 1998-12-09 松下電器産業株式会社 電子部品実装接続体およびその製造方法
JPH0637143A (ja) * 1992-07-15 1994-02-10 Toshiba Corp 半導体装置および半導体装置の製造方法
US5394490A (en) * 1992-08-11 1995-02-28 Hitachi, Ltd. Semiconductor device having an optical waveguide interposed in the space between electrode members
US5313366A (en) * 1992-08-12 1994-05-17 International Business Machines Corporation Direct chip attach module (DCAM)
JPH06244231A (ja) * 1993-02-01 1994-09-02 Motorola Inc 気密半導体デバイスおよびその製造方法
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
JP2795788B2 (ja) * 1993-02-18 1998-09-10 シャープ株式会社 半導体チップの実装方法
US5703405A (en) * 1993-03-15 1997-12-30 Motorola, Inc. Integrated circuit chip formed from processing two opposing surfaces of a wafer
US5510758A (en) * 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
JP3258764B2 (ja) * 1993-06-01 2002-02-18 三菱電機株式会社 樹脂封止型半導体装置の製造方法ならびに外部引出用電極およびその製造方法
US5397921A (en) * 1993-09-03 1995-03-14 Advanced Semiconductor Assembly Technology Tab grid array
US5734201A (en) * 1993-11-09 1998-03-31 Motorola, Inc. Low profile semiconductor device with like-sized chip and mounting substrate
US5367435A (en) * 1993-11-16 1994-11-22 International Business Machines Corporation Electronic package structure and method of making same
US5454160A (en) * 1993-12-03 1995-10-03 Ncr Corporation Apparatus and method for stacking integrated circuit devices
JPH07193184A (ja) * 1993-12-27 1995-07-28 Fujitsu Ltd マルチチップモジュールの製造方法及びマルチチップモジュール
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
HU212428B (en) * 1994-05-13 1996-06-28 Egyt Gyogyszervegyeszeti Gyar Process to prepare pharmaceutical compositions containing gemfibrozyl
JP3377867B2 (ja) * 1994-08-12 2003-02-17 京セラ株式会社 半導体素子収納用パッケージ
JP2546192B2 (ja) * 1994-09-30 1996-10-23 日本電気株式会社 フィルムキャリア半導体装置
US5532512A (en) * 1994-10-03 1996-07-02 General Electric Company Direct stacked and flip chip power semiconductor device structures
JP3138159B2 (ja) 1994-11-22 2001-02-26 シャープ株式会社 半導体装置、半導体装置実装体、及び半導体装置の交換方法
JPH08335653A (ja) * 1995-04-07 1996-12-17 Nitto Denko Corp 半導体装置およびその製法並びに上記半導体装置の製造に用いる半導体装置用テープキャリア
US5655703A (en) * 1995-05-25 1997-08-12 International Business Machines Corporation Solder hierarchy for chip attachment to substrates
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die
US5726502A (en) * 1996-04-26 1998-03-10 Motorola, Inc. Bumped semiconductor device with alignment features and method for making the same
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
US6423623B1 (en) * 1998-06-09 2002-07-23 Fairchild Semiconductor Corporation Low Resistance package for semiconductor devices
EP0966038A3 (en) * 1998-06-15 2001-02-28 Ford Motor Company Bonding of semiconductor power devices
US6133634A (en) * 1998-08-05 2000-10-17 Fairchild Semiconductor Corporation High performance flip chip package
JP2000077435A (ja) * 1998-08-31 2000-03-14 Hitachi Ltd 半導体装置及びその製造方法
JP3867881B2 (ja) * 1998-09-09 2007-01-17 新電元工業株式会社 半導体装置
KR20000057810A (ko) * 1999-01-28 2000-09-25 가나이 쓰토무 반도체 장치
JP4408475B2 (ja) * 1999-02-23 2010-02-03 三洋電機株式会社 ボンディングワイヤを採用しない半導体装置
JP3895884B2 (ja) * 1999-03-25 2007-03-22 三洋電機株式会社 半導体装置
US6624522B2 (en) * 2000-04-04 2003-09-23 International Rectifier Corporation Chip scale surface mounted device and process of manufacture
JP3639515B2 (ja) * 2000-09-04 2005-04-20 三洋電機株式会社 Ｍｏｓｆｅｔの実装構造の製造方法
US6391687B1 (en) * 2000-10-31 2002-05-21 Fairchild Semiconductor Corporation Column ball grid array package
US6717260B2 (en) * 2001-01-22 2004-04-06 International Rectifier Corporation Clip-type lead frame for source mounted die
US6711317B2 (en) * 2001-01-25 2004-03-23 Lucent Technologies Inc. Resiliently packaged MEMs device and method for making same
US6469398B1 (en) * 2001-03-29 2002-10-22 Kabushiki Kaisha Toshiba Semiconductor package and manufacturing method thereof
JP2003110077A (ja) * 2001-10-02 2003-04-11 Mitsubishi Electric Corp 半導体装置
US6781227B2 (en) * 2002-01-25 2004-08-24 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring

Also Published As

Publication number Publication date
JP2006507688A (ja) 2006-03-02
US20040099940A1 (en) 2004-05-27
TW200414533A (en) 2004-08-01
US6841865B2 (en) 2005-01-11
DE10393769T5 (de) 2006-02-09
CN100421240C (zh) 2008-09-24
WO2004049435A1 (en) 2004-06-10
DE10393769B4 (de) 2012-09-27
JP4327096B2 (ja) 2009-09-09
TWI228317B (en) 2005-02-21
CN1729568A (zh) 2006-02-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase