AU2003278824A1 - Method using silicide contacts for semiconductor processing - Google Patents

Method using silicide contacts for semiconductor processing

Info

Publication number
AU2003278824A1
AU2003278824A1 AU2003278824A AU2003278824A AU2003278824A1 AU 2003278824 A1 AU2003278824 A1 AU 2003278824A1 AU 2003278824 A AU2003278824 A AU 2003278824A AU 2003278824 A AU2003278824 A AU 2003278824A AU 2003278824 A1 AU2003278824 A1 AU 2003278824A1
Authority
AU
Australia
Prior art keywords
semiconductor processing
silicide contacts
silicide
contacts
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003278824A
Other languages
English (en)
Inventor
Paul R. Besser
David E. Brown
Simon S. Chan
Eric N. Paton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2003278824A1 publication Critical patent/AU2003278824A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50—Alloying conductive materials with semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
    • H10D64/0112—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors using conductive layers comprising silicides
AU2003278824A 2002-06-25 2003-06-04 Method using silicide contacts for semiconductor processing Abandoned AU2003278824A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/180,858 US6689688B2 (en) 2002-06-25 2002-06-25 Method and device using silicide contacts for semiconductor processing
US10/180,858 2002-06-25
PCT/US2003/017599 WO2004001826A1 (en) 2002-06-25 2003-06-04 Method using silicide contacts for semiconductor processing

Publications (1)

Publication Number Publication Date
AU2003278824A1 true AU2003278824A1 (en) 2004-01-06

Family

ID=29735101

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003278824A Abandoned AU2003278824A1 (en) 2002-06-25 2003-06-04 Method using silicide contacts for semiconductor processing

Country Status (8)

Country Link
US (1) US6689688B2 (https=)
EP (1) EP1522093A1 (https=)
JP (1) JP2006516174A (https=)
KR (1) KR20050009761A (https=)
CN (1) CN1663027B (https=)
AU (1) AU2003278824A1 (https=)
TW (1) TWI298521B (https=)
WO (1) WO2004001826A1 (https=)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003272444A1 (en) * 2002-09-30 2004-04-23 Advanced Micro Devices, Inc. Circuit element having a metal silicide region thermally stabilized by a barrier diffusion material
DE10245607B4 (de) 2002-09-30 2009-07-16 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Bilden von Schaltungselementen mit Nickelsilizidgebieten, die durch ein Barrierendiffusionsmaterial thermisch stabilisiert sind sowie Verfahren zur Herstellung einer Nickelmonosilizidschicht
JP3840198B2 (ja) * 2003-04-28 2006-11-01 株式会社東芝 半導体装置およびその製造方法
JP4349131B2 (ja) * 2004-01-09 2009-10-21 ソニー株式会社 バイポーラトランジスタの製造方法及び半導体装置の製造方法
US20050212015A1 (en) * 2004-03-25 2005-09-29 Taiwan Semiconductor Manufacturing Co., Ltd. Metal gate semiconductor device and manufacturing method
JP2005294360A (ja) * 2004-03-31 2005-10-20 Nec Electronics Corp 半導体装置の製造方法
US20050221612A1 (en) * 2004-04-05 2005-10-06 International Business Machines Corporation A low thermal budget (mol) liner, a semiconductor device comprising said liner and method of forming said semiconductor device
US7241674B2 (en) * 2004-05-13 2007-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming silicided gate structure
US7015126B2 (en) * 2004-06-03 2006-03-21 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming silicided gate structure
JP2006013270A (ja) * 2004-06-29 2006-01-12 Renesas Technology Corp 半導体装置およびその製造方法
US7396767B2 (en) * 2004-07-16 2008-07-08 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure including silicide regions and method of making same
US7135372B2 (en) * 2004-09-09 2006-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Strained silicon device manufacturing method
KR100618877B1 (ko) * 2004-11-19 2006-09-08 삼성전자주식회사 멀티비트 비휘발성 메모리 소자, 그 동작 방법 및 그 제조방법
JP2006147897A (ja) * 2004-11-22 2006-06-08 Samsung Electronics Co Ltd 半導体装置の製造方法
JP4146859B2 (ja) * 2004-11-30 2008-09-10 松下電器産業株式会社 半導体装置の製造方法
JP2006261635A (ja) * 2005-02-21 2006-09-28 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
US20060246720A1 (en) * 2005-04-28 2006-11-02 Chii-Ming Wu Method to improve thermal stability of silicides with additives
JP2007067225A (ja) * 2005-08-31 2007-03-15 Toshiba Corp 半導体装置およびその製造方法
CN100434569C (zh) * 2005-10-14 2008-11-19 首都师范大学 一种环保的活塞环表面改性方法
JP2007142347A (ja) 2005-10-19 2007-06-07 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP4755894B2 (ja) * 2005-12-16 2011-08-24 株式会社東芝 半導体装置およびその製造方法
US20070221993A1 (en) * 2006-03-27 2007-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method for making a thermally stable silicide
TW200910526A (en) * 2007-07-03 2009-03-01 Renesas Tech Corp Method of manufacturing semiconductor device
US7981749B2 (en) * 2007-08-20 2011-07-19 GlobalFoundries, Inc. MOS structures that exhibit lower contact resistance and methods for fabricating the same
JP2009094395A (ja) * 2007-10-11 2009-04-30 Renesas Technology Corp 半導体装置およびその製造方法
US8435862B2 (en) * 2010-03-29 2013-05-07 Renesas Electronics Corporation Method of manufacturing semiconductor device
CN102290325A (zh) * 2010-06-21 2011-12-21 无锡华润上华半导体有限公司 金属硅化物的清洗方法
CN102543701B (zh) * 2010-12-24 2014-05-14 中芯国际集成电路制造(上海)有限公司 制作金属硅化物的方法
CN102569054A (zh) * 2012-02-27 2012-07-11 中国科学院微电子研究所 一种t型栅的制备方法
US8927422B2 (en) 2012-06-18 2015-01-06 International Business Machines Corporation Raised silicide contact
US9240454B1 (en) * 2014-10-22 2016-01-19 Stmicroelectronics, Inc. Integrated circuit including a liner silicide with low contact resistance
US20240072125A1 (en) * 2022-08-23 2024-02-29 Wolfspeed, Inc. Electronic devices with reduced ohmic to ohmic dimensions

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH098297A (ja) * 1995-06-26 1997-01-10 Mitsubishi Electric Corp 半導体装置、その製造方法及び電界効果トランジスタ
JP3612157B2 (ja) * 1996-11-27 2005-01-19 株式会社ルネサステクノロジ 半導体装置の製造方法
US6372566B1 (en) * 1997-07-03 2002-04-16 Texas Instruments Incorporated Method of forming a silicide layer using metallic impurities and pre-amorphization
JP3149937B2 (ja) * 1997-12-08 2001-03-26 日本電気株式会社 半導体装置およびその製造方法
US6165903A (en) * 1998-11-04 2000-12-26 Advanced Micro Devices, Inc. Method of forming ultra-shallow junctions in a semiconductor wafer with deposited silicon layer to reduce silicon consumption during salicidation
US6180469B1 (en) 1998-11-06 2001-01-30 Advanced Micro Devices, Inc. Low resistance salicide technology with reduced silicon consumption
JP2001077050A (ja) * 1999-08-31 2001-03-23 Toshiba Corp 半導体装置の製造方法
US6440851B1 (en) * 1999-10-12 2002-08-27 International Business Machines Corporation Method and structure for controlling the interface roughness of cobalt disilicide
US6413859B1 (en) * 2000-03-06 2002-07-02 International Business Machines Corporation Method and structure for retarding high temperature agglomeration of silicides using alloys
US6890854B2 (en) * 2000-11-29 2005-05-10 Chartered Semiconductor Manufacturing, Inc. Method and apparatus for performing nickel salicidation
US6380057B1 (en) 2001-02-13 2002-04-30 Advanced Micro Devices, Inc. Enhancement of nickel silicide formation by use of nickel pre-amorphizing implant
US6444578B1 (en) * 2001-02-21 2002-09-03 International Business Machines Corporation Self-aligned silicide process for reduction of Si consumption in shallow junction and thin SOI electronic devices
US6468901B1 (en) * 2001-05-02 2002-10-22 Sharp Laboratories Of America, Inc. Nickel silicide including iridium for use in ultra-shallow junctions with high thermal stability and method of manufacturing the same

Also Published As

Publication number Publication date
JP2006516174A (ja) 2006-06-22
TWI298521B (en) 2008-07-01
CN1663027B (zh) 2010-12-08
US6689688B2 (en) 2004-02-10
US20030235984A1 (en) 2003-12-25
CN1663027A (zh) 2005-08-31
EP1522093A1 (en) 2005-04-13
TW200400571A (en) 2004-01-01
WO2004001826A1 (en) 2003-12-31
KR20050009761A (ko) 2005-01-25

Similar Documents

Publication Publication Date Title
AU2003278824A1 (en) Method using silicide contacts for semiconductor processing
AU2003246348A1 (en) Method for dividing semiconductor wafer
AU2003248339A1 (en) Method for dividing semiconductor wafer
AU2003262077A1 (en) Method for cutting semiconductor substrate
TWI372421B (en) Wafer processing method
SG135040A1 (en) Method for processing wafer
AU2003266565A1 (en) Substrate processing apparatus
AU2003266564A1 (en) Substrate processing apparatus
AU2003259203A1 (en) Substrate processing apparatus
AU2003282513A1 (en) Rapid thermal processing system for integrated circuits
AU2003275373A1 (en) Semiconductor device processing
AU2003294309A1 (en) Spatially-arranged chemical processing station
SG109568A1 (en) Wafer processing method
AU2003244166A1 (en) Plasma processing method
AU2003236002A1 (en) Method for manufacturing semiconductor chip
SG110134A1 (en) Wafer processing method
AU2002368383A1 (en) Electric heater for semiconductor processing apparatus
AU2003279033A1 (en) Method for reducing wafer arcing
AU2003265634A1 (en) Substrate processing system
AU2003212469A1 (en) Method for processing multiple semiconductor devices for test
AU2002360263A1 (en) System and method for processing correlated contacts
AU2003248343A1 (en) Process for producing semiconductor device
AU2003257063A1 (en) Semiconductor device and method for forming
AU2003291315A1 (en) Split manufacturing method for semiconductor circuits
AU2002348636A1 (en) Method for ashing

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase