AU2003248823A1 - Trench schottky barrier diode - Google Patents

Trench schottky barrier diode

Info

Publication number
AU2003248823A1
AU2003248823A1 AU2003248823A AU2003248823A AU2003248823A1 AU 2003248823 A1 AU2003248823 A1 AU 2003248823A1 AU 2003248823 A AU2003248823 A AU 2003248823A AU 2003248823 A AU2003248823 A AU 2003248823A AU 2003248823 A1 AU2003248823 A1 AU 2003248823A1
Authority
AU
Australia
Prior art keywords
schottky barrier
barrier diode
trench schottky
trench
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003248823A
Other languages
English (en)
Inventor
Kohji Andoh
Davide Chiola
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of AU2003248823A1 publication Critical patent/AU2003248823A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/117Recessed field plates, e.g. trench field plates or buried field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/01Manufacture or treatment
    • H10D8/051Manufacture or treatment of Schottky diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/60Schottky-barrier diodes 
    • H10D8/605Schottky-barrier diodes  of the trench conductor-insulator-semiconductor barrier type, e.g. trench MOS barrier Schottky rectifiers [TMBS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/221Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only diodes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/963Removing process residues from vertical substrate surfaces
AU2003248823A 2002-07-11 2003-07-02 Trench schottky barrier diode Abandoned AU2003248823A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/193,783 US6855593B2 (en) 2002-07-11 2002-07-11 Trench Schottky barrier diode
US10/193,783 2002-07-11
PCT/US2003/021009 WO2004008529A1 (en) 2002-07-11 2003-07-02 Trench schottky barrier diode

Publications (1)

Publication Number Publication Date
AU2003248823A1 true AU2003248823A1 (en) 2004-02-02

Family

ID=30114607

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003248823A Abandoned AU2003248823A1 (en) 2002-07-11 2003-07-02 Trench schottky barrier diode

Country Status (7)

Country Link
US (1) US6855593B2 (https=)
EP (1) EP1543554A4 (https=)
JP (1) JP2005532698A (https=)
CN (1) CN1291483C (https=)
AU (1) AU2003248823A1 (https=)
TW (1) TWI232590B (https=)
WO (1) WO2004008529A1 (https=)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7323402B2 (en) * 2002-07-11 2008-01-29 International Rectifier Corporation Trench Schottky barrier diode with differential oxide thickness
US8629019B2 (en) * 2002-09-24 2014-01-14 Vishay-Siliconix Method of forming self aligned contacts for a power MOSFET
TW583748B (en) * 2003-03-28 2004-04-11 Mosel Vitelic Inc The termination structure of DMOS device
US6998694B2 (en) * 2003-08-05 2006-02-14 Shye-Lin Wu High switching speed two mask Schottky diode with high field breakdown
US7973381B2 (en) * 2003-09-08 2011-07-05 International Rectifier Corporation Thick field oxide termination for trench schottky device
KR100566303B1 (ko) * 2003-12-15 2006-03-30 주식회사 하이닉스반도체 리세스된 게이트 전극 형성 방법
FR2864345B1 (fr) * 2003-12-18 2006-03-31 St Microelectronics Sa Realisation de la peripherie d'une diode schottky a tranchees mos
US7196397B2 (en) * 2004-03-04 2007-03-27 International Rectifier Corporation Termination design with multiple spiral trench rings
US7153784B2 (en) * 2004-04-20 2006-12-26 Intel Corporation Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
FR2879024A1 (fr) * 2004-12-08 2006-06-09 St Microelectronics Sa Peripherie de composant unipolaire vertical
DE102004059640A1 (de) * 2004-12-10 2006-06-22 Robert Bosch Gmbh Halbleitereinrichtung und Verfahren zu deren Herstellung
KR100567073B1 (ko) * 2004-12-29 2006-04-04 주식회사 하이닉스반도체 피모스펫 제조방법
US7671439B2 (en) * 2005-02-11 2010-03-02 Alpha & Omega Semiconductor, Ltd. Junction barrier Schottky (JBS) with floating islands
US7737522B2 (en) * 2005-02-11 2010-06-15 Alpha & Omega Semiconductor, Ltd. Trench junction barrier controlled Schottky device with top and bottom doped regions for enhancing forward current in a vertical direction
US7583485B1 (en) 2005-07-26 2009-09-01 Vishay-Siliconix Electrostatic discharge protection circuit for integrated circuits
US7544545B2 (en) 2005-12-28 2009-06-09 Vishay-Siliconix Trench polysilicon diode
TWI435430B (zh) * 2006-01-18 2014-04-21 維雪 希里康尼克斯公司 具高靜電放電性能之低電壓輸出驅動器
US7335927B2 (en) * 2006-01-30 2008-02-26 Internatioanl Business Machines Corporation Lateral silicided diodes
US7488673B2 (en) * 2006-02-24 2009-02-10 International Rectifier Corporation Trench MOS Schottky barrier rectifier with high k gate dielectric and reduced mask process for the manufacture thereof
US7955961B2 (en) * 2006-03-07 2011-06-07 International Rectifier Corporation Process for manufacture of trench Schottky
US20070293028A1 (en) * 2006-06-16 2007-12-20 Chip Integration Tech.Co.,Ltd. Method of forming low forward voltage Shottky barrier diode with LOCOS structure therein
EP2102717B1 (fr) 2006-12-21 2013-06-26 CompliTime S.A. Oscillateur mecanique pour une piece d'horlogerie
US7741693B1 (en) 2007-11-16 2010-06-22 National Semiconductor Corporation Method for integrating trench MOS Schottky barrier devices into integrated circuits and related semiconductor devices
US10600902B2 (en) 2008-02-13 2020-03-24 Vishay SIliconix, LLC Self-repairing field effect transisitor
US20090309181A1 (en) * 2008-06-12 2009-12-17 Force Mos Technology Co. Ltd. Trench schottky with multiple epi structure
JP5374520B2 (ja) * 2008-12-26 2013-12-25 ルネサスエレクトロニクス株式会社 半導体装置、ショットキバリアダイオード、電子装置、および半導体装置の製造方法
PE20121017A1 (es) 2009-04-17 2012-08-08 Seerstone Llc Metodo para la produccion de carbono solido mediante la reduccion de oxidos de carbono
US7915645B2 (en) 2009-05-28 2011-03-29 International Rectifier Corporation Monolithic vertically integrated composite group III-V and group IV semiconductor device and method for fabricating same
CN101609801B (zh) * 2009-07-03 2011-05-25 英属维京群岛商节能元件股份有限公司 沟槽式肖特基二极管及其制作方法
US9230810B2 (en) 2009-09-03 2016-01-05 Vishay-Siliconix System and method for substrate wafer back side and edge cross section seals
CN101882617B (zh) * 2010-06-12 2011-11-30 中国科学院上海微系统与信息技术研究所 肖特基二极管、半导体存储器及其制造工艺
JP5674366B2 (ja) * 2010-07-26 2015-02-25 新電元工業株式会社 ショットキーバリアダイオード及びその製造方法
CN102376568B (zh) * 2010-08-19 2015-08-05 北大方正集团有限公司 在深沟槽肖特基二极管晶圆的深沟槽内淀积多晶硅的方法
TWI497602B (zh) * 2011-02-15 2015-08-21 Tzu Hsiung Chen 溝渠式蕭基二極體及其製作方法
TWI492310B (zh) * 2012-01-17 2015-07-11 Richtek Technology Corp 溝槽蕭特基位障二極體及其製造方法
EP2838837A4 (en) 2012-04-16 2015-12-23 Seerstone Llc METHOD AND STRUCTURES FOR REDUCING CARBON OXIDES WITH IRON-FREE CATALYSTS
WO2013158160A1 (en) 2012-04-16 2013-10-24 Seerstone Llc Method for producing solid carbon by reducing carbon dioxide
CN104302576B (zh) 2012-04-16 2017-03-08 赛尔斯通股份有限公司 用于捕捉和封存碳并且用于减少废气流中碳氧化物的质量的方法和系统
EP2838844A4 (en) 2012-04-16 2015-10-28 Seerstone Llc METHOD FOR TREATING A GAS CLEARANCE CONTAINING CARBON OXIDES
NO2749379T3 (https=) 2012-04-16 2018-07-28
US9896341B2 (en) 2012-04-23 2018-02-20 Seerstone Llc Methods of forming carbon nanotubes having a bimodal size distribution
US9604848B2 (en) 2012-07-12 2017-03-28 Seerstone Llc Solid carbon products comprising carbon nanotubes and methods of forming same
US10815124B2 (en) 2012-07-12 2020-10-27 Seerstone Llc Solid carbon products comprising carbon nanotubes and methods of forming same
CN107215882A (zh) 2012-07-13 2017-09-29 赛尔斯通股份有限公司 用于形成氨和固体碳产物的方法和系统
US9779845B2 (en) 2012-07-18 2017-10-03 Seerstone Llc Primary voltaic sources including nanofiber Schottky barrier arrays and methods of forming same
TWI521693B (zh) 2012-11-27 2016-02-11 財團法人工業技術研究院 蕭基能障二極體及其製造方法
WO2014085378A1 (en) 2012-11-29 2014-06-05 Seerstone Llc Reactors and methods for producing solid carbon materials
CN103022137A (zh) * 2012-12-27 2013-04-03 淄博美林电子有限公司 一种高效率肖特基芯片
WO2014151144A1 (en) 2013-03-15 2014-09-25 Seerstone Llc Carbon oxide reduction with intermetallic and carbide catalysts
US9586823B2 (en) 2013-03-15 2017-03-07 Seerstone Llc Systems for producing solid carbon by reducing carbon oxides
CN104183483B (zh) * 2013-05-20 2017-06-06 上海华虹宏力半导体制造有限公司 沟槽型肖特基二极管的制备方法
CN104835734A (zh) * 2014-02-10 2015-08-12 北大方正集团有限公司 肖特基二极管的制造方法
EP2991104A3 (en) 2014-08-29 2016-03-09 International Rectifier Corporation Monolithic integrated composite group iii-v and group iv semiconductor device and ic
CN105720109A (zh) * 2014-12-05 2016-06-29 无锡华润上华半导体有限公司 一种沟槽型肖特基势垒二极管及其制备方法
US9716187B2 (en) 2015-03-06 2017-07-25 Semiconductor Components Industries, Llc Trench semiconductor device having multiple trench depths and method
US10431699B2 (en) 2015-03-06 2019-10-01 Semiconductor Components Industries, Llc Trench semiconductor device having multiple active trench depths and method
CN105161417B (zh) * 2015-08-31 2019-01-04 上海华虹宏力半导体制造有限公司 肖特基二极管工艺方法
DE102016100794B4 (de) * 2016-01-19 2019-03-28 Harting Electric Gmbh & Co. Kg Halterahmen mit Führungselement für Steckverbindermodule und System bestehend aus zwei dieser Halterahmen
WO2018022999A1 (en) 2016-07-28 2018-02-01 Seerstone Llc. Solid carbon products comprising compressed carbon nanotubes in a container and methods of forming same
CN106328718B (zh) * 2016-11-04 2024-06-25 南京涟沫动漫文化传播有限公司 一种台面二极管
US10388801B1 (en) * 2018-01-30 2019-08-20 Semiconductor Components Industries, Llc Trench semiconductor device having shaped gate dielectric and gate electrode structures and method
US10439075B1 (en) 2018-06-27 2019-10-08 Semiconductor Components Industries, Llc Termination structure for insulated gate semiconductor device and method
US10566466B2 (en) 2018-06-27 2020-02-18 Semiconductor Components Industries, Llc Termination structure for insulated gate semiconductor device and method
CN110634730B (zh) * 2019-09-27 2021-08-13 扬州扬杰电子科技股份有限公司 一种沟槽肖特基多晶硅沉积后栅氧中断返工方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3363153A (en) 1965-06-01 1968-01-09 Gen Telephone & Elect Solid state triode having gate electrode therein subtending a portion of the source electrode
US4219835A (en) 1978-02-17 1980-08-26 Siliconix, Inc. VMOS Mesa structure and manufacturing process
US4647957A (en) * 1983-10-11 1987-03-03 At&T Bell Laboratories Latchup-preventing CMOS device
GB2151844A (en) 1983-12-20 1985-07-24 Philips Electronic Associated Semiconductor devices
JPS6281040A (ja) * 1985-10-04 1987-04-14 Oki Electric Ind Co Ltd 素子分離領域の形成方法
US5082795A (en) * 1986-12-05 1992-01-21 General Electric Company Method of fabricating a field effect semiconductor device having a self-aligned structure
JPS63299365A (ja) * 1987-05-29 1988-12-06 Seiko Instr & Electronics Ltd 半導体装置の製造方法
US4994883A (en) 1989-10-02 1991-02-19 General Electric Company Field controlled diode (FCD) having MOS trench gates
JPH05283518A (ja) * 1992-04-06 1993-10-29 Toshiba Corp 半導体装置の製造方法
US5365102A (en) 1993-07-06 1994-11-15 North Carolina State University Schottky barrier rectifier with MOS trench
US6049108A (en) * 1995-06-02 2000-04-11 Siliconix Incorporated Trench-gated MOSFET with bidirectional voltage clamping
US6078090A (en) * 1997-04-02 2000-06-20 Siliconix Incorporated Trench-gated Schottky diode with integral clamping diode
US5612567A (en) 1996-05-13 1997-03-18 North Carolina State University Schottky barrier rectifiers and methods of forming same
US6130602A (en) * 1996-05-13 2000-10-10 Micron Technology, Inc. Radio frequency data communications device
GB9929613D0 (en) * 1999-12-15 2000-02-09 Koninkl Philips Electronics Nv Manufacture of semiconductor material and devices using that material
GB0002235D0 (en) 2000-02-02 2000-03-22 Koninkl Philips Electronics Nv Trenched schottky rectifiers
DE10007847A1 (de) * 2000-02-21 2001-08-23 Zahnradfabrik Friedrichshafen Elektromagnetische Schalteinrichtung
JP3691736B2 (ja) * 2000-07-31 2005-09-07 新電元工業株式会社 半導体装置
US6309929B1 (en) * 2000-09-22 2001-10-30 Industrial Technology Research Institute And Genetal Semiconductor Of Taiwan, Ltd. Method of forming trench MOS device and termination structure
US6396090B1 (en) * 2000-09-22 2002-05-28 Industrial Technology Research Institute Trench MOS device and termination structure
US6541312B2 (en) * 2000-12-22 2003-04-01 Matrix Semiconductor, Inc. Formation of antifuse structure in a three dimensional memory

Also Published As

Publication number Publication date
WO2004008529A1 (en) 2004-01-22
CN1291483C (zh) 2006-12-20
JP2005532698A (ja) 2005-10-27
US6855593B2 (en) 2005-02-15
EP1543554A1 (en) 2005-06-22
EP1543554A4 (en) 2008-05-07
CN1672257A (zh) 2005-09-21
US20040007723A1 (en) 2004-01-15
TW200402891A (en) 2004-02-16
TWI232590B (en) 2005-05-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase