AU2002221064A1 - Ultraviolet-curable resin composition and photosolder resist ink containing the composition - Google Patents

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Info

Publication number
AU2002221064A1
AU2002221064A1 AU2002221064A AU2106402A AU2002221064A1 AU 2002221064 A1 AU2002221064 A1 AU 2002221064A1 AU 2002221064 A AU2002221064 A AU 2002221064A AU 2106402 A AU2106402 A AU 2106402A AU 2002221064 A1 AU2002221064 A1 AU 2002221064A1
Authority
AU
Australia
Prior art keywords
composition
ultraviolet
curable resin
ink containing
resist ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002221064A
Other languages
English (en)
Inventor
Soichi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goo Chemical Industries Co Ltd
Original Assignee
Goo Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Industries Co Ltd filed Critical Goo Chemical Industries Co Ltd
Publication of AU2002221064A1 publication Critical patent/AU2002221064A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C08F290/126—Polymers of unsaturated carboxylic acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/142—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2800/00—Copolymer characterised by the proportions of the comonomers expressed
    • C08F2800/20—Copolymer characterised by the proportions of the comonomers expressed as weight or mass percentages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2810/00—Chemical modification of a polymer
    • C08F2810/30—Chemical modification of a polymer leading to the formation or introduction of aliphatic or alicyclic unsaturated groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
AU2002221064A 2000-12-14 2001-12-06 Ultraviolet-curable resin composition and photosolder resist ink containing the composition Abandoned AU2002221064A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000381110 2000-12-14
JP2000-381110 2000-12-14
JP2000398458 2000-12-27
JP2000-398458 2000-12-27
PCT/JP2001/010657 WO2002048226A1 (fr) 2000-12-14 2001-12-06 Composition de résine durcissant aux uv et photorésine liquide de photosoudage contenant cette composition

Publications (1)

Publication Number Publication Date
AU2002221064A1 true AU2002221064A1 (en) 2002-06-24

Family

ID=26605867

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002221064A Abandoned AU2002221064A1 (en) 2000-12-14 2001-12-06 Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Country Status (8)

Country Link
US (1) US6964813B2 (de)
EP (1) EP1359172B1 (de)
JP (1) JP4095441B2 (de)
CN (1) CN1233679C (de)
AU (1) AU2002221064A1 (de)
DE (1) DE60138836D1 (de)
TW (1) TW562834B (de)
WO (1) WO2002048226A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT504465A1 (de) * 2002-10-21 2008-05-15 Surface Specialties Austria Wässrige nichtionisch stabilisierte epoxidharze
JP2004263142A (ja) * 2003-03-04 2004-09-24 Goo Chemical Co Ltd ポリエステル樹脂、紫外線硬化性樹脂組成物、その硬化物及びプリント配線板
TW200602427A (en) * 2004-03-30 2006-01-16 Taiyo Ink Mfg Co Ltd Thermosetting resin composition and multilayered printed wiring board comprising the same
WO2006001171A1 (ja) * 2004-06-09 2006-01-05 Bridgestone Corporation 現像ローラ、帯電ローラ、導電性ローラ及びその製造方法
JP5031578B2 (ja) * 2006-03-29 2012-09-19 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
CN102662304B (zh) * 2007-01-25 2016-12-14 新应材股份有限公司 一种双面微影蚀刻制程
JP5154915B2 (ja) * 2007-12-26 2013-02-27 株式会社日本触媒 主鎖環構造を有するアルカリ可溶性樹脂及びその用途
JP5412357B2 (ja) * 2010-04-01 2014-02-12 株式会社フジクラ メンブレン配線板
TWI442181B (zh) * 2010-12-02 2014-06-21 Ind Tech Res Inst 感光性組成物與光阻
US9081275B2 (en) 2010-12-02 2015-07-14 Industrial Technology Research Institute Photosensitive composition and photoresist
KR20120082169A (ko) * 2011-01-13 2012-07-23 삼성전자주식회사 알칼리 가용성의 에폭시 수지를 포함하는 감광성 접착제 조성물 및 이를 이용한 패턴 형성용 접착 필름
CN102654731B (zh) * 2011-09-02 2014-04-02 京东方科技集团股份有限公司 一种彩色光阻剂、彩色滤光片及含有其的显示装置
JP5970185B2 (ja) * 2011-12-27 2016-08-17 株式会社タムラ製作所 樹脂および当該樹脂を含む感光性組成物
JP6178797B2 (ja) * 2012-10-15 2017-08-09 株式会社ダイセル 硬化性樹脂組成物及びその硬化物
JP6184087B2 (ja) * 2012-12-07 2017-08-23 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用スペーサー及び／またはカラーフィルター保護膜
CN103235484B (zh) * 2013-04-25 2016-04-06 京东方科技集团股份有限公司 光阻组合物及其制备方法和显示装置
CN104714365A (zh) * 2014-07-01 2015-06-17 广东丹邦科技有限公司 一种感光组合物和光致抗蚀剂
CN105330829A (zh) * 2015-10-29 2016-02-17 苏州市博来特油墨有限公司 一种用于印刷pe材料油墨中连接料预聚物的制备方法
JP6753305B2 (ja) * 2016-12-22 2020-09-09 Dic株式会社 水性エポキシ樹脂組成物、繊維集束剤、繊維材料、成形材料、及びコーティング剤
JP6996284B2 (ja) * 2016-12-28 2022-01-17 荒川化学工業株式会社 樹脂及びその製造方法、活性エネルギー線硬化型樹脂組成物、硬化物、活性エネルギー線硬化型印刷インキ、並びに印刷物
EP3609946A4 (de) * 2017-04-12 2020-12-23 Sun Chemical Corporation Stabile photoresistzusammensetzungen mit organoschwefelverbindungen
JP2024518795A (ja) * 2021-05-18 2024-05-02 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 光硬化性組成物

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JPS61243869A (ja) 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JPH0823694B2 (ja) * 1988-08-04 1996-03-06 富士写真フイルム株式会社 液状感光性樹脂組成物
US5124234A (en) 1989-01-20 1992-06-23 Fuji Photo Film Co., Ltd. Liquid light-sensitive resin composition
JPH04151158A (ja) 1990-05-18 1992-05-25 Arakawa Chem Ind Co Ltd アルカリ現像型液状フォトソルダーレジストインキ組成物
JPH04166944A (ja) 1990-10-31 1992-06-12 Mitsubishi Kasei Corp 感光性樹脂組成物
JPH0767008B2 (ja) 1991-09-21 1995-07-19 太陽インキ製造株式会社 ソルダーレジストパターン形成方法
US5306744A (en) * 1992-12-18 1994-04-26 Rohm And Haas Company Functionalized multistage polymers
ES2128127T3 (es) * 1995-06-23 1999-05-01 Inventa Ag Composicion de revestimiento en polvo termoendurecible.
DE19614008C2 (de) 1995-06-23 1997-05-22 Inventa Ag Wärmehärtbare pulverförmige Beschichtungsmasse
JP4081217B2 (ja) * 1999-03-17 2008-04-23 互応化学工業株式会社 紫外線硬化性樹脂組成物、フォトソルダーレジストインク、予備乾燥被膜、基板及びプリント配線板
AU2001286239A1 (en) * 2000-09-16 2002-04-02 Goo Chemical Co., Ltd. Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Also Published As

Publication number Publication date
JP4095441B2 (ja) 2008-06-04
DE60138836D1 (de) 2009-07-09
EP1359172A1 (de) 2003-11-05
CN1233679C (zh) 2005-12-28
JPWO2002048226A1 (ja) 2004-04-15
US20040044102A1 (en) 2004-03-04
TW562834B (en) 2003-11-21
EP1359172A4 (de) 2005-03-30
EP1359172B1 (de) 2009-05-27
CN1496377A (zh) 2004-05-12
US6964813B2 (en) 2005-11-15
WO2002048226A1 (fr) 2002-06-20

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