AU2001276676A1 - Resist ink composition - Google Patents

Resist ink composition

Info

Publication number
AU2001276676A1
AU2001276676A1 AU2001276676A AU7667601A AU2001276676A1 AU 2001276676 A1 AU2001276676 A1 AU 2001276676A1 AU 2001276676 A AU2001276676 A AU 2001276676A AU 7667601 A AU7667601 A AU 7667601A AU 2001276676 A1 AU2001276676 A1 AU 2001276676A1
Authority
AU
Australia
Prior art keywords
ink composition
resist ink
resist
composition
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001276676A
Inventor
Takashi Sato
Hirotaka Tagoshi
Takeo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of AU2001276676A1 publication Critical patent/AU2001276676A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
AU2001276676A 2000-07-21 2001-07-19 Resist ink composition Abandoned AU2001276676A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000219997A JP2002040632A (en) 2000-07-21 2000-07-21 Resist ink composition
JP2000-219997 2000-07-21
US24659600P 2000-11-08 2000-11-08
US60246596 2000-11-08
PCT/JP2001/006309 WO2002008347A2 (en) 2000-07-21 2001-07-19 Resist ink composition

Publications (1)

Publication Number Publication Date
AU2001276676A1 true AU2001276676A1 (en) 2002-02-05

Family

ID=18714680

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001276676A Abandoned AU2001276676A1 (en) 2000-07-21 2001-07-19 Resist ink composition

Country Status (7)

Country Link
US (1) US6783840B2 (en)
EP (1) EP1222496A1 (en)
JP (1) JP2002040632A (en)
KR (1) KR100485658B1 (en)
AU (1) AU2001276676A1 (en)
CA (1) CA2385253A1 (en)
WO (1) WO2002008347A2 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7122288B2 (en) * 2000-03-28 2006-10-17 Fujitsu Limited Negative resist composition, a method for forming a resist pattern thereof, and a method for fabricating a semiconductor device
AU2003236229A1 (en) * 2002-04-15 2003-10-27 Toagosei Co., Ltd. Actinic radiation hardenable resin composition and hardening product thereof
JP4214729B2 (en) * 2002-07-25 2009-01-28 コニカミノルタホールディングス株式会社 Curable white ink composition
JP3888254B2 (en) * 2002-07-29 2007-02-28 富士電機ホールディングス株式会社 Multilayer printed wiring board
US7084184B2 (en) * 2002-08-30 2006-08-01 Konica Corporation Actinic ray curable composition, actinic ray curable ink, image forming method, and ink jet recording apparatus
JP2004168961A (en) * 2002-11-22 2004-06-17 Konica Minolta Holdings Inc Active energy beam-curing type ink and printed material by using the same
JP4175221B2 (en) * 2003-09-09 2008-11-05 Ｊｓｒ株式会社 Photosensitive insulating resin composition and cured product thereof
JP2005105191A (en) * 2003-10-01 2005-04-21 Konica Minolta Medical & Graphic Inc Active ray-curable ink composition for inkjet printing, method for image formation using the same and ink jet recording device using the same
TW200533692A (en) * 2003-11-06 2005-10-16 Showa Denko Kk Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof
GB0414847D0 (en) * 2004-07-02 2004-08-04 Avecia Ltd Process
TW200710570A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure
JP4809006B2 (en) * 2005-07-05 2011-11-02 太陽ホールディングス株式会社 Colored photosensitive resin composition and cured product thereof
JP4426537B2 (en) * 2006-02-08 2010-03-03 株式会社東芝 Photosensitive composition, composite member and electronic component using the same
JP2007217471A (en) * 2006-02-14 2007-08-30 Fujifilm Corp Cationically polymerizable composition, and image formation method and recording each using the same
JP5168860B2 (en) 2006-09-14 2013-03-27 株式会社スリーボンド Photopolymerizable composition
US8791173B2 (en) 2008-06-13 2014-07-29 Dic Corporation Ink composition for forming insulating film and insulating film formed from the ink composition
WO2013137227A1 (en) * 2012-03-13 2013-09-19 株式会社ダイセル Photosensitive resin composition, cured product thereof, and optical component
JP6171677B2 (en) * 2013-07-26 2017-08-02 東洋インキＳｃホールディングス株式会社 Photocurable resin composition
FI3689984T3 (en) * 2014-06-19 2023-07-20 Nat Res Council Canada Molecular inks
TWI519560B (en) 2014-11-24 2016-02-01 財團法人工業技術研究院 Resin containing oxetane and epoxy groups and resin composition including the same
JP6487376B2 (en) * 2015-06-11 2019-03-20 株式会社タムラ製作所 Photosensitive resin composition
CN111587274A (en) * 2017-12-18 2020-08-25 爱克发-格法特公司 Solder resist ink jet ink for manufacturing printed circuit board

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1463054A (en) * 1964-10-06 1966-06-03 Henkel & Cie Gmbh Process for manufacturing synthetic resins from epoxy compounds and carboxylic acids
DE1301132B (en) * 1964-10-06 1969-08-14 Henkel & Cie Gmbh Process for the production of molded articles on the basis of epoxy polyadducts
US3457193A (en) * 1965-06-30 1969-07-22 Union Carbide Corp Epoxyoxacyclobutanes and polymers thereof
JP3839510B2 (en) * 1996-02-16 2006-11-01 関西ペイント株式会社 Thermosetting resin composition
JP3839543B2 (en) * 1996-02-16 2006-11-01 関西ペイント株式会社 Active energy ray-curable resin composition
US5882842A (en) 1996-02-16 1999-03-16 Kansai Paint Co., Ltd. Active energy ray-curable resin composition
CN1195356A (en) * 1996-06-12 1998-10-07 日本化药株式会社 Photopolymerization initiator and actinic radiation-curable composition comprising same
US6190833B1 (en) * 1997-03-30 2001-02-20 Jsr Corporation Radiation-sensitive resin composition
DE19736471A1 (en) * 1997-08-21 1999-02-25 Espe Dental Ag Light-induced cationic curing compositions and their use
JPH11148045A (en) * 1997-11-19 1999-06-02 Kansai Paint Co Ltd Active energy light-curable coating composition and formation of coating using the same
JPH11152441A (en) * 1997-11-21 1999-06-08 Kansai Paint Co Ltd Ultraviolet-curing composition for coating can
US6287745B1 (en) * 1998-02-18 2001-09-11 Dsm N.V. Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound
US6232361B1 (en) * 1998-12-11 2001-05-15 Sun Chemical Corporation Radiation curable water based cationic inks and coatings
JP2001040205A (en) * 1999-07-30 2001-02-13 Ube Ind Ltd Energy ray-curing composition
JP2001222103A (en) * 1999-08-05 2001-08-17 Nippon Paint Co Ltd Water-base photo soldering resist composition
JP2001310938A (en) * 2000-04-28 2001-11-06 Showa Denko Kk Polymerizable composition, its cured product and production method

Also Published As

Publication number Publication date
JP2002040632A (en) 2002-02-06
EP1222496A1 (en) 2002-07-17
KR20020040811A (en) 2002-05-30
KR100485658B1 (en) 2005-04-27
US6783840B2 (en) 2004-08-31
CA2385253A1 (en) 2002-01-31
WO2002008347A2 (en) 2002-01-31
US20030022958A1 (en) 2003-01-30
WO2002008347A3 (en) 2002-04-18

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