AU2002221042A1 - Solder resist ink - Google Patents

Solder resist ink

Info

Publication number
AU2002221042A1
AU2002221042A1 AU2002221042A AU2104202A AU2002221042A1 AU 2002221042 A1 AU2002221042 A1 AU 2002221042A1 AU 2002221042 A AU2002221042 A AU 2002221042A AU 2104202 A AU2104202 A AU 2104202A AU 2002221042 A1 AU2002221042 A1 AU 2002221042A1
Authority
AU
Australia
Prior art keywords
solder resist
resist ink
ink
solder
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002221042A
Inventor
Hiroko Daido
Teruo Furukawa
Soichi Hashimoto
Tatsuya Kubo
Akiyuki Nakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goo Chemical Industries Co Ltd
Original Assignee
Goo Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Industries Co Ltd filed Critical Goo Chemical Industries Co Ltd
Publication of AU2002221042A1 publication Critical patent/AU2002221042A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
AU2002221042A 2000-12-13 2001-11-26 Solder resist ink Abandoned AU2002221042A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2000379432 2000-12-13
JP2000-379432 2000-12-13
JP2000-380988 2000-12-14
JP2000380988 2000-12-14
JP2001-99983 2001-03-30
JP2001099983 2001-03-30
PCT/JP2001/010288 WO2002048794A1 (en) 2000-12-13 2001-11-26 Solder resist ink

Publications (1)

Publication Number Publication Date
AU2002221042A1 true AU2002221042A1 (en) 2002-06-24

Family

ID=27345435

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002221042A Abandoned AU2002221042A1 (en) 2000-12-13 2001-11-26 Solder resist ink

Country Status (4)

Country Link
JP (1) JP3805745B2 (en)
AU (1) AU2002221042A1 (en)
TW (1) TWI237531B (en)
WO (1) WO2002048794A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2507471A1 (en) 2002-11-28 2004-06-10 Hidetaka Oka Photosensitive resin composition comprising a halogen-free colorant
JP2007201453A (en) * 2005-12-28 2007-08-09 Sumitomo Bakelite Co Ltd Wiring board and insulating resin composition for solder resist used for same
JP5392373B2 (en) * 2005-12-28 2014-01-22 住友ベークライト株式会社 WIRING BOARD AND INSULATION RESIN COMPOSITION FOR SOLDER RESIST USED FOR THE WIRING BOARD
JP4620700B2 (en) * 2006-03-17 2011-01-26 富士フイルム株式会社 Photosensitive composition, photosensitive film, method for forming permanent pattern, and printed circuit board
US7859110B2 (en) * 2006-04-28 2010-12-28 Sumitomo Bakelite Co., Ltd. Solder resist material, wiring board using the solder resist material, and semiconductor package
US20100112474A1 (en) * 2007-03-12 2010-05-06 Fujifilm Corporation Photosensitive composition, photosensitive film, method for forming a permanent pattern, and printed board
CN101542392B (en) * 2007-03-29 2013-08-14 太阳控股株式会社 Photocurable resin composition, dry film, cured product, and printed wiring board
JP5968007B2 (en) * 2012-03-30 2016-08-10 太陽インキ製造株式会社 Photocurable resin composition, dry film and printed wiring board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989316A (en) * 1982-11-12 1984-05-23 Mitsui Toatsu Chem Inc Solder resist ink composition curable by ultraviolet rays
JPS6198725A (en) * 1984-10-19 1986-05-17 Nippon Kayaku Co Ltd Novel epoxy acrylate mixture and ultraviolet curable resin composition containing same
JP2528349B2 (en) * 1988-07-28 1996-08-28 日本化薬株式会社 Solder-resist ink composition
JP4523679B2 (en) * 1998-06-22 2010-08-11 太陽インキ製造株式会社 Green resist ink composition for printed wiring board using halogen-free color pigment
JP4502427B2 (en) * 1998-12-09 2010-07-14 互応化学工業株式会社 Photo solder resist ink
JP2000290564A (en) * 1999-04-09 2000-10-17 Tamura Kaken Co Ltd Resist ink composition and printed wiring board

Also Published As

Publication number Publication date
JP3805745B2 (en) 2006-08-09
TWI237531B (en) 2005-08-01
WO2002048794A1 (en) 2002-06-20
JPWO2002048794A1 (en) 2004-04-15

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