AU2001213568A1 - Pad designs and structures for a versatile materials processing apparatus - Google Patents

Pad designs and structures for a versatile materials processing apparatus

Info

Publication number
AU2001213568A1
AU2001213568A1 AU2001213568A AU1356801A AU2001213568A1 AU 2001213568 A1 AU2001213568 A1 AU 2001213568A1 AU 2001213568 A AU2001213568 A AU 2001213568A AU 1356801 A AU1356801 A AU 1356801A AU 2001213568 A1 AU2001213568 A1 AU 2001213568A1
Authority
AU
Australia
Prior art keywords
structures
processing apparatus
materials processing
pad designs
versatile materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001213568A
Other languages
English (en)
Inventor
Bulent Basol
Homayoun Talieh
Cyprian Uzoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
Original Assignee
ASM Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of AU2001213568A1 publication Critical patent/AU2001213568A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00Combined machining
    • B23H5/06Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08Electrolytic grinding
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/14Electrodes, e.g. composition, counter electrode for pad-plating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04Electroplating with moving electrodes
    • C25D5/06Brush or pad plating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/16Polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2001213568A 2000-02-23 2000-11-01 Pad designs and structures for a versatile materials processing apparatus Abandoned AU2001213568A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/511,278 US6413388B1 (en) 2000-02-23 2000-02-23 Pad designs and structures for a versatile materials processing apparatus
US09511278 2000-02-23
PCT/US2000/030031 WO2001063018A1 (en) 2000-02-23 2000-11-01 Pad designs and structures for a versatile materials processing apparatus

Publications (1)

Publication Number Publication Date
AU2001213568A1 true AU2001213568A1 (en) 2001-09-03

Family

ID=24034209

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001213568A Abandoned AU2001213568A1 (en) 2000-02-23 2000-11-01 Pad designs and structures for a versatile materials processing apparatus

Country Status (8)

Country Link
US (3) US6413388B1 (ko)
EP (1) EP1259661A4 (ko)
JP (1) JP2003524079A (ko)
KR (1) KR100755098B1 (ko)
CN (1) CN1220798C (ko)
AU (1) AU2001213568A1 (ko)
TW (1) TW593780B (ko)
WO (1) WO2001063018A1 (ko)

Families Citing this family (129)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6534116B2 (en) * 2000-08-10 2003-03-18 Nutool, Inc. Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
US7204917B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7077721B2 (en) * 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7029365B2 (en) * 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US7303462B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20060131177A1 (en) * 2000-02-23 2006-06-22 Jeffrey Bogart Means to eliminate bubble entrapment during electrochemical processing of workpiece surface
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US7754061B2 (en) * 2000-08-10 2010-07-13 Novellus Systems, Inc. Method for controlling conductor deposition on predetermined portions of a wafer
US6921551B2 (en) 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
US6652764B1 (en) * 2000-08-31 2003-11-25 Micron Technology, Inc. Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6867448B1 (en) * 2000-08-31 2005-03-15 Micron Technology, Inc. Electro-mechanically polished structure
US20040170753A1 (en) * 2000-12-18 2004-09-02 Basol Bulent M. Electrochemical mechanical processing using low temperature process environment
JP2002254248A (ja) * 2001-02-28 2002-09-10 Sony Corp 電解加工装置
US7201829B2 (en) * 2001-03-01 2007-04-10 Novellus Systems, Inc. Mask plate design
US6899804B2 (en) * 2001-12-21 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
US6638863B2 (en) * 2001-04-24 2003-10-28 Acm Research, Inc. Electropolishing metal layers on wafers having trenches or vias with dummy structures
US6800187B1 (en) * 2001-05-31 2004-10-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating wafers
US6551487B1 (en) 2001-05-31 2003-04-22 Novellus Systems, Inc. Methods and apparatus for controlled-angle wafer immersion
JP4087581B2 (ja) * 2001-06-06 2008-05-21 株式会社荏原製作所 研磨装置
JP3978005B2 (ja) * 2001-08-31 2007-09-19 株式会社日立グローバルストレージテクノロジーズ 薄膜磁気ヘッド並びに薄膜磁気ヘッドスライダ及びその製造方法と磁気ディスク装置
US6706158B2 (en) * 2001-09-28 2004-03-16 Intel Corporation Electrochemical mechanical planarization
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
US6815354B2 (en) * 2001-10-27 2004-11-09 Nutool, Inc. Method and structure for thru-mask contact electrodeposition
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US6841057B2 (en) * 2002-03-13 2005-01-11 Applied Materials Inc. Method and apparatus for substrate polishing
US6843897B2 (en) 2002-05-28 2005-01-18 Applied Materials, Inc. Anode slime reduction method while maintaining low current
US6855235B2 (en) 2002-05-28 2005-02-15 Applied Materials, Inc. Anode impedance control through electrolyte flow control
US20050205425A1 (en) * 2002-06-25 2005-09-22 Integran Technologies Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
US20040072445A1 (en) * 2002-07-11 2004-04-15 Applied Materials, Inc. Effective method to improve surface finish in electrochemically assisted CMP
JP4434948B2 (ja) * 2002-07-18 2010-03-17 株式会社荏原製作所 めっき装置及びめっき方法
JP2004068158A (ja) * 2002-08-08 2004-03-04 Texas Instruments Inc Ecd反応器内の電流密度改善および機構充填制御方法並びに装置
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US20050040049A1 (en) * 2002-09-20 2005-02-24 Rimma Volodarsky Anode assembly for plating and planarizing a conductive layer
US7153400B2 (en) * 2002-09-30 2006-12-26 Lam Research Corporation Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US6773570B2 (en) * 2002-11-14 2004-08-10 International Business Machines Corporation Integrated plating and planarization process and apparatus therefor
US6802950B2 (en) 2002-11-26 2004-10-12 Sandia National Laboratories Apparatus and method for controlling plating uniformity
US6875322B1 (en) 2003-01-15 2005-04-05 Lam Research Corporation Electrochemical assisted CMP
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
US7842169B2 (en) 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
US20050023149A1 (en) * 2003-06-05 2005-02-03 Tsutomu Nakada Plating apparatus, plating method and substrate processing apparatus
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US20050016861A1 (en) * 2003-07-24 2005-01-27 Thomas Laursen Method for planarizing a work piece
DE10342880A1 (de) * 2003-09-15 2005-04-14 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Substratplatte
US20050121141A1 (en) * 2003-11-13 2005-06-09 Manens Antoine P. Real time process control for a polishing process
US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US20050167266A1 (en) * 2004-02-02 2005-08-04 Cabot Microelectronics Corporation ECMP system
US7648622B2 (en) * 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
IL161771A0 (en) * 2004-05-04 2005-11-20 J G Systems Inc Method and composition to minimize dishing in semiconductor wafer processing
US7438795B2 (en) 2004-06-10 2008-10-21 Cabot Microelectronics Corp. Electrochemical-mechanical polishing system
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
CN101056718A (zh) * 2004-11-19 2007-10-17 诺发系统有限公司 工件表面电化学加工期间清除残存空气的方法
WO2006068660A2 (en) * 2004-12-23 2006-06-29 Diamond Innovations, Inc. Electrochemical dissolution of conductive composites
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US20060252254A1 (en) * 2005-05-06 2006-11-09 Basol Bulent M Filling deep and wide openings with defect-free conductor
US20070014958A1 (en) * 2005-07-08 2007-01-18 Chaplin Ernest R Hanger labels, label assemblies and methods for forming the same
JP4356661B2 (ja) * 2005-07-25 2009-11-04 住友電気工業株式会社 ウェハ保持体およびそれを搭載したウェハプローバ
US20070081880A1 (en) * 2005-09-29 2007-04-12 Riordon Benjamin B Wafer-handling method, system, and apparatus
US20070135024A1 (en) * 2005-12-08 2007-06-14 Itsuki Kobata Polishing pad and polishing apparatus
US8219367B2 (en) * 2005-12-20 2012-07-10 Sintokogio, Ltd. Method of estimating information on projection conditions by a projection machine and a device thereof
US20070153453A1 (en) * 2006-01-05 2007-07-05 Applied Materials, Inc. Fully conductive pad for electrochemical mechanical processing
US7550070B2 (en) * 2006-02-03 2009-06-23 Novellus Systems, Inc. Electrode and pad assembly for processing conductive layers
US7485561B2 (en) * 2006-03-29 2009-02-03 Asm Nutool, Inc. Filling deep features with conductors in semiconductor manufacturing
US7625814B2 (en) * 2006-03-29 2009-12-01 Asm Nutool, Inc. Filling deep features with conductors in semiconductor manufacturing
EP1839695A1 (en) * 2006-03-31 2007-10-03 Debiotech S.A. Medical liquid injection device
US20070235344A1 (en) * 2006-04-06 2007-10-11 Applied Materials, Inc. Process for high copper removal rate with good planarization and surface finish
US20070251832A1 (en) * 2006-04-27 2007-11-01 Applied Materials, Inc. Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance
US20070261964A1 (en) * 2006-05-10 2007-11-15 Semitool, Inc. Reactors, systems, and methods for electroplating microfeature workpieces
JP4509968B2 (ja) * 2006-05-25 2010-07-21 株式会社荏原製作所 めっき装置
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
US7651384B2 (en) * 2007-01-09 2010-01-26 Applied Materials, Inc. Method and system for point of use recycling of ECMP fluids
US8580090B2 (en) * 2007-08-01 2013-11-12 Intermolecular, Inc. Combinatorial electrochemical deposition
US20090065365A1 (en) * 2007-09-11 2009-03-12 Asm Nutool, Inc. Method and apparatus for copper electroplating
US7985325B2 (en) * 2007-10-30 2011-07-26 Novellus Systems, Inc. Closed contact electroplating cup assembly
US7935231B2 (en) * 2007-10-31 2011-05-03 Novellus Systems, Inc. Rapidly cleanable electroplating cup assembly
JP5271554B2 (ja) * 2008-02-04 2013-08-21 東京応化工業株式会社 サポートプレート
US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
US10011917B2 (en) 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
US9512538B2 (en) 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
JP5237924B2 (ja) * 2008-12-10 2013-07-17 ノベルス・システムズ・インコーポレーテッド ベースプレート、及び電気メッキ装置
US7884016B2 (en) * 2009-02-12 2011-02-08 Asm International, N.V. Liner materials and related processes for 3-D integration
US8962085B2 (en) 2009-06-17 2015-02-24 Novellus Systems, Inc. Wetting pretreatment for enhanced damascene metal filling
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9138784B1 (en) 2009-12-18 2015-09-22 Novellus Systems, Inc. Deionized water conditioning system and methods
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
US9028666B2 (en) 2011-05-17 2015-05-12 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US9108291B2 (en) * 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
RU2489234C2 (ru) * 2011-10-19 2013-08-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Сибирский государственный аэрокосмический университет имени академика М.Ф. Решетнева" (СибГАУ) Способ размерной электрохимической обработки
TWI462797B (zh) * 2011-11-24 2014-12-01 Univ Nat Taiwan Science Tech Electric field assisted chemical mechanical polishing system and its method
JPWO2013118578A1 (ja) * 2012-02-10 2015-05-11 旭硝子株式会社 研磨パッド及び研磨装置
CN104272438B (zh) 2012-03-28 2018-01-12 诺发系统公司 用于清洁电镀衬底保持器的方法和装置
US9476139B2 (en) 2012-03-30 2016-10-25 Novellus Systems, Inc. Cleaning electroplating substrate holders using reverse current deplating
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
US9746427B2 (en) 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9435049B2 (en) 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating
US9844800B2 (en) * 2014-04-23 2017-12-19 Applied Materials, Inc. Systems, methods and apparatus for post-chemical mechanical planarization substrate cleaning
US9481942B2 (en) 2015-02-03 2016-11-01 Lam Research Corporation Geometry and process optimization for ultra-high RPM plating
GB2535805A (en) 2015-02-27 2016-08-31 Biomet Uk Healthcare Ltd Apparatus and method for selectively treating a surface of a component
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
US9816194B2 (en) * 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
JP6438868B2 (ja) * 2015-09-16 2018-12-19 東芝メモリ株式会社 半導体装置の製造方法および半導体製造装置
TWM522954U (zh) * 2015-12-03 2016-06-01 財團法人工業技術研究院 電沉積設備
CN109075054B (zh) * 2016-03-25 2023-06-09 应用材料公司 具有局部区域速率控制及振荡模式的研磨系统
CN109155249B (zh) * 2016-03-25 2023-06-23 应用材料公司 局部区域研磨系统以及用于研磨系统的研磨垫组件
US10155297B2 (en) * 2016-07-08 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing head
JP6966958B2 (ja) * 2018-03-01 2021-11-17 株式会社荏原製作所 めっき液を撹拌するために用いるパドルおよびパドルを備えるめっき装置
US11136688B1 (en) 2018-08-08 2021-10-05 University Of Louisville Research Foundation, Inc. Use of electropolishing for uniform surface treatment of metal components with complex external geometries
CN110257895B (zh) * 2019-06-24 2021-03-23 江苏守航实业有限公司 一种半导体材料的电解抛光方法及装置
US20210053179A1 (en) * 2019-08-23 2021-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Novel CMP Pad Design and Method of Using the Same
JP7098089B1 (ja) * 2022-02-07 2022-07-08 株式会社荏原製作所 めっき装置
JP7467782B1 (ja) 2023-09-25 2024-04-15 株式会社荏原製作所 めっき装置およびめっき液排出方法

Family Cites Families (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1758682A (en) * 1925-07-13 1930-05-13 Batenburg Pad for electroplating devices
US1739657A (en) * 1928-01-16 1929-12-17 Reuben B Shemitz Electroplating device
US2540602A (en) * 1946-07-03 1951-02-06 Lockheed Aircraft Corp Method and apparatus for the surface treatment of metals
US3448023A (en) * 1966-01-20 1969-06-03 Hammond Machinery Builders Inc Belt type electro-chemical (or electrolytic) grinding machine
US3328273A (en) 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3595089A (en) * 1969-09-23 1971-07-27 Frank J Jirik Rotary grain sampler device
DE2008664A1 (en) 1970-02-25 1971-09-09 Licentia Gmbh Galvanically or chemically assisted mechanic
US3779887A (en) * 1972-03-14 1973-12-18 Sifco Ind Inc Vibratory applicator for electroplating solutions
US3959089A (en) * 1972-07-31 1976-05-25 Watts John Dawson Surface finishing and plating method
CA1047654A (en) * 1974-10-17 1979-01-30 Norman Rain Electrodeposition on semiconductor material
IT1046971B (it) * 1975-03-11 1980-09-10 Oxy Metal Industries Corp Begno per l elettrodeposizione di rame e metodo per prepararlo
US4140598A (en) * 1976-06-03 1979-02-20 Hitachi Shipbuilding & Engineering Co., Ltd. Mirror finishing
GB2081742B (en) * 1980-07-17 1983-07-20 Rolls Royce Manufacture of articles having internal passages by electromachining
FR2510145B1 (fr) 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes
US4466864A (en) * 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US4610772A (en) * 1985-07-22 1986-09-09 The Carolinch Company Electrolytic plating apparatus
US4948474A (en) 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
DE3836521C2 (de) 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
US5024735A (en) * 1989-02-15 1991-06-18 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
US5084071A (en) 1989-03-07 1992-01-28 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US4954142A (en) 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US5256565A (en) 1989-05-08 1993-10-26 The United States Of America As Represented By The United States Department Of Energy Electrochemical planarization
US5252565A (en) 1990-04-02 1993-10-12 Merrell Dow Pharmaceuticals Inc. Haloethyl-substituted steroid enzyme inhibitors
US5081421A (en) * 1990-05-01 1992-01-14 At&T Bell Laboratories In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
US5171412A (en) * 1991-08-23 1992-12-15 Applied Materials, Inc. Material deposition method for integrated circuit manufacturing
JP3200468B2 (ja) * 1992-05-21 2001-08-20 日本エレクトロプレイテイング・エンジニヤース株式会社 ウエーハ用めっき装置
US5225034A (en) 1992-06-04 1993-07-06 Micron Technology, Inc. Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing
DE4324330C2 (de) * 1992-08-01 1994-11-17 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Behandeln von insbesondere flachem Behandlungsgut, sowie Anordnung, insbesondere zur Durchführung dieses Verfahrens
US5435772A (en) * 1993-04-30 1995-07-25 Motorola, Inc. Method of polishing a semiconductor substrate
JP3397501B2 (ja) 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
ATE186001T1 (de) * 1994-08-09 1999-11-15 Ontrak Systems Inc Linear poliergerät und wafer planarisierungsverfahren
US5567300A (en) * 1994-09-02 1996-10-22 Ibm Corporation Electrochemical metal removal technique for planarization of surfaces
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
JPH08195363A (ja) * 1994-10-11 1996-07-30 Ontrak Syst Inc 流体軸受を有する半導体ウェーハポリシング装置
US5486282A (en) * 1994-11-30 1996-01-23 Ibm Corporation Electroetching process for seed layer removal in electrochemical fabrication of wafers
US5516412A (en) 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
US5795215A (en) 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
US5681215A (en) 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
EP0751567B1 (en) 1995-06-27 2007-11-28 International Business Machines Corporation Copper alloys for chip interconnections and method of making
US5755859A (en) 1995-08-24 1998-05-26 International Business Machines Corporation Cobalt-tin alloys and their applications for devices, chip interconnections and packaging
CN1235271C (zh) * 1995-10-17 2006-01-04 佳能株式会社 生产半导体器件的工艺
US5762544A (en) 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5840629A (en) 1995-12-14 1998-11-24 Sematech, Inc. Copper chemical mechanical polishing slurry utilizing a chromate oxidant
RU2077611C1 (ru) * 1996-03-20 1997-04-20 Виталий Макарович Рябков Способ обработки поверхностей и устройство для его осуществления
US5858813A (en) 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
US5862605A (en) * 1996-05-24 1999-01-26 Ebara Corporation Vaporizer apparatus
JP3400650B2 (ja) 1996-06-28 2003-04-28 株式会社日立製作所 電気泳動分離検出方法及び装置
US5793272A (en) 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
US5773364A (en) 1996-10-21 1998-06-30 Motorola, Inc. Method for using ammonium salt slurries for chemical mechanical polishing (CMP)
US5954997A (en) 1996-12-09 1999-09-21 Cabot Corporation Chemical mechanical polishing slurry useful for copper substrates
JPH10166262A (ja) * 1996-12-10 1998-06-23 Nikon Corp 研磨装置
US5933753A (en) 1996-12-16 1999-08-03 International Business Machines Corporation Open-bottomed via liner structure and method for fabricating same
JP2000510289A (ja) 1996-12-16 2000-08-08 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 集積回路チップ上の電気めっき相互接続構造
US5807165A (en) 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US5930669A (en) 1997-04-03 1999-07-27 International Business Machines Corporation Continuous highly conductive metal wiring structures and method for fabricating the same
JP3462970B2 (ja) * 1997-04-28 2003-11-05 三菱電機株式会社 メッキ処理装置およびメッキ処理方法
US5922091A (en) 1997-05-16 1999-07-13 National Science Council Of Republic Of China Chemical mechanical polishing slurry for metallic thin film
US5985679A (en) * 1997-06-12 1999-11-16 Lsi Logic Corporation Automated endpoint detection system during chemical-mechanical polishing
US5833820A (en) * 1997-06-19 1998-11-10 Advanced Micro Devices, Inc. Electroplating apparatus
US5985123A (en) 1997-07-09 1999-11-16 Koon; Kam Kwan Continuous vertical plating system and method of plating
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
US6692338B1 (en) * 1997-07-23 2004-02-17 Lsi Logic Corporation Through-pad drainage of slurry during chemical mechanical polishing
US6074546A (en) * 1997-08-21 2000-06-13 Rodel Holdings, Inc. Method for photoelectrochemical polishing of silicon wafers
WO1999016936A1 (en) * 1997-09-30 1999-04-08 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US5897375A (en) 1997-10-20 1999-04-27 Motorola, Inc. Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture
US6027631A (en) 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6113462A (en) * 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Feedback loop for selective conditioning of chemical mechanical polishing pad
US6004880A (en) 1998-02-20 1999-12-21 Lsi Logic Corporation Method of single step damascene process for deposition and global planarization
JP2870537B1 (ja) * 1998-02-26 1999-03-17 日本電気株式会社 研磨装置及び該装置を用いる半導体装置の製造方法
US6071388A (en) 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6143155A (en) * 1998-06-11 2000-11-07 Speedfam Ipec Corp. Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6074544A (en) 1998-07-22 2000-06-13 Novellus Systems, Inc. Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
US6132587A (en) 1998-10-19 2000-10-17 Jorne; Jacob Uniform electroplating of wafers
US6709565B2 (en) * 1998-10-26 2004-03-23 Novellus Systems, Inc. Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6251235B1 (en) * 1999-03-30 2001-06-26 Nutool, Inc. Apparatus for forming an electrical contact with a semiconductor substrate
US6534116B2 (en) * 2000-08-10 2003-03-18 Nutool, Inc. Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
US6497800B1 (en) * 2000-03-17 2002-12-24 Nutool Inc. Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US6610190B2 (en) * 2000-11-03 2003-08-26 Nutool, Inc. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
US6902659B2 (en) * 1998-12-01 2005-06-07 Asm Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6103085A (en) 1998-12-04 2000-08-15 Advanced Micro Devices, Inc. Electroplating uniformity by diffuser design
US6353623B1 (en) 1999-01-04 2002-03-05 Uniphase Telecommunications Products, Inc. Temperature-corrected wavelength monitoring and control apparatus
JP2000208443A (ja) 1999-01-13 2000-07-28 Sony Corp 電子装置の製造方法および製造装置
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
US6136163A (en) 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
JP3422731B2 (ja) * 1999-07-23 2003-06-30 理化学研究所 Elidセンタレス研削装置
US6653226B1 (en) * 2001-01-09 2003-11-25 Novellus Systems, Inc. Method for electrochemical planarization of metal surfaces
US6341998B1 (en) * 1999-11-04 2002-01-29 Vlsi Technology, Inc. Integrated circuit (IC) plating deposition system and method
US6352623B1 (en) * 1999-12-17 2002-03-05 Nutool, Inc. Vertically configured chamber used for multiple processes
US6626740B2 (en) * 1999-12-23 2003-09-30 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
US6354916B1 (en) * 2000-02-11 2002-03-12 Nu Tool Inc. Modified plating solution for plating and planarization and process utilizing same
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6346479B1 (en) * 2000-06-14 2002-02-12 Advanced Micro Devices, Inc. Method of manufacturing a semiconductor device having copper interconnects
US6436267B1 (en) * 2000-08-29 2002-08-20 Applied Materials, Inc. Method for achieving copper fill of high aspect ratio interconnect features
US7153410B2 (en) * 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US7220166B2 (en) * 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US6936154B2 (en) * 2000-12-15 2005-08-30 Asm Nutool, Inc. Planarity detection methods and apparatus for electrochemical mechanical processing systems
US6696358B2 (en) * 2001-01-23 2004-02-24 Honeywell International Inc. Viscous protective overlayers for planarization of integrated circuits
US6482656B1 (en) * 2001-06-04 2002-11-19 Advanced Micro Devices, Inc. Method of electrochemical formation of high Tc superconducting damascene interconnect for integrated circuit
TW584899B (en) * 2001-07-20 2004-04-21 Nutool Inc Planar metal electroprocessing
US6833063B2 (en) * 2001-12-21 2004-12-21 Nutool, Inc. Electrochemical edge and bevel cleaning process and system

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CN1220798C (zh) 2005-09-28
TW593780B (en) 2004-06-21
EP1259661A4 (en) 2003-06-04
US20020130034A1 (en) 2002-09-19
US6413403B1 (en) 2002-07-02
WO2001063018A1 (en) 2001-08-30
US7378004B2 (en) 2008-05-27
KR20020091095A (ko) 2002-12-05
KR100755098B1 (ko) 2007-09-04
JP2003524079A (ja) 2003-08-12
EP1259661A1 (en) 2002-11-27
US6413388B1 (en) 2002-07-02
CN1434882A (zh) 2003-08-06

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