ATE552934T1 - Laserbearbeitung mit hilfe eines tensidfilms - Google Patents
Laserbearbeitung mit hilfe eines tensidfilmsInfo
- Publication number
- ATE552934T1 ATE552934T1 AT04739567T AT04739567T ATE552934T1 AT E552934 T1 ATE552934 T1 AT E552934T1 AT 04739567 T AT04739567 T AT 04739567T AT 04739567 T AT04739567 T AT 04739567T AT E552934 T1 ATE552934 T1 AT E552934T1
- Authority
- AT
- Austria
- Prior art keywords
- surfactant film
- laser processing
- debris
- laser
- surfactant
- Prior art date
Links
- 239000004094 surface-active agent Substances 0.000 title abstract 3
- 238000003754 machining Methods 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0313115A GB0313115D0 (en) | 2003-06-06 | 2003-06-06 | Laser machining using a protective coating |
GB0400677A GB2409998B (en) | 2004-01-13 | 2004-01-13 | Laser machining using a surfactant film |
PCT/EP2004/006001 WO2004110694A2 (en) | 2003-06-06 | 2004-06-03 | Laser machining using a surfactant film |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE552934T1 true ATE552934T1 (de) | 2012-04-15 |
Family
ID=33554138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04739567T ATE552934T1 (de) | 2003-06-06 | 2004-06-03 | Laserbearbeitung mit hilfe eines tensidfilms |
Country Status (8)
Country | Link |
---|---|
US (1) | US9242312B2 (de) |
EP (1) | EP1633521B1 (de) |
JP (2) | JP4961206B2 (de) |
KR (1) | KR101061863B1 (de) |
AT (1) | ATE552934T1 (de) |
MY (1) | MY139967A (de) |
TW (1) | TWI292183B (de) |
WO (1) | WO2004110694A2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4648056B2 (ja) * | 2005-03-31 | 2011-03-09 | 株式会社ディスコ | ウエーハのレーザー加工方法およびレーザー加工装置 |
JP4903523B2 (ja) * | 2006-09-25 | 2012-03-28 | 株式会社ディスコ | ウエーハのレーザー加工方法 |
JP4845834B2 (ja) * | 2007-08-21 | 2011-12-28 | 株式会社ネオス | ガラス加工時のガラス表面への切り屑付着防止方法 |
WO2010144778A2 (en) * | 2009-06-12 | 2010-12-16 | Applied Materials, Inc. | Methods and systems for laser-scribed line alignment |
US20130134133A1 (en) * | 2010-03-26 | 2013-05-30 | Mervyn Rudgley | Devices and methods for severing fastener heads |
WO2012060831A1 (en) * | 2010-11-03 | 2012-05-10 | Perfect Point Edm Corporation | Devices and methods for dissecting fastener head and sleeve buffer |
JP5881464B2 (ja) * | 2012-02-27 | 2016-03-09 | 株式会社ディスコ | ウェーハのレーザー加工方法 |
KR101909797B1 (ko) * | 2015-03-24 | 2018-10-18 | 아반스트레이트 가부시키가이샤 | 유리 기판의 제조 방법 |
KR102362654B1 (ko) | 2015-07-03 | 2022-02-15 | 삼성전자주식회사 | 오븐 |
JP6585422B2 (ja) * | 2015-08-24 | 2019-10-02 | 株式会社ディスコ | レーザー加工方法 |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS538634A (en) * | 1976-07-14 | 1978-01-26 | Nippon Electric Co | Coating liquid for laser scriber |
JPS5347270U (de) | 1976-09-24 | 1978-04-21 | ||
JPS5347270A (en) | 1976-10-12 | 1978-04-27 | Nec Home Electronics Ltd | Semiconductor waver protecting film |
JPS5747933Y2 (de) | 1976-11-15 | 1982-10-21 | ||
JPS554980A (en) * | 1978-06-27 | 1980-01-14 | Nec Home Electronics Ltd | Semicondutor device manufacturing method |
JPS58110190A (ja) * | 1981-12-23 | 1983-06-30 | Toshiba Corp | レ−ザ加工方法 |
JPS6041266A (ja) * | 1983-08-15 | 1985-03-04 | Semiconductor Energy Lab Co Ltd | 半導体装置作製方法およびその作製用装置 |
US4532403A (en) * | 1984-04-16 | 1985-07-30 | United Technologies Corporation | Weld spatter protective coating |
SU1636231A1 (ru) | 1988-07-21 | 1991-03-23 | Рославльский завод алмазного инструмента | Способ получени алмазных волок |
JP2680897B2 (ja) | 1989-07-31 | 1997-11-19 | 株式会社日平トヤマ | レーザ加工システム |
JP2748727B2 (ja) | 1991-06-28 | 1998-05-13 | 日本電気株式会社 | 搬送波同期回路 |
JPH05211381A (ja) * | 1991-11-12 | 1993-08-20 | Nec Corp | 混成集積回路の製造方法 |
JP2697447B2 (ja) * | 1992-01-17 | 1998-01-14 | 富士通株式会社 | レーザアブレーション加工方法と電子装置 |
JPH07106238A (ja) | 1993-09-29 | 1995-04-21 | Ricoh Co Ltd | 半導体装置の製造方法 |
JP2845738B2 (ja) | 1993-10-28 | 1999-01-13 | 大日本スクリーン製造株式会社 | 回転式基板処理装置の基板回転保持具 |
JPH07185875A (ja) | 1993-12-24 | 1995-07-25 | Nissin Electric Co Ltd | パルスレーザによる材料加工方法 |
JPH08132260A (ja) | 1994-10-31 | 1996-05-28 | Canon Inc | レーザ加工方法およびこれを用いた液体噴射記録ヘッドの製造方法 |
EP0731490A3 (de) | 1995-03-02 | 1998-03-11 | Ebara Corporation | Ultrafeines Mikroherstellungsverfahren unter Verwendung eines Energiebündel |
US5718615A (en) * | 1995-10-20 | 1998-02-17 | Boucher; John N. | Semiconductor wafer dicing method |
US5641416A (en) * | 1995-10-25 | 1997-06-24 | Micron Display Technology, Inc. | Method for particulate-free energy beam cutting of a wafer of die assemblies |
JP3404456B2 (ja) | 1997-12-26 | 2003-05-06 | シャープ株式会社 | 固体材料ダイシング方法 |
JP3012926B1 (ja) * | 1998-09-21 | 2000-02-28 | 工業技術院長 | 透明材料のレーザー微細加工法 |
US6379746B1 (en) * | 1999-02-02 | 2002-04-30 | Corning Incorporated | Method for temporarily protecting glass articles |
US6420245B1 (en) * | 1999-06-08 | 2002-07-16 | Kulicke & Soffa Investments, Inc. | Method for singulating semiconductor wafers |
US6344402B1 (en) * | 1999-07-28 | 2002-02-05 | Disco Corporation | Method of dicing workpiece |
US6287879B1 (en) * | 1999-08-11 | 2001-09-11 | Micron Technology, Inc. | Endpoint stabilization for polishing process |
US6468362B1 (en) * | 1999-08-25 | 2002-10-22 | Applied Materials, Inc. | Method and apparatus for cleaning/drying hydrophobic wafers |
JP2001118781A (ja) | 1999-10-20 | 2001-04-27 | United Microelectronics Corp | ビデオセンサ利用のレジストコーティング状況検査方法及び装置 |
JP4697823B2 (ja) | 2000-05-16 | 2011-06-08 | 株式会社ディスコ | 脆性基板の分割方法 |
JP3544343B2 (ja) | 2000-06-16 | 2004-07-21 | 松下電器産業株式会社 | 半導体集積回路の不良チップ除外装置 |
ATE323569T1 (de) | 2001-03-22 | 2006-05-15 | Xsil Technology Ltd | Ein laserbearbeitungssystem und -verfahren |
KR100676249B1 (ko) | 2001-05-23 | 2007-01-30 | 삼성전자주식회사 | 기판 절단용 냉매, 이를 이용한 기판 절단 방법 및 이를수행하기 위한 장치 |
US6797404B2 (en) * | 2001-09-07 | 2004-09-28 | Siemens Vdo Automotive Corporation | Anti-spatter coating for laser machining |
KR20040086725A (ko) * | 2002-02-25 | 2004-10-12 | 가부시기가이샤 디스코 | 반도체 웨이퍼의 분할 방법 |
JP2003285192A (ja) * | 2002-03-26 | 2003-10-07 | Kyocera Corp | セラミック基板へのレーザー加工方法 |
JP2004188475A (ja) * | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | レーザー加工方法 |
TWI248244B (en) * | 2003-02-19 | 2006-01-21 | J P Sercel Associates Inc | System and method for cutting using a variable astigmatic focal beam spot |
JP2004322168A (ja) * | 2003-04-25 | 2004-11-18 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP4471632B2 (ja) * | 2003-11-18 | 2010-06-02 | 株式会社ディスコ | ウエーハの加工方法 |
US6974726B2 (en) * | 2003-12-30 | 2005-12-13 | Intel Corporation | Silicon wafer with soluble protective coating |
JP2005324217A (ja) * | 2004-05-13 | 2005-11-24 | Yasuo Fukutani | 溶接スパッタ付着防止剤 |
JP4571850B2 (ja) | 2004-11-12 | 2010-10-27 | 東京応化工業株式会社 | レーザーダイシング用保護膜剤及び該保護膜剤を用いたウエーハの加工方法 |
JP5347270B2 (ja) | 2008-01-08 | 2013-11-20 | 富士通セミコンダクター株式会社 | 半導体装置及びその制御方法 |
JP5747933B2 (ja) | 2013-03-27 | 2015-07-15 | 株式会社三洋物産 | 遊技機 |
-
2004
- 2004-06-03 KR KR1020057023201A patent/KR101061863B1/ko active IP Right Grant
- 2004-06-03 JP JP2006508262A patent/JP4961206B2/ja not_active Expired - Fee Related
- 2004-06-03 US US10/559,442 patent/US9242312B2/en not_active Expired - Fee Related
- 2004-06-03 AT AT04739567T patent/ATE552934T1/de active
- 2004-06-03 EP EP04739567A patent/EP1633521B1/de not_active Expired - Lifetime
- 2004-06-03 WO PCT/EP2004/006001 patent/WO2004110694A2/en active Application Filing
- 2004-06-04 MY MYPI20042159A patent/MY139967A/en unknown
- 2004-06-04 TW TW93116148A patent/TWI292183B/zh not_active IP Right Cessation
-
2012
- 2012-01-19 JP JP2012009470A patent/JP5504292B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1633521A2 (de) | 2006-03-15 |
KR20060009023A (ko) | 2006-01-27 |
WO2004110694A3 (en) | 2005-04-21 |
TWI292183B (en) | 2008-01-01 |
EP1633521B1 (de) | 2012-04-11 |
JP2006527477A (ja) | 2006-11-30 |
TW200507096A (en) | 2005-02-16 |
JP2012110964A (ja) | 2012-06-14 |
JP5504292B2 (ja) | 2014-05-28 |
US9242312B2 (en) | 2016-01-26 |
WO2004110694A2 (en) | 2004-12-23 |
KR101061863B1 (ko) | 2011-09-02 |
US20070090099A1 (en) | 2007-04-26 |
JP4961206B2 (ja) | 2012-06-27 |
MY139967A (en) | 2009-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE493226T1 (de) | Verfahren zum schneiden eines bearbeiteten objekts | |
ATE556807T1 (de) | Laserverarbeitungsverfahren | |
ATE552934T1 (de) | Laserbearbeitung mit hilfe eines tensidfilms | |
DE502005007090D1 (de) | Laserbearbeitung eines werkstücks | |
SG125965A1 (en) | Laser beam processing method and laser beam processing machine | |
ATE553638T1 (de) | Verfahren zur herstellung durch laser werkstücke | |
TW200735197A (en) | Laser machining device | |
MY147331A (en) | A machining method using laser | |
TW200515966A (en) | Laser beam manufacturing method, laser beam manufacturing apparatus and work produced | |
ATE534142T1 (de) | Verfahren zum auftrennen eines substrats | |
EA200300390A1 (ru) | Способ осаждения тонких пленок посредством лазерной абляции | |
ATE361803T1 (de) | Schneideinsatz | |
ATE297281T1 (de) | Verfahren zum spanenden bearbeiten von bohrungsoberflächen | |
SE0402386L (sv) | Metod för höghastighetsbearbetning och belagt skärverktyg | |
EP1504842A4 (de) | Einen laserstrahl verwendende endbearbeitungsmaschine | |
ATE327857T1 (de) | Werkzeugmaschine mit palettenwechselmodul | |
EP1228836A3 (de) | Verfahren zur Herstellung einer Haltevorrichtung für dreidimensionale lineare Schneidbearbeitung | |
SE0301450L (sv) | Skärande verktyg för metallbearbetning samt metod vid tillverkning av skärande verktyg | |
TW200505614A (en) | Machining method and manufacturing method of semiconductor device | |
MX2007002935A (es) | Metodos y sistemas de micromaquinado con laser que usan un liquido como un medio de ayuda. | |
FR2423349A1 (fr) | Procede de reproduction d'un original sur une pierre dure | |
ATE233892T1 (de) | Entgrateverfahren | |
CN107116349A (zh) | 一种刀具生产方法 | |
BR0011327A (pt) | Torneamento duro | |
DE50204770D1 (de) | Verfahren zum abtragen einer äusseren schicht eines mauerwerkes und vorrichtung zum entfernen der äusseren schicht, insbesondere von fugenmörtel |