JPS5347270A - Semiconductor waver protecting film - Google Patents
Semiconductor waver protecting filmInfo
- Publication number
- JPS5347270A JPS5347270A JP12252376A JP12252376A JPS5347270A JP S5347270 A JPS5347270 A JP S5347270A JP 12252376 A JP12252376 A JP 12252376A JP 12252376 A JP12252376 A JP 12252376A JP S5347270 A JPS5347270 A JP S5347270A
- Authority
- JP
- Japan
- Prior art keywords
- protecting film
- semiconductor waver
- made possible
- waver
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Formation Of Insulating Films (AREA)
- Dicing (AREA)
Abstract
PURPOSE: Easy formation of a protecting film with a spinner, etc. is made possible and the formation of the thin layer free from pinholes is made possible by for forming the protecting film with a mixed solution of polyethylene glycol, a water soluble organic agent and polyethylene oxide.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12252376A JPS5347270A (en) | 1976-10-12 | 1976-10-12 | Semiconductor waver protecting film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12252376A JPS5347270A (en) | 1976-10-12 | 1976-10-12 | Semiconductor waver protecting film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5347270A true JPS5347270A (en) | 1978-04-27 |
JPS5638057B2 JPS5638057B2 (en) | 1981-09-03 |
Family
ID=14837949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12252376A Granted JPS5347270A (en) | 1976-10-12 | 1976-10-12 | Semiconductor waver protecting film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5347270A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57183033A (en) * | 1981-05-06 | 1982-11-11 | Toshiba Corp | Method for wafer exposure and device thereof |
DE102004020270B4 (en) * | 2003-04-25 | 2012-06-21 | Disco Corp. | Laser beam processing machine |
US9242312B2 (en) | 2003-06-06 | 2016-01-26 | Electro Scientific Industries, Inc. | Laser machining using a surfactant film |
US20160184934A1 (en) * | 2014-12-24 | 2016-06-30 | Disco Corporation | Laser processing method for plate-shaped workpiece |
JPWO2020100403A1 (en) * | 2018-11-15 | 2021-09-02 | 東京応化工業株式会社 | Protective film forming agent for plasma dicing and method for manufacturing semiconductor chips |
-
1976
- 1976-10-12 JP JP12252376A patent/JPS5347270A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57183033A (en) * | 1981-05-06 | 1982-11-11 | Toshiba Corp | Method for wafer exposure and device thereof |
JPS6211780B2 (en) * | 1981-05-06 | 1987-03-14 | Tokyo Shibaura Electric Co | |
DE102004020270B4 (en) * | 2003-04-25 | 2012-06-21 | Disco Corp. | Laser beam processing machine |
US9242312B2 (en) | 2003-06-06 | 2016-01-26 | Electro Scientific Industries, Inc. | Laser machining using a surfactant film |
US20160184934A1 (en) * | 2014-12-24 | 2016-06-30 | Disco Corporation | Laser processing method for plate-shaped workpiece |
US10537967B2 (en) * | 2014-12-24 | 2020-01-21 | Disco Corporation | Laser processing method for plate-shaped workpiece |
JPWO2020100403A1 (en) * | 2018-11-15 | 2021-09-02 | 東京応化工業株式会社 | Protective film forming agent for plasma dicing and method for manufacturing semiconductor chips |
Also Published As
Publication number | Publication date |
---|---|
JPS5638057B2 (en) | 1981-09-03 |
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