JPS5347270A - Semiconductor waver protecting film - Google Patents

Semiconductor waver protecting film

Info

Publication number
JPS5347270A
JPS5347270A JP12252376A JP12252376A JPS5347270A JP S5347270 A JPS5347270 A JP S5347270A JP 12252376 A JP12252376 A JP 12252376A JP 12252376 A JP12252376 A JP 12252376A JP S5347270 A JPS5347270 A JP S5347270A
Authority
JP
Japan
Prior art keywords
protecting film
semiconductor waver
made possible
waver
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12252376A
Other languages
Japanese (ja)
Other versions
JPS5638057B2 (en
Inventor
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP12252376A priority Critical patent/JPS5347270A/en
Publication of JPS5347270A publication Critical patent/JPS5347270A/en
Publication of JPS5638057B2 publication Critical patent/JPS5638057B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Formation Of Insulating Films (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: Easy formation of a protecting film with a spinner, etc. is made possible and the formation of the thin layer free from pinholes is made possible by for forming the protecting film with a mixed solution of polyethylene glycol, a water soluble organic agent and polyethylene oxide.
COPYRIGHT: (C)1978,JPO&Japio
JP12252376A 1976-10-12 1976-10-12 Semiconductor waver protecting film Granted JPS5347270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12252376A JPS5347270A (en) 1976-10-12 1976-10-12 Semiconductor waver protecting film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12252376A JPS5347270A (en) 1976-10-12 1976-10-12 Semiconductor waver protecting film

Publications (2)

Publication Number Publication Date
JPS5347270A true JPS5347270A (en) 1978-04-27
JPS5638057B2 JPS5638057B2 (en) 1981-09-03

Family

ID=14837949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12252376A Granted JPS5347270A (en) 1976-10-12 1976-10-12 Semiconductor waver protecting film

Country Status (1)

Country Link
JP (1) JPS5347270A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183033A (en) * 1981-05-06 1982-11-11 Toshiba Corp Method for wafer exposure and device thereof
DE102004020270B4 (en) * 2003-04-25 2012-06-21 Disco Corp. Laser beam processing machine
US9242312B2 (en) 2003-06-06 2016-01-26 Electro Scientific Industries, Inc. Laser machining using a surfactant film
US20160184934A1 (en) * 2014-12-24 2016-06-30 Disco Corporation Laser processing method for plate-shaped workpiece
JPWO2020100403A1 (en) * 2018-11-15 2021-09-02 東京応化工業株式会社 Protective film forming agent for plasma dicing and method for manufacturing semiconductor chips

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183033A (en) * 1981-05-06 1982-11-11 Toshiba Corp Method for wafer exposure and device thereof
JPS6211780B2 (en) * 1981-05-06 1987-03-14 Tokyo Shibaura Electric Co
DE102004020270B4 (en) * 2003-04-25 2012-06-21 Disco Corp. Laser beam processing machine
US9242312B2 (en) 2003-06-06 2016-01-26 Electro Scientific Industries, Inc. Laser machining using a surfactant film
US20160184934A1 (en) * 2014-12-24 2016-06-30 Disco Corporation Laser processing method for plate-shaped workpiece
US10537967B2 (en) * 2014-12-24 2020-01-21 Disco Corporation Laser processing method for plate-shaped workpiece
JPWO2020100403A1 (en) * 2018-11-15 2021-09-02 東京応化工業株式会社 Protective film forming agent for plasma dicing and method for manufacturing semiconductor chips

Also Published As

Publication number Publication date
JPS5638057B2 (en) 1981-09-03

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