ATE540336T1 - Zusammensetzung zur bildung eines oberschichtfilms und verfahren zur bildung einer fotoresiststruktur - Google Patents
Zusammensetzung zur bildung eines oberschichtfilms und verfahren zur bildung einer fotoresiststrukturInfo
- Publication number
- ATE540336T1 ATE540336T1 AT07829596T AT07829596T ATE540336T1 AT E540336 T1 ATE540336 T1 AT E540336T1 AT 07829596 T AT07829596 T AT 07829596T AT 07829596 T AT07829596 T AT 07829596T AT E540336 T1 ATE540336 T1 AT E540336T1
- Authority
- AT
- Austria
- Prior art keywords
- forming
- layer film
- composition
- general formula
- repeating unit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006279490 | 2006-10-13 | ||
JP2007023574 | 2007-02-01 | ||
PCT/JP2007/069858 WO2008047678A1 (fr) | 2006-10-13 | 2007-10-11 | Composition pour la formation d'un film de couche supérieure et procédé de formation d'un motif en photorésine |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE540336T1 true ATE540336T1 (de) | 2012-01-15 |
Family
ID=39313916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07829596T ATE540336T1 (de) | 2006-10-13 | 2007-10-11 | Zusammensetzung zur bildung eines oberschichtfilms und verfahren zur bildung einer fotoresiststruktur |
Country Status (7)
Country | Link |
---|---|
US (1) | US8895229B2 (de) |
EP (1) | EP2078983B1 (de) |
JP (1) | JP5088326B2 (de) |
KR (2) | KR101121380B1 (de) |
AT (1) | ATE540336T1 (de) |
TW (1) | TWI412892B (de) |
WO (1) | WO2008047678A1 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
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JPWO2008133311A1 (ja) * | 2007-04-25 | 2010-07-29 | 旭硝子株式会社 | イマージョンリソグラフィー用レジスト保護膜組成物 |
KR101433565B1 (ko) | 2007-09-26 | 2014-08-27 | 제이에스알 가부시끼가이샤 | 액침용 상층막 형성용 조성물 및 액침용 상층막 및 포토레지스트 패턴 형성 방법 |
JP5010569B2 (ja) * | 2008-01-31 | 2012-08-29 | 信越化学工業株式会社 | レジスト保護膜材料及びパターン形成方法 |
JP2010039148A (ja) * | 2008-08-05 | 2010-02-18 | Jsr Corp | 液浸上層膜形成用組成物の製造方法 |
JP5245700B2 (ja) * | 2008-08-25 | 2013-07-24 | Jsr株式会社 | 上層膜形成組成物及び上層膜 |
JP5228792B2 (ja) * | 2008-10-23 | 2013-07-03 | Jsr株式会社 | 上層反射防止膜形成用組成物及び上層反射防止膜 |
EP2204694A1 (de) | 2008-12-31 | 2010-07-07 | Rohm and Haas Electronic Materials LLC | Zusammensetzungen und Verfahren für Fotolithografie |
EP2204392A1 (de) | 2008-12-31 | 2010-07-07 | Rohm and Haas Electronic Materials LLC | Zusammensetzungen und Verfahren für Fotolithografie |
WO2011030737A1 (ja) | 2009-09-11 | 2011-03-17 | Jsr株式会社 | 感放射線性組成物及び新規化合物 |
US8691526B2 (en) | 2010-01-20 | 2014-04-08 | Xyleco, Inc. | Processing materials |
WO2011093280A1 (ja) | 2010-01-29 | 2011-08-04 | Jsr株式会社 | 感放射線性樹脂組成物 |
KR20130086139A (ko) * | 2010-05-18 | 2013-07-31 | 제이에스알 가부시끼가이샤 | 액침 상층막 형성용 조성물 및 포토레지스트 패턴 형성 방법 |
WO2012033145A1 (ja) | 2010-09-09 | 2012-03-15 | Jsr株式会社 | 感放射線性樹脂組成物 |
TW201224664A (en) | 2010-09-29 | 2012-06-16 | Jsr Corp | Composition for forming liquid immersion upper layer film, and polymer |
WO2012070548A1 (ja) | 2010-11-26 | 2012-05-31 | Jsr株式会社 | 感放射線性組成物及び化合物 |
JP5729392B2 (ja) | 2010-12-02 | 2015-06-03 | Jsr株式会社 | 感放射線性樹脂組成物及び感放射線性酸発生剤 |
WO2012096264A1 (ja) | 2011-01-11 | 2012-07-19 | Jsr株式会社 | 感放射線性樹脂組成物及び感放射線性酸発生剤 |
US9122159B2 (en) * | 2011-04-14 | 2015-09-01 | Rohm And Haas Electronic Materials Llc | Compositions and processes for photolithography |
JP6141620B2 (ja) | 2011-11-07 | 2017-06-07 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 上塗り組成物およびフォトリソグラフィ方法 |
WO2013069750A1 (ja) | 2011-11-11 | 2013-05-16 | Jsr株式会社 | レジスト上層膜形成用組成物、レジストパターン形成方法、化合物、化合物の製造方法及び重合体 |
US9259668B2 (en) | 2012-02-17 | 2016-02-16 | Jsr Corporation | Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate |
US20130213894A1 (en) | 2012-02-17 | 2013-08-22 | Jsr Corporation | Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate |
JP5910445B2 (ja) | 2012-09-28 | 2016-04-27 | Jsr株式会社 | 液浸上層膜形成用組成物及びレジストパターン形成方法 |
WO2014132100A1 (en) * | 2013-03-01 | 2014-09-04 | Mater Medical Research Institute Limited | Mobilizing agents and uses therefor |
JP6540293B2 (ja) | 2014-07-10 | 2019-07-10 | Jsr株式会社 | レジストパターン微細化組成物及び微細パターン形成方法 |
CN110716269B (zh) * | 2019-09-20 | 2021-10-29 | 武汉电信器件有限公司 | 一种可采用液体浸没式制冷的光模块及其制作方法 |
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US4471955A (en) | 1983-06-15 | 1984-09-18 | Paper Converting Machine Company | Method and apparatus for developing and handling stacks of web material |
JPS61103912A (ja) | 1984-10-25 | 1986-05-22 | Nitto Electric Ind Co Ltd | 樹脂水性エマルジヨン |
DE69323812T2 (de) | 1992-08-14 | 1999-08-26 | Japan Synthetic Rubber Co Ltd | Reflexionsverhindernder Film und Verfahren zur Herstellung von Resistmustern |
JPH10120968A (ja) | 1996-08-28 | 1998-05-12 | Hitachi Chem Co Ltd | レジスト保護膜用樹脂組成物、レジスト保護膜及びこれを用いたパターン製造法 |
JPH10341396A (ja) * | 1997-04-09 | 1998-12-22 | Seiko Epson Corp | デジタルカメラの機能付加方法およびデジタルカメラ |
JPH11176727A (ja) | 1997-12-11 | 1999-07-02 | Nikon Corp | 投影露光装置 |
US7038328B2 (en) | 2002-10-15 | 2006-05-02 | Brewer Science Inc. | Anti-reflective compositions comprising triazine compounds |
JP5301070B2 (ja) | 2004-02-16 | 2013-09-25 | 東京応化工業株式会社 | 液浸露光プロセス用レジスト保護膜形成用材料、および該保護膜を用いたレジストパターン形成方法 |
JP4355944B2 (ja) | 2004-04-16 | 2009-11-04 | 信越化学工業株式会社 | パターン形成方法及びこれに用いるレジスト上層膜材料 |
KR100960838B1 (ko) | 2004-04-27 | 2010-06-07 | 도오꾜오까고오교 가부시끼가이샤 | 액침 노광 프로세스용 레지스트 보호막 형성용 재료, 및 이보호막을 이용한 레지스트 패턴 형성 방법 |
JP2005351983A (ja) * | 2004-06-08 | 2005-12-22 | Jsr Corp | 塩基遮断性反射防止膜形成用組成物およびレジストパターンの形成方法 |
JP2006047351A (ja) | 2004-07-30 | 2006-02-16 | Asahi Glass Co Ltd | フォトレジスト保護膜用組成物、フォトレジスト保護膜およびフォトレジストパターン形成方法 |
JP4368266B2 (ja) | 2004-07-30 | 2009-11-18 | 東京応化工業株式会社 | レジスト保護膜形成用材料、およびこれを用いたレジストパターン形成方法 |
WO2006035790A1 (ja) | 2004-09-30 | 2006-04-06 | Jsr Corporation | 共重合体および上層膜形成組成物 |
KR100966197B1 (ko) | 2004-12-03 | 2010-06-25 | 제이에스알 가부시끼가이샤 | 반사 방지막 형성용 조성물, 적층체 및 레지스트 패턴의형성 방법 |
JP4742685B2 (ja) | 2005-06-03 | 2011-08-10 | Jsr株式会社 | 液浸上層膜用重合体および液浸用上層膜形成組成物 |
JP2006343492A (ja) * | 2005-06-08 | 2006-12-21 | Fujifilm Holdings Corp | 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法 |
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US8945808B2 (en) * | 2006-04-28 | 2015-02-03 | International Business Machines Corporation | Self-topcoating resist for photolithography |
US20080311530A1 (en) * | 2007-06-15 | 2008-12-18 | Allen Robert D | Graded topcoat materials for immersion lithography |
-
2007
- 2007-10-11 AT AT07829596T patent/ATE540336T1/de active
- 2007-10-11 JP JP2008539773A patent/JP5088326B2/ja active Active
- 2007-10-11 KR KR1020097008996A patent/KR101121380B1/ko active IP Right Grant
- 2007-10-11 WO PCT/JP2007/069858 patent/WO2008047678A1/ja active Application Filing
- 2007-10-11 US US12/445,152 patent/US8895229B2/en active Active
- 2007-10-11 EP EP07829596A patent/EP2078983B1/de active Active
- 2007-10-11 KR KR1020117029036A patent/KR101365275B1/ko active IP Right Grant
- 2007-10-12 TW TW096138264A patent/TWI412892B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20090079223A (ko) | 2009-07-21 |
US20100021852A1 (en) | 2010-01-28 |
EP2078983B1 (de) | 2012-01-04 |
JP5088326B2 (ja) | 2012-12-05 |
EP2078983A1 (de) | 2009-07-15 |
TWI412892B (zh) | 2013-10-21 |
WO2008047678A1 (fr) | 2008-04-24 |
EP2078983A4 (de) | 2010-08-25 |
KR101121380B1 (ko) | 2012-03-09 |
KR101365275B1 (ko) | 2014-02-26 |
KR20120006566A (ko) | 2012-01-18 |
JPWO2008047678A1 (ja) | 2010-02-25 |
TW200832069A (en) | 2008-08-01 |
US8895229B2 (en) | 2014-11-25 |
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