ATE539135T1 - PHOSPHORUS COMPOSITION AND LIGHT EMITTING DEVICE THEREFROM - Google Patents

PHOSPHORUS COMPOSITION AND LIGHT EMITTING DEVICE THEREFROM

Info

Publication number
ATE539135T1
ATE539135T1 AT09007211T AT09007211T ATE539135T1 AT E539135 T1 ATE539135 T1 AT E539135T1 AT 09007211 T AT09007211 T AT 09007211T AT 09007211 T AT09007211 T AT 09007211T AT E539135 T1 ATE539135 T1 AT E539135T1
Authority
AT
Austria
Prior art keywords
light
emitting device
phosphor
luminous element
red phosphor
Prior art date
Application number
AT09007211T
Other languages
German (de)
Inventor
Shozo Oshio
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39697774&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE539135(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP2004250739A external-priority patent/JP2005336450A/en
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE539135T1 publication Critical patent/ATE539135T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device which emits a high luminous flux of high color rendering properties, especially, a light-emitting device which emits warm white light.SOLUTION: The light-emitting device includes a luminous element and a phosphor layer. The luminous element is a blue luminous element that emits light which has the luminescence peak in a wavelength region of 440 nm or more and less than 500 nm. The phosphor layer includes: a green phosphor which contains Euor Ceas the emission major ions; and a red phosphor of a nitride or an oxynitride containing Euas the emission major ions. The green phosphor and the red phosphor emit light by being excited by the light emitted by the blue luminous element. The light-emitting device outputs light which includes light components emitted from the green phosphor, the red phosphor and the blue luminous element. The green phosphor has the excitation peak at the shorter wavelength side than the excitation wavelength which is the peak of the light emitted by the blue luminous element. The red phosphor is a nitride-aluminosilicate-based red phosphor.
AT09007211T 2004-04-27 2005-04-26 PHOSPHORUS COMPOSITION AND LIGHT EMITTING DEVICE THEREFROM ATE539135T1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004131770 2004-04-27
JP2004182797 2004-06-21
JP2004194196 2004-06-30
JP2004250739A JP2005336450A (en) 2004-04-27 2004-08-30 Phosphor composition, method for producing the same and light-emitting device using the same phosphor composition
JP2004363534A JP4128564B2 (en) 2004-04-27 2004-12-15 Light emitting device

Publications (1)

Publication Number Publication Date
ATE539135T1 true ATE539135T1 (en) 2012-01-15

Family

ID=39697774

Family Applications (2)

Application Number Title Priority Date Filing Date
AT08010928T ATE546506T1 (en) 2004-04-27 2005-04-26 LIGHT EMITTING DEVICE
AT09007211T ATE539135T1 (en) 2004-04-27 2005-04-26 PHOSPHORUS COMPOSITION AND LIGHT EMITTING DEVICE THEREFROM

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT08010928T ATE546506T1 (en) 2004-04-27 2005-04-26 LIGHT EMITTING DEVICE

Country Status (4)

Country Link
JP (8) JP4128564B2 (en)
KR (1) KR20110016506A (en)
AT (2) ATE546506T1 (en)
TW (2) TW200611963A (en)

Families Citing this family (136)

* Cited by examiner, † Cited by third party
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