ATE537232T1 - Cmp-zusammensetzung für verbesserte oxidentfernungsgeschwindigkeit - Google Patents

Cmp-zusammensetzung für verbesserte oxidentfernungsgeschwindigkeit

Info

Publication number
ATE537232T1
ATE537232T1 AT05760474T AT05760474T ATE537232T1 AT E537232 T1 ATE537232 T1 AT E537232T1 AT 05760474 T AT05760474 T AT 05760474T AT 05760474 T AT05760474 T AT 05760474T AT E537232 T1 ATE537232 T1 AT E537232T1
Authority
AT
Austria
Prior art keywords
removal rate
oxide removal
cmp composition
improved oxide
improved
Prior art date
Application number
AT05760474T
Other languages
German (de)
English (en)
Inventor
Phillip Carter
Robert Vacassy
Original Assignee
Cabot Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics filed Critical Cabot Microelectronics
Application granted granted Critical
Publication of ATE537232T1 publication Critical patent/ATE537232T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Detergent Compositions (AREA)
AT05760474T 2004-06-18 2005-06-10 Cmp-zusammensetzung für verbesserte oxidentfernungsgeschwindigkeit ATE537232T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/871,774 US20050279733A1 (en) 2004-06-18 2004-06-18 CMP composition for improved oxide removal rate
PCT/US2005/020614 WO2006009640A1 (en) 2004-06-18 2005-06-10 Cmp composition for improved oxide removal rate

Publications (1)

Publication Number Publication Date
ATE537232T1 true ATE537232T1 (de) 2011-12-15

Family

ID=34972454

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05760474T ATE537232T1 (de) 2004-06-18 2005-06-10 Cmp-zusammensetzung für verbesserte oxidentfernungsgeschwindigkeit

Country Status (8)

Country Link
US (2) US20050279733A1 (enExample)
EP (1) EP1797151B1 (enExample)
JP (2) JP4938654B2 (enExample)
CN (1) CN101379154B (enExample)
AT (1) ATE537232T1 (enExample)
IL (1) IL179570A (enExample)
TW (1) TWI313031B (enExample)
WO (1) WO2006009640A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8038752B2 (en) * 2004-10-27 2011-10-18 Cabot Microelectronics Corporation Metal ion-containing CMP composition and method for using the same
US7531105B2 (en) * 2004-11-05 2009-05-12 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
US7803203B2 (en) * 2005-09-26 2010-09-28 Cabot Microelectronics Corporation Compositions and methods for CMP of semiconductor materials
CN102827549B (zh) * 2012-09-04 2014-05-07 上海新安纳电子科技有限公司 一种氧化硅介电材料用化学机械抛光液
JP6422325B2 (ja) * 2014-12-15 2018-11-14 花王株式会社 半導体基板用研磨液組成物
EP3344716A4 (en) * 2015-09-03 2019-04-10 Cabot Microelectronics Corporation METHODS AND COMPOSITIONS FOR TREATING DIELECTRIC SUBSTRATE
JP6551136B2 (ja) * 2015-10-14 2019-07-31 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
CN109155246B (zh) * 2016-04-22 2024-01-05 日挥触媒化成株式会社 二氧化硅系复合微粒分散液及其制造方法
US10584266B2 (en) * 2018-03-14 2020-03-10 Cabot Microelectronics Corporation CMP compositions containing polymer complexes and agents for STI applications
CN110922896A (zh) * 2019-11-18 2020-03-27 宁波日晟新材料有限公司 一种高效环保碳化硅抛光液及其制备方法和应用
CN117070148A (zh) * 2023-08-21 2023-11-17 河北工业大学 基于乙酸-乙酸铵缓冲液体系的高稳定性二氧化铈抛光液

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US5759917A (en) * 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
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US6350393B2 (en) * 1999-11-04 2002-02-26 Cabot Microelectronics Corporation Use of CsOH in a dielectric CMP slurry
JP3956587B2 (ja) * 1999-11-18 2007-08-08 Ｈｏｙａ株式会社 磁気ディスク用ガラス基板の洗浄方法
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US6812193B2 (en) * 2001-08-31 2004-11-02 International Business Machines Corporation Slurry for mechanical polishing (CMP) of metals and use thereof
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KR100474537B1 (ko) * 2002-07-16 2005-03-10 주식회사 하이닉스반도체 산화막용 ｃｍｐ 슬러리 조성물 및 이를 이용한 반도체소자의 제조 방법
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Also Published As

Publication number Publication date
TWI313031B (en) 2009-08-01
TW200605211A (en) 2006-02-01
CN101379154A (zh) 2009-03-04
IL179570A (en) 2013-02-28
US20090191710A1 (en) 2009-07-30
IL179570A0 (en) 2007-05-15
EP1797151B1 (en) 2011-12-14
JP4938654B2 (ja) 2012-05-23
JP2008503874A (ja) 2008-02-07
WO2006009640A1 (en) 2006-01-26
US20050279733A1 (en) 2005-12-22
EP1797151A1 (en) 2007-06-20
JP2012074736A (ja) 2012-04-12
CN101379154B (zh) 2011-07-13
JP5264985B2 (ja) 2013-08-14

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