ATE532836T1 - Druckempfindliche haftklebefolie für die laserverarbeitung und verfahren zur laserverarbeitung - Google Patents

Druckempfindliche haftklebefolie für die laserverarbeitung und verfahren zur laserverarbeitung

Info

Publication number
ATE532836T1
ATE532836T1 AT09171810T AT09171810T ATE532836T1 AT E532836 T1 ATE532836 T1 AT E532836T1 AT 09171810 T AT09171810 T AT 09171810T AT 09171810 T AT09171810 T AT 09171810T AT E532836 T1 ATE532836 T1 AT E532836T1
Authority
AT
Austria
Prior art keywords
pressure
sensitive adhesive
laser processing
light
wavelength
Prior art date
Application number
AT09171810T
Other languages
English (en)
Inventor
Fumiteru Asai
Tomokazu Takahashi
Keiko Maekawa
Kazuhiro Aoyagi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE532836T1 publication Critical patent/ATE532836T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
AT09171810T 2008-10-01 2009-09-30 Druckempfindliche haftklebefolie für die laserverarbeitung und verfahren zur laserverarbeitung ATE532836T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008255896A JP5537789B2 (ja) 2008-10-01 2008-10-01 レーザー加工用粘着シート及びレーザー加工方法

Publications (1)

Publication Number Publication Date
ATE532836T1 true ATE532836T1 (de) 2011-11-15

Family

ID=41491556

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09171810T ATE532836T1 (de) 2008-10-01 2009-09-30 Druckempfindliche haftklebefolie für die laserverarbeitung und verfahren zur laserverarbeitung

Country Status (7)

Country Link
US (1) US20100080989A1 (de)
EP (1) EP2172526B1 (de)
JP (1) JP5537789B2 (de)
KR (1) KR101259224B1 (de)
CN (1) CN101712852B (de)
AT (1) ATE532836T1 (de)
TW (1) TWI448344B (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD628170S1 (en) * 2008-07-16 2010-11-30 The Furukawa Electric Company Semiconductor wafer processing tape
JP2011146552A (ja) * 2010-01-15 2011-07-28 Toshiba Corp 半導体装置の製造方法及び半導体装置
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD804435S1 (en) 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD656909S1 (en) 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
US20130260140A1 (en) * 2010-12-06 2013-10-03 Kimoto Co., Ltd. Auxiliary sheet for laser dicing
JP5761596B2 (ja) * 2011-03-30 2015-08-12 住友ベークライト株式会社 半導体ウエハ加工用粘着テープ
JP5990910B2 (ja) * 2012-01-11 2016-09-14 住友ベークライト株式会社 半導体ウエハ等加工用粘着テープ
JP2013021105A (ja) * 2011-07-11 2013-01-31 Nitto Denko Corp ダイシング用粘着シート、及び、ダイシング用粘着シートを用いた半導体装置の製造方法
EP2810539B1 (de) * 2012-02-03 2018-03-28 Avery Dennison Corporation Laserstrukturierung von fotovoltaischen rückseitenfolien
CA2892893C (en) * 2012-11-30 2020-03-24 H. David Dean Absorbant and reflecting biocompatible dyes for highly accurate medical implants
KR101600654B1 (ko) * 2012-12-28 2016-03-07 제일모직주식회사 편광판용 점착 필름, 이를 위한 점착제 조성물, 이를 포함하는 편광판 및 이를 포함하는 광학표시장치
JP6609473B2 (ja) * 2013-03-11 2019-11-20 リンテック株式会社 粘着シートおよび加工されたデバイス関連部材の製造方法
CN103170751A (zh) * 2013-04-18 2013-06-26 苏州光韵达光电科技有限公司 一种光纤激光切割陶瓷的方法
JP6331312B2 (ja) * 2013-09-30 2018-05-30 大日本印刷株式会社 蒸着マスクの製造方法、及び蒸着マスク準備体
WO2015072259A1 (ja) * 2013-11-14 2015-05-21 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
US20150143849A1 (en) * 2013-11-26 2015-05-28 Corning Incorporated Method and system of laser cutting a sheet material
WO2016007695A1 (en) * 2014-07-09 2016-01-14 Corning Incorporated Methods for separating a glass sheet
CN105489472B (zh) * 2014-09-16 2019-03-15 长春石油化学股份有限公司 前切割保护液及使用此保护液的晶片加工方法
US20180370205A1 (en) * 2015-12-30 2018-12-27 3M Innovative Properties Company Infrared absorbing adhesive films and related methods
JP6088701B1 (ja) * 2016-10-06 2017-03-01 株式会社きもと レーザーダイシング用補助シート
CN108235574A (zh) * 2016-12-15 2018-06-29 吴勇杰 电路板及其制作方法
JP6718174B2 (ja) * 2017-07-03 2020-07-08 日化精工株式会社 レーザー加工用保護膜剤
TWI826418B (zh) * 2018-02-01 2023-12-21 日商力森諾科股份有限公司 構件連接方法
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
US20240002701A1 (en) * 2020-01-30 2024-01-04 Nitto Denko Corporation Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet
JP7509571B2 (ja) * 2020-05-01 2024-07-02 日東電工株式会社 粘着シート
JP7584906B2 (ja) * 2020-05-01 2024-11-18 日東電工株式会社 粘着シート
JP1685752S (de) * 2020-11-02 2021-05-24
USD962883S1 (en) 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
WO2022097471A1 (ja) * 2020-11-09 2022-05-12 デンカ株式会社 粘着テープ及び加工方法
CN116457206A (zh) * 2021-03-26 2023-07-18 琳得科株式会社 工件处理片及器件制造方法
KR102992401B1 (ko) * 2022-01-26 2026-07-21 주식회사 엘지화학 반도체 공정용 점착 조성물, 이를 포함하는 반도체 공정용 필름 및 이를 이용한 반도체 패키지 제조 방법

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Publication number Priority date Publication date Assignee Title
US6602599B1 (en) 1999-06-10 2003-08-05 Nitto Denko Corporation Low-staining adhesive sheets and method for removing resist material
JP4354066B2 (ja) 2000-01-28 2009-10-28 リンテック株式会社 剥離シート及びその製造方法
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
JP4886937B2 (ja) 2001-05-17 2012-02-29 リンテック株式会社 ダイシングシート及びダイシング方法
US7005031B2 (en) * 2002-01-16 2006-02-28 3M Innovative Properties Company Pressure sensitive adhesives having quaternary ammonium functionality, articles, and methods
JP4676711B2 (ja) * 2004-03-29 2011-04-27 日東電工株式会社 レーザー加工品の製造方法、およびそれに用いるレーザー加工用粘着シート
US20060246279A1 (en) * 2003-04-25 2006-11-02 Masakatsu Urairi Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
JP4767144B2 (ja) * 2006-10-04 2011-09-07 日東電工株式会社 レーザ加工用粘着シート
JP4493643B2 (ja) * 2006-12-06 2010-06-30 日東電工株式会社 再剥離型粘着剤組成物、及び粘着テープ又はシート
JP2008163276A (ja) 2007-01-05 2008-07-17 Nitto Denko Corp 半導体基板加工用粘着シート
JP2009297734A (ja) 2008-06-11 2009-12-24 Nitto Denko Corp レーザー加工用粘着シート及びレーザー加工方法

Also Published As

Publication number Publication date
KR101259224B1 (ko) 2013-04-29
CN101712852B (zh) 2013-11-06
JP5537789B2 (ja) 2014-07-02
TW201021953A (en) 2010-06-16
EP2172526A1 (de) 2010-04-07
EP2172526B1 (de) 2011-11-09
CN101712852A (zh) 2010-05-26
KR20100037570A (ko) 2010-04-09
TWI448344B (zh) 2014-08-11
JP2010084047A (ja) 2010-04-15
US20100080989A1 (en) 2010-04-01

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