ATE528256T1 - Verfahren zur gemeinsamen herstellung von membranen und hohlräumen mit kleinem volumen und grosser masshaltigkeit - Google Patents

Verfahren zur gemeinsamen herstellung von membranen und hohlräumen mit kleinem volumen und grosser masshaltigkeit

Info

Publication number
ATE528256T1
ATE528256T1 AT07728561T AT07728561T ATE528256T1 AT E528256 T1 ATE528256 T1 AT E528256T1 AT 07728561 T AT07728561 T AT 07728561T AT 07728561 T AT07728561 T AT 07728561T AT E528256 T1 ATE528256 T1 AT E528256T1
Authority
AT
Austria
Prior art keywords
membranes
cavities
small volume
high dimensional
joint production
Prior art date
Application number
AT07728561T
Other languages
English (en)
Inventor
Joel Collet
Stephane Nicolas
Christian Pisella
Original Assignee
Tronic S Microsystems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tronic S Microsystems filed Critical Tronic S Microsystems
Application granted granted Critical
Publication of ATE528256T1 publication Critical patent/ATE528256T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/0015—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F04B43/046—Micropumps with piezoelectric drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/054—Microvalves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Micromachines (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Valve Housings (AREA)
  • Reciprocating Pumps (AREA)
  • Element Separation (AREA)
  • Recrystallisation Techniques (AREA)
AT07728561T 2006-04-28 2007-04-26 Verfahren zur gemeinsamen herstellung von membranen und hohlräumen mit kleinem volumen und grosser masshaltigkeit ATE528256T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0651511A FR2900400B1 (fr) 2006-04-28 2006-04-28 Procede collectif de fabrication de membranes et de cavites de faible volume et de haute precision
US83881406P 2006-08-17 2006-08-17
PCT/EP2007/054106 WO2007128705A1 (en) 2006-04-28 2007-04-26 Process for collective manufacturing of small volume high precision membranes and cavities

Publications (1)

Publication Number Publication Date
ATE528256T1 true ATE528256T1 (de) 2011-10-15

Family

ID=37507609

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07728561T ATE528256T1 (de) 2006-04-28 2007-04-26 Verfahren zur gemeinsamen herstellung von membranen und hohlräumen mit kleinem volumen und grosser masshaltigkeit

Country Status (9)

Country Link
US (1) US7838393B2 (de)
EP (1) EP2013137B1 (de)
JP (1) JP5112420B2 (de)
KR (1) KR101424748B1 (de)
CN (1) CN101432223B (de)
AT (1) ATE528256T1 (de)
DK (1) DK2013137T3 (de)
FR (1) FR2900400B1 (de)
WO (1) WO2007128705A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2952628A1 (fr) * 2009-11-13 2011-05-20 Commissariat Energie Atomique Procede de fabrication d'au moins une micropompe a membrane deformable et micropompe a membrane deformable
CN102306703B (zh) * 2011-08-09 2013-05-22 上海交通大学 一种微型压电泵的制备方法
EP2888479B1 (de) 2012-07-05 2021-03-03 3M Innovative Properties Company Systeme und verfahren zur zuführung von reduziertem druck unter verwendung einer scheibenpumpe mit elektrostatischer betätigung
FR2994228B1 (fr) 2012-07-31 2017-05-12 Commissariat Energie Atomique Pompe realisee dans un substrat
DE102013002667B4 (de) 2013-02-15 2022-02-10 Microfluidic Chipshop Gmbh Mikrofluidiksystem mit nach außen verschlossenen Kavitäten
FR3030111B1 (fr) 2014-12-12 2017-12-22 Commissariat Energie Atomique Procede de realisation d'une connexion electrique dans un via borgne et connexion electrique obtenue
NL2014801B1 (en) * 2015-05-13 2017-01-27 Berkin Bv Fluid flow device, comprising a valve unit, as well as method of manufacturing the same.
DE102015220018A1 (de) * 2015-10-15 2016-10-06 Carl Zeiss Smt Gmbh Verfahren zur Herstellung eines mikroelektromechanischen Bauelements mit mindestens einem beweglichen Bestandteil
CN107512699B (zh) * 2017-07-27 2019-10-11 沈阳工业大学 基于键合技术的soi加速度敏感芯片制造方法
TWI626627B (zh) * 2017-08-31 2018-06-11 研能科技股份有限公司 致動傳感模組
JP7146499B2 (ja) * 2018-07-17 2022-10-04 東京計器株式会社 ３次元構造部材の製造方法、加速度ピックアップ部材の製造方法、加速度ピックアップ部材、及び加速度センサ
DE102019208023B4 (de) 2019-05-31 2024-01-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum herstellen einer mikromechanischen vorrichtung, mikromechanisches ventil und mikropumpe

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051669A (ja) * 1991-06-21 1993-01-08 Seiko Epson Corp マイクロポンプ及びマイクロバルブの製造方法
FR2681472B1 (fr) * 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
DE19719861A1 (de) 1997-05-12 1998-11-19 Fraunhofer Ges Forschung Verfahren zum Herstellen eines Mikromembranpumpenkörpers
DE19719862A1 (de) * 1997-05-12 1998-11-19 Fraunhofer Ges Forschung Mikromembranpumpe
ATE247227T1 (de) * 1999-05-17 2003-08-15 Fraunhofer Ges Forschung Mikromechanische pumpe
WO2001090577A1 (fr) * 2000-05-25 2001-11-29 Westonbridge International Limited Dispositif fluidique micro-usine et son procede de fabrication
GB2371119A (en) * 2000-09-25 2002-07-17 Marconi Caswell Ltd Micro electro-mechanical systems
JP2002228033A (ja) * 2001-02-05 2002-08-14 Olympus Optical Co Ltd 分離型マイクロバルブ
KR100439700B1 (ko) * 2002-07-16 2004-07-12 한국과학기술원 전자기력으로 구동되는 미소거울 구동기 및 그 제조방법
JP2004332706A (ja) * 2003-05-09 2004-11-25 Honda Motor Co Ltd マイクロポンプ
JP4572534B2 (ja) * 2003-12-18 2010-11-04 パナソニック電工株式会社 静電駆動型半導体マイクロバルブ
CN1583541B (zh) * 2004-05-27 2010-09-29 哈尔滨工程大学 采用多层驱动膜结构的微驱动器及其制作方法
JP4208777B2 (ja) * 2004-06-25 2009-01-14 キヤノン株式会社 マイクロバルブの製造方法
US7238589B2 (en) * 2004-11-01 2007-07-03 International Business Machines Corporation In-place bonding of microstructures

Also Published As

Publication number Publication date
DK2013137T3 (da) 2012-01-30
CN101432223B (zh) 2011-11-16
JP2009535549A (ja) 2009-10-01
WO2007128705A1 (en) 2007-11-15
JP5112420B2 (ja) 2013-01-09
US20090130822A1 (en) 2009-05-21
KR101424748B1 (ko) 2014-08-01
FR2900400A1 (fr) 2007-11-02
EP2013137A1 (de) 2009-01-14
KR20090007436A (ko) 2009-01-16
FR2900400B1 (fr) 2008-11-07
US7838393B2 (en) 2010-11-23
CN101432223A (zh) 2009-05-13
EP2013137B1 (de) 2011-10-12

Similar Documents

Publication Publication Date Title
DK2013137T3 (da) Fremgangsmåde til kollektiv fremstilling af membraner og hulrum med lille volumen, som har høj dimensionsmæssig nøjagtighed
ATE505813T1 (de) Herstellung von luftspalten um eine verbindungsleitung herum
ATE497481T1 (de) Struktur mit einer getter-schicht und einer unterschicht zur einstellung sowie verfahren zu ihrer herstellung
WO2006025967A3 (en) Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
DE60217359D1 (de) Verfahren zur herstellung aufgehängter poröser siliziummikrostrukturen und anwendung in gassensoren
ATE510795T1 (de) Verfahren zur herstellung eines elektromechanischen mems-bauteils in einem einkristallinen material
WO2007127074A3 (en) Semiconductor on glass insulator made using improved thinning process
WO2005097439A8 (en) Manufacturing and use of microperforated substrates
PL1860722T3 (pl) Mikropodzespół scalony, łączący w sobie funkcję odzyskiwania i magazynowania energii
DE60140379D1 (de) Soi/glas-verfahren zur herstellung von dünnen mikrobearbeiteten strukturen
EP2202526A3 (de) MEMS-Sensor und MEMS-Sensorherstellungsverfahren
TW200626481A (en) Method of selective etching using etch stop layer
WO2007084982A8 (en) Dual-damascene process to fabricate thick wire structure
TW200802713A (en) Manufacturing method of semiconductor device
WO2009024762A3 (en) Mems process and device
TW200711004A (en) Method of forming buried isolation regions in semiconductor substrates and semiconductor devices with buried isolation regions
TW200701817A (en) Method for producing polymeric capacitive ultrasonic transducer
SG139678A1 (en) Method for producing bonded wafer
ATE530496T1 (de) Verfahren zur herstellung eines mikromechanischen bauelementes mit einer dünnschicht-verkappung
ATE480495T1 (de) Verfahren zur herstellung von ein gettermaterial enthaltenden mikromechanischen vorrichtungen und so hergestellte vorrichtungen
DE60317264D1 (de) Verfahren zur Herstellung von Mikrohalbleiterbauelementen
SG138581A1 (en) Method of producing bonded wafer
TW200620460A (en) Method of manufacturing a semiconductor device, and a semiconductor substrate
WO2004071941A3 (de) Verfahren zur herstellung einer mikromechanischen vorrichtung und vorrichtung
TW200638824A (en) Flexible circuits and method of making same

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties