ATE511102T1 - Prüfung von elektronischen anordnungen auf kapselungsebene unter verwendung von testleiterplatten ohne sockel - Google Patents
Prüfung von elektronischen anordnungen auf kapselungsebene unter verwendung von testleiterplatten ohne sockelInfo
- Publication number
- ATE511102T1 ATE511102T1 AT08708989T AT08708989T ATE511102T1 AT E511102 T1 ATE511102 T1 AT E511102T1 AT 08708989 T AT08708989 T AT 08708989T AT 08708989 T AT08708989 T AT 08708989T AT E511102 T1 ATE511102 T1 AT E511102T1
- Authority
- AT
- Austria
- Prior art keywords
- test
- electronic devices
- boards
- test system
- conditioning fluid
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07102397 | 2007-02-14 | ||
EP07102650A EP1959262A1 (de) | 2007-02-19 | 2007-02-19 | Testen elektronischer Vorrichtungen unter Verwendung sockelloser Platinen |
PCT/EP2008/051791 WO2008098987A1 (en) | 2007-02-14 | 2008-02-14 | Test of electronic devices at package level using test boards without sockets |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE511102T1 true ATE511102T1 (de) | 2011-06-15 |
Family
ID=39537440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08708989T ATE511102T1 (de) | 2007-02-14 | 2008-02-14 | Prüfung von elektronischen anordnungen auf kapselungsebene unter verwendung von testleiterplatten ohne sockel |
Country Status (6)
Country | Link |
---|---|
US (1) | US8330482B2 (de) |
EP (1) | EP2115480B1 (de) |
CN (1) | CN101675350A (de) |
AT (1) | ATE511102T1 (de) |
MY (1) | MY152599A (de) |
WO (1) | WO2008098987A1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7762822B2 (en) | 2005-04-27 | 2010-07-27 | Aehr Test Systems | Apparatus for testing electronic devices |
EP1959265A1 (de) * | 2007-02-16 | 2008-08-20 | Eles Semiconductor Equipment S.P.A. | Testen von integrierten Schaltungen auf einem Wafer mit einer die Oberfläche freiliegen lassenden Kassette |
US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
ITMI20081023A1 (it) * | 2008-06-04 | 2009-12-05 | Eles Semiconductor Equipment Spa | Test di dispositivi elettronici con schede senza zoccoli basate su bloccaggio magnetico |
FR2933201B1 (fr) * | 2008-06-30 | 2010-11-19 | Airbus France | Systeme et procede de deverminage d'equipements |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
US9360502B2 (en) | 2011-12-31 | 2016-06-07 | Intel Corporation | Increasing current carrying capability through direct liquid cooling of test contacts |
US9459280B2 (en) * | 2012-08-27 | 2016-10-04 | Intel Corporation | Using fluid to position a device in a socket for testing |
CN102914723B (zh) * | 2012-10-29 | 2015-10-28 | 江苏物联网研究发展中心 | 电互连阵列的测试结构及其测试方法 |
CN104076235A (zh) * | 2013-03-27 | 2014-10-01 | 深圳市海洋王照明工程有限公司 | Pcb板的印制线开路检测方法 |
US10446728B2 (en) * | 2014-10-31 | 2019-10-15 | eLux, Inc. | Pick-and remove system and method for emissive display repair |
US10466292B2 (en) | 2016-01-08 | 2019-11-05 | Aehr Test Systems | Method and system for thermal control of devices in an electronics tester |
WO2017210108A1 (en) * | 2016-06-02 | 2017-12-07 | Kes Systems, Inc. | System and methods for semiconductor burn-in test |
CN110383092B (zh) * | 2017-03-03 | 2022-04-01 | 雅赫测试系统公司 | 电子测试器 |
CN107364641B (zh) * | 2017-09-01 | 2023-06-09 | 佛山市富乐喜电子信息技术有限公司 | 一种直插端子磁性开关的包装测试装置 |
KR102447833B1 (ko) * | 2018-02-09 | 2022-09-27 | 주성엔지니어링(주) | 전력 인터페이스 |
JP6961632B2 (ja) | 2019-01-21 | 2021-11-05 | 株式会社アドバンテスト | バーンインボード及びバーンイン装置 |
IT201900006974A1 (it) * | 2019-05-17 | 2020-11-17 | Eles Semiconductor Equipment S P A | Condizionamento termico di dispositivi elettronici sotto test basato su elementi estensibili |
KR20210071486A (ko) * | 2019-12-06 | 2021-06-16 | 삼성전자주식회사 | 검사보드와 이를 구비하는 전자기기 검사장치 |
KR20220014403A (ko) | 2020-07-24 | 2022-02-07 | 삼성전자주식회사 | 반도체 패키지 테스트 시스템 및 이를 이용한 반도체 패키지 제조방법 |
CN113030697A (zh) * | 2021-02-25 | 2021-06-25 | 长鑫存储技术有限公司 | 复合测试机及其使用方法 |
TWI822371B (zh) * | 2022-09-30 | 2023-11-11 | 鴻勁精密股份有限公司 | 接合機構、測試裝置及作業機 |
Family Cites Families (39)
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US3596228A (en) * | 1969-05-29 | 1971-07-27 | Ibm | Fluid actuated contactor |
US4617824A (en) * | 1985-06-21 | 1986-10-21 | R.R. Mcglogan Equipment Ltd. | Cylinder head pressure testing apparatus |
US4820976A (en) * | 1987-11-24 | 1989-04-11 | Advanced Micro Devices, Inc. | Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts |
US5523696A (en) * | 1993-06-14 | 1996-06-04 | International Business Machines Corp. | Method and apparatus for testing integrated circuit chips |
US5550482A (en) * | 1993-07-20 | 1996-08-27 | Tokyo Electron Kabushiki Kaisha | Probe device |
US5500605A (en) * | 1993-09-17 | 1996-03-19 | At&T Corp. | Electrical test apparatus and method |
KR0140034B1 (ko) * | 1993-12-16 | 1998-07-15 | 모리시다 요이치 | 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법 |
JPH0883825A (ja) * | 1994-09-09 | 1996-03-26 | Tokyo Electron Ltd | プローブ装置 |
US5808474A (en) * | 1994-11-30 | 1998-09-15 | Lsi Logic Corporation | Test socket for testing integrated circuit packages |
US5600257A (en) * | 1995-08-09 | 1997-02-04 | International Business Machines Corporation | Semiconductor wafer test and burn-in |
WO1998007041A1 (fr) * | 1996-08-09 | 1998-02-19 | Advantest Corporation | Appareil d'essai de dispositifs a semi-conducteur |
US5952840A (en) * | 1996-12-31 | 1999-09-14 | Micron Technology, Inc. | Apparatus for testing semiconductor wafers |
US6798224B1 (en) * | 1997-02-11 | 2004-09-28 | Micron Technology, Inc. | Method for testing semiconductor wafers |
JP3689215B2 (ja) * | 1997-02-20 | 2005-08-31 | 株式会社ルネサステクノロジ | 半導体デバイスのテスト用搬送装置 |
JPH11118875A (ja) * | 1997-10-14 | 1999-04-30 | Hitachi Ltd | バーンイン基板及びそれを用いたバーンイン方法 |
JP3557887B2 (ja) * | 1998-01-14 | 2004-08-25 | 日立ハイテク電子エンジニアリング株式会社 | Icデバイスのコンタクト装置 |
JP3282800B2 (ja) * | 1998-05-20 | 2002-05-20 | 東京エレクトロン株式会社 | アライナー |
US6233184B1 (en) * | 1998-11-13 | 2001-05-15 | International Business Machines Corporation | Structures for wafer level test and burn-in |
SG98373A1 (en) * | 1998-11-25 | 2003-09-19 | Advantest Corp | Device testing apparatus |
TW533316B (en) * | 1998-12-08 | 2003-05-21 | Advantest Corp | Testing device for electronic device |
JP4346752B2 (ja) * | 1999-01-29 | 2009-10-21 | 東京エレクトロン株式会社 | コンタクタの保持機構及びコンタクタの自動交換機構 |
JP2000258495A (ja) * | 1999-03-12 | 2000-09-22 | Oki Electric Ind Co Ltd | 半導体デバイス試験装置 |
AU6747300A (en) | 1999-07-14 | 2001-01-30 | Aehr Test Systems Inc. | Wafer-level burn-in and test cartridge and methods |
US6468098B1 (en) * | 1999-08-17 | 2002-10-22 | Formfactor, Inc. | Electrical contactor especially wafer level contactor using fluid pressure |
US6529027B1 (en) * | 2000-03-23 | 2003-03-04 | Micron Technology, Inc. | Interposer and methods for fabricating same |
JP4327335B2 (ja) * | 2000-06-23 | 2009-09-09 | 株式会社アドバンテスト | コンタクトアームおよびこれを用いた電子部品試験装置 |
US6617843B2 (en) * | 2001-01-15 | 2003-09-09 | Techwing Co., Ltd. | Contactor of the device for testing semiconductor device |
JP2005533254A (ja) | 2002-07-16 | 2005-11-04 | エイアー テスト システムズ | 被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体 |
KR100479988B1 (ko) * | 2002-07-24 | 2005-03-30 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 발열 보상방법 |
US6784676B2 (en) * | 2002-09-25 | 2004-08-31 | International Business Machines Corporation | Pressurized electrical contact system |
US7282931B2 (en) * | 2003-02-19 | 2007-10-16 | Octavian Scientific, Inc. | Full wafer contacter and applications thereof |
US6774661B1 (en) * | 2003-03-18 | 2004-08-10 | Unisys Corporation | Initial contact method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint |
JP2005055330A (ja) * | 2003-08-06 | 2005-03-03 | Elpida Memory Inc | 半導体装置への加圧装置 |
JP4971181B2 (ja) | 2004-12-21 | 2012-07-11 | エレス・セミコンダクター・エクイップメント・エッセ・ピー・アー | 電子装置と接触するためのシステムとその製造方法 |
US7870800B2 (en) * | 2006-05-15 | 2011-01-18 | Centipede Systems, Inc. | Apparatus including a fluid coupler interfaced to a test head |
US20080018353A1 (en) * | 2006-07-24 | 2008-01-24 | Francis Rapheal Thamarayoor | Methods and apparatus for releasably mounting a semiconductor device to a printed circuit board |
EP1959262A1 (de) | 2007-02-19 | 2008-08-20 | Eles Semiconductor Equipment S.P.A. | Testen elektronischer Vorrichtungen unter Verwendung sockelloser Platinen |
EP1959265A1 (de) | 2007-02-16 | 2008-08-20 | Eles Semiconductor Equipment S.P.A. | Testen von integrierten Schaltungen auf einem Wafer mit einer die Oberfläche freiliegen lassenden Kassette |
US7939945B2 (en) * | 2008-04-30 | 2011-05-10 | Intel Corporation | Electrically conductive fluid interconnects for integrated circuit devices |
-
2007
- 2007-02-14 MY MYPI20093413 patent/MY152599A/en unknown
-
2008
- 2008-02-14 US US12/527,418 patent/US8330482B2/en not_active Expired - Fee Related
- 2008-02-14 EP EP08708989A patent/EP2115480B1/de active Active
- 2008-02-14 WO PCT/EP2008/051791 patent/WO2008098987A1/en active Application Filing
- 2008-02-14 CN CN200880011969A patent/CN101675350A/zh active Pending
- 2008-02-14 AT AT08708989T patent/ATE511102T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20100141287A1 (en) | 2010-06-10 |
CN101675350A (zh) | 2010-03-17 |
US8330482B2 (en) | 2012-12-11 |
WO2008098987A1 (en) | 2008-08-21 |
EP2115480A1 (de) | 2009-11-11 |
EP2115480B1 (de) | 2011-05-25 |
MY152599A (en) | 2014-10-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |