ATE494763T1 - Verfahren zur herstellung eines gewebeartikels mit elektronischer beschaltung und gewebeartikel - Google Patents
Verfahren zur herstellung eines gewebeartikels mit elektronischer beschaltung und gewebeartikelInfo
- Publication number
- ATE494763T1 ATE494763T1 AT01987714T AT01987714T ATE494763T1 AT E494763 T1 ATE494763 T1 AT E494763T1 AT 01987714 T AT01987714 T AT 01987714T AT 01987714 T AT01987714 T AT 01987714T AT E494763 T1 ATE494763 T1 AT E494763T1
- Authority
- AT
- Austria
- Prior art keywords
- fabric article
- producing
- electronic circuit
- article
- fabric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D1/00—Garments
- A41D1/002—Garments adapted to accommodate electronic equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
- Mirrors, Picture Frames, Photograph Stands, And Related Fastening Devices (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Details Of Garments (AREA)
- Decoration Of Textiles (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24080800P | 2000-10-16 | 2000-10-16 | |
| US32725901P | 2001-10-05 | 2001-10-05 | |
| PCT/US2001/032266 WO2002032665A1 (en) | 2000-10-16 | 2001-10-16 | A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE494763T1 true ATE494763T1 (de) | 2011-01-15 |
Family
ID=26933737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01987714T ATE494763T1 (de) | 2000-10-16 | 2001-10-16 | Verfahren zur herstellung eines gewebeartikels mit elektronischer beschaltung und gewebeartikel |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6729025B2 (de) |
| EP (1) | EP1335831B1 (de) |
| JP (1) | JP2004513247A (de) |
| AT (1) | ATE494763T1 (de) |
| AU (1) | AU2002224385A1 (de) |
| CA (1) | CA2426110C (de) |
| DE (1) | DE60143811D1 (de) |
| WO (1) | WO2002032665A1 (de) |
Families Citing this family (165)
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|---|---|---|---|---|
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| DE10202123A1 (de) * | 2002-01-21 | 2003-07-31 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Integration von Elektronik in Textilien |
| US7144830B2 (en) * | 2002-05-10 | 2006-12-05 | Sarnoff Corporation | Plural layer woven electronic textile, article and method |
| US7592276B2 (en) * | 2002-05-10 | 2009-09-22 | Sarnoff Corporation | Woven electronic textile, yarn and article |
| JP2004016658A (ja) * | 2002-06-19 | 2004-01-22 | Ntt Docomo Inc | 生体信号測定可能な携帯型端末および測定方法 |
| US20050120458A1 (en) * | 2002-10-21 | 2005-06-09 | Clark Brandon M. | Animated apparel |
| JP2004303195A (ja) * | 2003-03-19 | 2004-10-28 | Seiko Epson Corp | シートコンピュータ、ウェアラブルコンピュータ、ディスプレイ装置及びこれらの製造方法並びに電子機器 |
| FR2854480A1 (fr) * | 2003-04-29 | 2004-11-05 | France Telecom | Afficheur souple |
| WO2004110192A1 (en) * | 2003-06-17 | 2004-12-23 | Koninklijke Philips Electronics, N.V. | Fabric interconnect |
| JP2005042223A (ja) * | 2003-07-24 | 2005-02-17 | Isuikkusu World Kk | 電磁波防護衣服 |
| AU2004277381B2 (en) * | 2003-08-22 | 2008-04-24 | Foster-Miller, Inc. | Physiological monitoring garment |
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| US8334425B2 (en) | 2007-06-27 | 2012-12-18 | Kimberly-Clark Worldwide, Inc. | Interactive garment printing for enhanced functionality of absorbent articles |
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| US8360904B2 (en) | 2007-08-17 | 2013-01-29 | Adidas International Marketing Bv | Sports electronic training system with sport ball, and applications thereof |
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| US20110041230A1 (en) * | 2009-08-21 | 2011-02-24 | Tex-Ray Industrial Co., Ltd. | Clothing and cloth structure thereof |
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| EP2509497A4 (de) * | 2009-12-17 | 2014-02-05 | Mc10 Inc | Verfahren und vorrichtungen zur konformen erfassung von kräften und/oder bewegungsänderungen |
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| JP5854617B2 (ja) * | 2010-03-16 | 2016-02-09 | 韓國電子通信研究院Electronics and Telecommunications Research Institute | 織物型電子素子パッケージ及びその製造方法と織物型電子素子パッケージの実装方法 |
| KR101199483B1 (ko) | 2010-03-16 | 2012-11-09 | 한국전자통신연구원 | 직물형 전자소자 패키지 및 그 제조 방법과 직물형 전자소자 패키지의 실장 방법 |
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| US10462898B2 (en) | 2012-09-11 | 2019-10-29 | L.I.F.E. Corporation S.A. | Physiological monitoring garments |
| ES2705526T3 (es) | 2012-09-11 | 2019-03-25 | Life Corp Sa | Plataforma de comunicación ponible |
| US8948839B1 (en) | 2013-08-06 | 2015-02-03 | L.I.F.E. Corporation S.A. | Compression garments having stretchable and conductive ink |
| US9817440B2 (en) | 2012-09-11 | 2017-11-14 | L.I.F.E. Corporation S.A. | Garments having stretchable and conductive ink |
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-
2001
- 2001-10-16 CA CA2426110A patent/CA2426110C/en not_active Expired - Fee Related
- 2001-10-16 US US09/981,480 patent/US6729025B2/en not_active Expired - Lifetime
- 2001-10-16 EP EP01987714A patent/EP1335831B1/de not_active Expired - Lifetime
- 2001-10-16 WO PCT/US2001/032266 patent/WO2002032665A1/en not_active Ceased
- 2001-10-16 DE DE60143811T patent/DE60143811D1/de not_active Expired - Lifetime
- 2001-10-16 JP JP2002535879A patent/JP2004513247A/ja active Pending
- 2001-10-16 AU AU2002224385A patent/AU2002224385A1/en not_active Abandoned
- 2001-10-16 AT AT01987714T patent/ATE494763T1/de not_active IP Right Cessation
-
2004
- 2004-03-19 US US10/804,730 patent/US20040224138A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1335831A1 (de) | 2003-08-20 |
| WO2002032665A9 (en) | 2002-07-11 |
| EP1335831B1 (de) | 2011-01-05 |
| CA2426110C (en) | 2010-06-29 |
| US20020076948A1 (en) | 2002-06-20 |
| DE60143811D1 (de) | 2011-02-17 |
| AU2002224385A1 (en) | 2002-04-29 |
| WO2002032665A1 (en) | 2002-04-25 |
| CA2426110A1 (en) | 2002-04-25 |
| US6729025B2 (en) | 2004-05-04 |
| US20040224138A1 (en) | 2004-11-11 |
| EP1335831A4 (de) | 2009-01-28 |
| JP2004513247A (ja) | 2004-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |