ATE408250T1 - Anisotroper leitfähiger film und verfahren zu seiner herstellung - Google Patents

Anisotroper leitfähiger film und verfahren zu seiner herstellung

Info

Publication number
ATE408250T1
ATE408250T1 AT03743552T AT03743552T ATE408250T1 AT E408250 T1 ATE408250 T1 AT E408250T1 AT 03743552 T AT03743552 T AT 03743552T AT 03743552 T AT03743552 T AT 03743552T AT E408250 T1 ATE408250 T1 AT E408250T1
Authority
AT
Austria
Prior art keywords
anisotropic conductive
chain
conductive film
mounting
film
Prior art date
Application number
AT03743552T
Other languages
English (en)
Inventor
Hideki Kashihara
Masamichi Yamamoto
Jun Yorita
Hideaki Toshioka
Misako Osoegawa
Keiji Koyama
Masatoshi Majima
Yoshie Tani
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002324311A external-priority patent/JP4433449B2/ja
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Application granted granted Critical
Publication of ATE408250T1 publication Critical patent/ATE408250T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258—Alkali metal or alkaline earth metal or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT03743552T 2002-03-04 2003-03-03 Anisotroper leitfähiger film und verfahren zu seiner herstellung ATE408250T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002057598 2002-03-04
JP2002324311A JP4433449B2 (ja) 2001-11-09 2002-11-07 異方導電膜とその製造方法

Publications (1)

Publication Number Publication Date
ATE408250T1 true ATE408250T1 (de) 2008-09-15

Family

ID=27790949

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03743552T ATE408250T1 (de) 2002-03-04 2003-03-03 Anisotroper leitfähiger film und verfahren zu seiner herstellung

Country Status (10)

Country Link
US (1) US7390442B2 (de)
EP (1) EP1489695B1 (de)
KR (1) KR100923183B1 (de)
CN (1) CN100495824C (de)
AT (1) ATE408250T1 (de)
DE (1) DE60323473D1 (de)
ES (1) ES2312797T3 (de)
HK (1) HK1071233A1 (de)
TW (1) TWI264735B (de)
WO (1) WO2003075409A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4479161B2 (ja) * 2002-03-25 2010-06-09 住友金属鉱山株式会社 透明導電膜とこの透明導電膜形成用塗布液および透明導電性積層構造体と表示装置
EP2216113A1 (de) * 2004-04-30 2010-08-11 Sumitomo Electric Industries, Ltd. Verfahren zur Herstellung von Kettenmetallpulver, damit hergestelltes Kettenmetallpulver und mit dem Pulver hergestellte anisotrope leitfähige Folie
KR100673778B1 (ko) * 2005-08-19 2007-01-24 제일모직주식회사 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법
JP2007091959A (ja) * 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP2008235556A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd 配線板モジュール及び該配線板モジュールの製造方法
JP2010121007A (ja) * 2008-11-18 2010-06-03 Sumitomo Electric Ind Ltd 異方導電性フィルム
JP4616927B1 (ja) * 2010-02-25 2011-01-19 パナソニック株式会社 配線基板、配線基板の製造方法、及びビアペースト
JP4713682B1 (ja) * 2010-02-25 2011-06-29 パナソニック株式会社 多層配線基板、及び多層配線基板の製造方法
JP4795488B1 (ja) * 2011-01-18 2011-10-19 パナソニック株式会社 配線基板、配線基板の製造方法、及びビアペースト
CN102436874B (zh) * 2011-09-17 2013-01-02 山西金开源实业有限公司 各向异性导电薄膜生产设备
US9469902B2 (en) * 2014-02-18 2016-10-18 Lam Research Corporation Electroless deposition of continuous platinum layer
US20150307995A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS
CN105632717B (zh) * 2015-12-03 2018-09-21 上海磁宇信息科技有限公司 一种嵌入集成电路芯片的电感及集成电路芯片
CN108574158B (zh) * 2017-03-14 2020-10-09 群创光电股份有限公司 显示装置及其制造方法
US20190100663A1 (en) * 2017-10-03 2019-04-04 Shin-Etsu Chemical Co., Ltd. Anisotropic conductive film and method for manufacturing anisotropic conductive film
KR20200017869A (ko) * 2018-08-09 2020-02-19 쓰리엠 이노베이티브 프로퍼티즈 캄파니 도전성 접착 필름 및 이의 제조 방법
KR102196385B1 (ko) * 2020-05-04 2020-12-30 제엠제코(주) 반도체 패키지
US11462472B2 (en) * 2020-08-04 2022-10-04 Micron Technology, Inc. Low cost three-dimensional stacking semiconductor assemblies

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55159578A (en) 1979-05-30 1980-12-11 Japan Synthetic Rubber Co Ltd Connector
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
CN1011271B (zh) * 1984-09-04 1991-01-16 明尼苏达矿业制造公司 在延着压敏胶粘层有导电颗粒组成桥路的软带
JPS62186413A (ja) 1986-02-12 1987-08-14 住友ベークライト株式会社 異方導電性フイルム
US4923739A (en) 1987-07-30 1990-05-08 American Telephone And Telegraph Company Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method
JPS6452303U (de) 1987-09-28 1989-03-31
JPH0412334Y2 (de) 1987-10-01 1992-03-25
US4902857A (en) * 1988-12-27 1990-02-20 American Telephone And Telegraph Company, At&T Bell Laboratories Polymer interconnect structure
JPH025376A (ja) 1989-02-01 1990-01-10 Toray Ind Inc 低抵抗エラスチックコネクター
JP2622019B2 (ja) * 1990-07-31 1997-06-18 福田金属箔粉工業株式会社 粒状銅微粉末の製造方法
JP2923137B2 (ja) 1992-09-22 1999-07-26 シャープ株式会社 液晶表示装置
JP3275390B2 (ja) 1992-10-06 2002-04-15 神鋼電機株式会社 可搬式密閉コンテナ流通式の自動搬送システム
CA2158941A1 (en) * 1994-01-27 1995-08-03 Ciaran Bernard Mcardle Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors
JPH08315883A (ja) 1995-03-14 1996-11-29 Fujikura Rubber Ltd コネクタおよびコネクタ付基板とそれらの製造方法
US5958590A (en) * 1995-03-31 1999-09-28 International Business Machines Corporation Dendritic powder materials for high conductivity paste applications
JPH09286936A (ja) * 1996-04-22 1997-11-04 Sumitomo Metal Mining Co Ltd 透明導電膜形成用塗布液、これを用いた透明導電膜及びその形成方法
US6190509B1 (en) * 1997-03-04 2001-02-20 Tessera, Inc. Methods of making anisotropic conductive elements for use in microelectronic packaging
US6238599B1 (en) * 1997-06-18 2001-05-29 International Business Machines Corporation High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
JPH11134935A (ja) * 1997-10-29 1999-05-21 Sekisui Finechem Co Ltd 導電性微粒子、異方性導電接着剤及び導電接続構造体
JP3283226B2 (ja) * 1997-12-26 2002-05-20 ポリマテック株式会社 ホルダーの製造法
JP2000124662A (ja) 1998-10-14 2000-04-28 Sumitomo Osaka Cement Co Ltd 透明導電膜および表示装置
US6620344B2 (en) * 1999-05-28 2003-09-16 Dowa Mining Co., Ltd. Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
JP2000357414A (ja) 1999-06-11 2000-12-26 Sumitomo Osaka Cement Co Ltd 透明導電膜および表示装置
JP2001351445A (ja) 2000-06-09 2001-12-21 Jsr Corp 複合シートの製造方法および複合シート
KR20010090778A (ko) * 2000-04-10 2001-10-19 마쯔모또 에이찌 복합시이트 및 그의 제조 방법
JP2002038053A (ja) 2000-07-25 2002-02-06 Sumitomo Metal Mining Co Ltd 透明導電層形成用塗液
EP1315241A4 (de) 2000-08-09 2008-03-19 Jsr Corp Anisotropische leitfähige folie

Also Published As

Publication number Publication date
TW200305173A (en) 2003-10-16
HK1071233A1 (en) 2005-07-08
CN100495824C (zh) 2009-06-03
KR100923183B1 (ko) 2009-10-22
CN1639918A (zh) 2005-07-13
DE60323473D1 (de) 2008-10-23
US7390442B2 (en) 2008-06-24
US20050106382A1 (en) 2005-05-19
EP1489695A1 (de) 2004-12-22
EP1489695B1 (de) 2008-09-10
EP1489695A4 (de) 2005-05-04
ES2312797T3 (es) 2009-03-01
KR20040091683A (ko) 2004-10-28
TWI264735B (en) 2006-10-21
WO2003075409A1 (fr) 2003-09-12

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Legal Events

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