ATE69664T1 - Elektronische vorrichtung fuer flachmontage. - Google Patents

Elektronische vorrichtung fuer flachmontage.

Info

Publication number
ATE69664T1
ATE69664T1 AT86304251T AT86304251T ATE69664T1 AT E69664 T1 ATE69664 T1 AT E69664T1 AT 86304251 T AT86304251 T AT 86304251T AT 86304251 T AT86304251 T AT 86304251T AT E69664 T1 ATE69664 T1 AT E69664T1
Authority
AT
Austria
Prior art keywords
electronic device
inductor
electrode
discrete electronic
end portion
Prior art date
Application number
AT86304251T
Other languages
English (en)
Inventor
Donald C Mcelheny
Dale E Ponivas
David A Syracuse
Stephen H Chandler
Robert H Nareau
Original Assignee
American Precision Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Precision Ind filed Critical American Precision Ind
Application granted granted Critical
Publication of ATE69664T1 publication Critical patent/ATE69664T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Details Of Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT86304251T 1985-06-07 1986-06-04 Elektronische vorrichtung fuer flachmontage. ATE69664T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/742,452 US4801912A (en) 1985-06-07 1985-06-07 Surface mountable electronic device
EP86304251A EP0206584B1 (de) 1985-06-07 1986-06-04 Elektronische Vorrichtung für Flachmontage

Publications (1)

Publication Number Publication Date
ATE69664T1 true ATE69664T1 (de) 1991-12-15

Family

ID=24984902

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86304251T ATE69664T1 (de) 1985-06-07 1986-06-04 Elektronische vorrichtung fuer flachmontage.

Country Status (5)

Country Link
US (1) US4801912A (de)
EP (1) EP0206584B1 (de)
JP (1) JPH0821505B2 (de)
AT (1) ATE69664T1 (de)
DE (1) DE3682540D1 (de)

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US6076253A (en) * 1994-09-19 2000-06-20 Taiyo Yuden Kabushiki Kaisha Method of manufacturing chip conductor
US6377151B1 (en) * 1994-09-19 2002-04-23 Taiyo Yuden Kabushiki Kaisha Chip inductor and method of manufacturing same
DE19650996A1 (de) * 1996-11-26 1998-05-28 Chip Choke Inductivity Compone Kontaktelement
JP3322189B2 (ja) * 1997-10-24 2002-09-09 株式会社村田製作所 インダクタ及びその製造方法
JP3351738B2 (ja) * 1998-05-01 2002-12-03 太陽誘電株式会社 積層インダクタ及びその製造方法
US6675462B1 (en) 1998-05-01 2004-01-13 Taiyo Yuden Co., Ltd. Method of manufacturing a multi-laminated inductor
JP3330559B2 (ja) 1999-03-15 2002-09-30 日本圧着端子製造株式会社 プリント配線板用コネクタ
JP3262107B2 (ja) * 1999-08-26 2002-03-04 株式会社村田製作所 コイル部品及びその製造方法
US6285272B1 (en) 1999-10-28 2001-09-04 Coilcraft, Incorporated Low profile inductive component
US6422901B1 (en) 1999-12-06 2002-07-23 Fci Americas Technology, Inc. Surface mount device and use thereof
EP1381061B1 (de) * 2001-03-30 2011-08-24 Nippon Chemi-Con Corporation Induktivitätselement und gehäuse
US6653923B2 (en) * 2001-06-19 2003-11-25 Cooper Technologies Company Inductor manufacture and method
US6873241B1 (en) 2003-03-24 2005-03-29 Robert O. Sanchez High frequency transformers and high Q factor inductors formed using epoxy-based magnetic polymer materials
US20040238202A1 (en) * 2003-06-02 2004-12-02 Ohmcraft Inc. Method of making an inductor with written wire and an inductor made therefrom
US7307502B2 (en) * 2003-07-16 2007-12-11 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7489219B2 (en) * 2003-07-16 2009-02-10 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7023313B2 (en) * 2003-07-16 2006-04-04 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7760525B2 (en) * 2003-08-21 2010-07-20 Marvell World Trade Ltd. Voltage regulator
US7872454B2 (en) * 2003-08-21 2011-01-18 Marvell World Trade Ltd. Digital low dropout regulator
US8324872B2 (en) * 2004-03-26 2012-12-04 Marvell World Trade, Ltd. Voltage regulator with coupled inductors having high coefficient of coupling
US7190152B2 (en) * 2004-07-13 2007-03-13 Marvell World Trade Ltd. Closed-loop digital control system for a DC/DC converter
TW200743434A (en) * 2006-05-11 2007-11-16 Delta Electronics Inc Packaged electronic component for shielding electromagnetic interference
US20080036566A1 (en) 2006-08-09 2008-02-14 Andrzej Klesyk Electronic Component And Methods Relating To Same
US8063727B2 (en) * 2006-12-08 2011-11-22 Teradyne, Inc. Conductive shielding device
US10446309B2 (en) 2016-04-20 2019-10-15 Vishay Dale Electronics, Llc Shielded inductor and method of manufacturing
US10497635B2 (en) 2018-03-27 2019-12-03 Linear Technology Holding Llc Stacked circuit package with molded base having laser drilled openings for upper package
US11844178B2 (en) * 2020-06-02 2023-12-12 Analog Devices International Unlimited Company Electronic component
US11744021B2 (en) 2022-01-21 2023-08-29 Analog Devices, Inc. Electronic assembly
DE102022111353A1 (de) 2022-05-06 2023-11-09 Tdk Electronics Ag Induktives Bauelement, Mold-Werkzeug und Verfahren zum Einbetten
DE102022134934A1 (de) 2022-12-28 2024-07-04 Tdk Electronics Ag Induktives Bauelement, Mold-Werkzeug und Verfahren zum Einbetten

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Also Published As

Publication number Publication date
JPH0821505B2 (ja) 1996-03-04
JPS6242407A (ja) 1987-02-24
EP0206584A1 (de) 1986-12-30
EP0206584B1 (de) 1991-11-21
US4801912A (en) 1989-01-31
DE3682540D1 (de) 1992-01-02

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties