ATE380394T1 - Parallelgestapelte computermodule hoher dichte - Google Patents

Parallelgestapelte computermodule hoher dichte

Info

Publication number
ATE380394T1
ATE380394T1 AT99903153T AT99903153T ATE380394T1 AT E380394 T1 ATE380394 T1 AT E380394T1 AT 99903153 T AT99903153 T AT 99903153T AT 99903153 T AT99903153 T AT 99903153T AT E380394 T1 ATE380394 T1 AT E380394T1
Authority
AT
Austria
Prior art keywords
boards
high density
primary
board
trace
Prior art date
Application number
AT99903153T
Other languages
English (en)
Inventor
Jayesh Bhakta
Kavous Vakilian
Original Assignee
Viking Components Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viking Components Inc filed Critical Viking Components Inc
Application granted granted Critical
Publication of ATE380394T1 publication Critical patent/ATE380394T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
    • H05K7/1431—Retention mechanisms for CPU modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Advance Control (AREA)
  • Multi Processors (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Stackable Containers (AREA)
AT99903153T 1998-01-20 1999-01-19 Parallelgestapelte computermodule hoher dichte ATE380394T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US892598A 1998-01-20 1998-01-20
US09/228,867 US6222739B1 (en) 1998-01-20 1999-01-12 High-density computer module with stacked parallel-plane packaging

Publications (1)

Publication Number Publication Date
ATE380394T1 true ATE380394T1 (de) 2007-12-15

Family

ID=32033051

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99903153T ATE380394T1 (de) 1998-01-20 1999-01-19 Parallelgestapelte computermodule hoher dichte

Country Status (5)

Country Link
US (1) US6222739B1 (de)
EP (1) EP1050077B1 (de)
JP (1) JP2004507067A (de)
AT (1) ATE380394T1 (de)
DE (1) DE69937672T2 (de)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1122778A3 (de) * 2000-01-31 2004-04-07 Sanyo Electric Co., Ltd. Schaltungsanordnung und Verfahren zum Herstellen derselben
US7091606B2 (en) * 2000-01-31 2006-08-15 Sanyo Electric Co., Ltd. Circuit device and manufacturing method of circuit device and semiconductor module
US6713854B1 (en) * 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US6772261B1 (en) * 2000-04-27 2004-08-03 International Business Machines Corporation Interface that allows testing and using memory modules in computer systems not designed for the modules
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
KR100355237B1 (ko) * 2000-10-16 2002-10-11 삼성전자 주식회사 모듈확장용 소켓들 및 상기 모듈확장용 소켓들을 이용하는메모리시스템
KR100897314B1 (ko) * 2001-03-14 2009-05-14 레가시 일렉트로닉스, 인크. 반도체 칩의 3차원 표면 실장 어레이를 갖는 회로 기판을 제조하기 위한 방법 및 장치
DE10131939B4 (de) * 2001-07-02 2014-12-11 Qimonda Ag Elektronische Leiterplatte mit mehreren bauartgleichen gehäusegefaßten Halbleiterspeichern
KR100429878B1 (ko) * 2001-09-10 2004-05-03 삼성전자주식회사 메모리 모듈과 그에 사용되는 인쇄회로기판
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US6751113B2 (en) * 2002-03-07 2004-06-15 Netlist, Inc. Arrangement of integrated circuits in a memory module
US7234099B2 (en) * 2003-04-14 2007-06-19 International Business Machines Corporation High reliability memory module with a fault tolerant address and command bus
TW576505U (en) * 2003-05-07 2004-02-11 Hon Hai Prec Ind Co Ltd Testing device for slots of motherboards
DE102004039806B4 (de) * 2003-08-13 2009-05-07 Samsung Electronics Co., Ltd., Suwon Speichermodul
US20050018495A1 (en) * 2004-01-29 2005-01-27 Netlist, Inc. Arrangement of integrated circuits in a memory module
US7227759B2 (en) * 2004-04-01 2007-06-05 Silicon Pipe, Inc. Signal-segregating connector system
US7254036B2 (en) * 2004-04-09 2007-08-07 Netlist, Inc. High density memory module using stacked printed circuit boards
US7170757B2 (en) * 2004-04-09 2007-01-30 Nvidia Corporation Field changeable graphics system for a computing device
US7248264B2 (en) 2004-04-09 2007-07-24 Nvidia Corporation Edge connector for field changeable graphics system
US7265759B2 (en) 2004-04-09 2007-09-04 Nvidia Corporation Field changeable rendering system for a computing device
WO2005104324A2 (en) * 2004-04-15 2005-11-03 Smith Gary W Folded, fully buffered memory module
TW200538919A (en) * 2004-05-21 2005-12-01 Hon Hai Prec Ind Co Ltd System and method for checking split plane of motherboard layout
US7446410B2 (en) * 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7760513B2 (en) 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US7423885B2 (en) 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US20060053345A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method
US20060137903A1 (en) * 2004-12-23 2006-06-29 Sprietsma John T Memory module circuit board layer routing
US20060139983A1 (en) * 2004-12-23 2006-06-29 Sprietsma John T Memory module routing
WO2006076381A2 (en) * 2005-01-12 2006-07-20 Legacy Electronics, Inc. Radial circuit board, system, and methods
US7710741B1 (en) 2005-05-03 2010-05-04 Nvidia Corporation Reconfigurable graphics processing system
US20060250780A1 (en) * 2005-05-06 2006-11-09 Staktek Group L.P. System component interposer
US20080082763A1 (en) 2006-10-02 2008-04-03 Metaram, Inc. Apparatus and method for power management of memory circuits by a system or component thereof
US7472220B2 (en) * 2006-07-31 2008-12-30 Metaram, Inc. Interface circuit system and method for performing power management operations utilizing power management signals
US8386722B1 (en) 2008-06-23 2013-02-26 Google Inc. Stacked DIMM memory interface
US9171585B2 (en) 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
US8244971B2 (en) 2006-07-31 2012-08-14 Google Inc. Memory circuit system and method
US8077535B2 (en) 2006-07-31 2011-12-13 Google Inc. Memory refresh apparatus and method
US9542352B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US7580312B2 (en) * 2006-07-31 2009-08-25 Metaram, Inc. Power saving system and method for use with a plurality of memory circuits
US7386656B2 (en) * 2006-07-31 2008-06-10 Metaram, Inc. Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
US9507739B2 (en) 2005-06-24 2016-11-29 Google Inc. Configurable memory circuit system and method
US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
US8089795B2 (en) 2006-02-09 2012-01-03 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US8397013B1 (en) 2006-10-05 2013-03-12 Google Inc. Hybrid memory module
US8055833B2 (en) 2006-10-05 2011-11-08 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8090897B2 (en) 2006-07-31 2012-01-03 Google Inc. System and method for simulating an aspect of a memory circuit
GB2441726B (en) * 2005-06-24 2010-08-11 Metaram Inc An integrated memory core and memory interface circuit
US8130560B1 (en) 2006-11-13 2012-03-06 Google Inc. Multi-rank partial width memory modules
US20080028136A1 (en) 2006-07-31 2008-01-31 Schakel Keith R Method and apparatus for refresh management of memory modules
US8327104B2 (en) 2006-07-31 2012-12-04 Google Inc. Adjusting the timing of signals associated with a memory system
US10013371B2 (en) 2005-06-24 2018-07-03 Google Llc Configurable memory circuit system and method
US8796830B1 (en) 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8359187B2 (en) 2005-06-24 2013-01-22 Google Inc. Simulating a different number of memory circuit devices
US7392338B2 (en) * 2006-07-31 2008-06-24 Metaram, Inc. Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits
US8335894B1 (en) 2008-07-25 2012-12-18 Google Inc. Configurable memory system with interface circuit
US8111566B1 (en) 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8060774B2 (en) 2005-06-24 2011-11-15 Google Inc. Memory systems and memory modules
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US8041881B2 (en) 2006-07-31 2011-10-18 Google Inc. Memory device with emulated characteristics
DE102005032061B4 (de) * 2005-07-08 2009-07-30 Qimonda Ag Speichermodul, und Speichermodul-System
US7442050B1 (en) 2005-08-29 2008-10-28 Netlist, Inc. Circuit card with flexible connection for memory module with heat spreader
JP5242397B2 (ja) 2005-09-02 2013-07-24 メタラム インコーポレイテッド Ｄｒａｍをスタックする方法及び装置
JP2007109932A (ja) * 2005-10-14 2007-04-26 Toshiba Corp 半導体装置
US8769808B2 (en) * 2005-10-17 2014-07-08 Alcatel Lucent Method for fixed and replaceable module architecture
DE102005051998B3 (de) * 2005-10-31 2007-01-11 Infineon Technologies Ag Halbleiterspeichermodul
US9632929B2 (en) 2006-02-09 2017-04-25 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
WO2007095554A2 (en) * 2006-02-13 2007-08-23 Finisar Corporation Optical transceiver pcb mounting system having emi containment features
US7619893B1 (en) 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
US20070224854A1 (en) * 2006-03-27 2007-09-27 Abdallah Bacha Memory module, method of manufacturing a memory module and computer system
US20080105963A1 (en) * 2006-07-28 2008-05-08 Tessera, Inc. Stackable electronic device assembly
US7724589B2 (en) * 2006-07-31 2010-05-25 Google Inc. System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits
US20080028135A1 (en) * 2006-07-31 2008-01-31 Metaram, Inc. Multiple-component memory interface system and method
KR100810613B1 (ko) * 2006-08-04 2008-03-07 삼성전자주식회사 개별소자들의 개선된 배치 구조를 갖는 메모리 모듈
US7724540B1 (en) 2007-03-13 2010-05-25 Yazaki North America, Inc. Spacer for circuit boards
US8209479B2 (en) 2007-07-18 2012-06-26 Google Inc. Memory circuit system and method
US20090026599A1 (en) * 2007-07-27 2009-01-29 Powertech Technology Inc. Memory module capable of lessening shock stress
US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
US8018723B1 (en) 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US7684196B2 (en) * 2008-05-13 2010-03-23 International Business Machines Corporation Enhancing the cooling of dual in-line memory modules
WO2010144624A1 (en) 2009-06-09 2010-12-16 Google Inc. Programming of dimm termination resistance values
US20120106052A1 (en) * 2010-10-29 2012-05-03 Odineal Robert D Twin-mate cpu assembly
US8597032B2 (en) * 2011-02-26 2013-12-03 International Business Machines Corporation Electronic assemblies mating system
US8738828B2 (en) 2011-02-26 2014-05-27 International Business Machines Corporation System to operationally connect logic nodes
US8589608B2 (en) 2011-02-26 2013-11-19 International Business Machines Corporation Logic node connection system
US8713228B2 (en) 2011-02-26 2014-04-29 International Business Machines Corporation Shared system to operationally connect logic nodes
TWI432755B (zh) * 2012-01-13 2014-04-01 Wistron Corp 測試系統及印刷電路板組件之測試方法
US20130313714A1 (en) * 2012-05-22 2013-11-28 Samsung Electronics Co., Ltd. Semiconductor device having enhanced signal integrity
US8559183B1 (en) * 2013-01-02 2013-10-15 iJet Technologies, Inc. Method to use empty slots in onboard aircraft servers and communication devices to install non-proprietary servers and communications interfaces
US9668359B2 (en) * 2015-02-04 2017-05-30 Cyntec Co., Ltd. Circuit module having surface-mount pads on a lateral surface for connecting with a circuit board
CA169446S (en) * 2016-01-22 2017-02-21 Shenzhen Longsys Electronics Co Ltd Ssd storage module
US10028402B1 (en) * 2017-03-22 2018-07-17 Seagate Technology Llc Planar expansion card assembly
US10306751B2 (en) * 2017-10-20 2019-05-28 Hamilton Sundstrand Corporation DDR electronic module assembly
US10903594B2 (en) * 2018-10-01 2021-01-26 Te Connectivity Corporation Board-to-board connector assembly for add-in cards
US11399434B2 (en) * 2018-10-11 2022-07-26 Intel Corporation Electronic package and method of forming an electronic package
TWM612388U (zh) * 2021-02-05 2021-05-21 微星科技股份有限公司 輸入輸出傳輸介面總成及主機板模組
CN115119368B (zh) * 2022-07-01 2023-09-12 扬州灿阳电子科技有限公司 一种具有4g实时通讯功能的路灯单灯控制器

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4683550A (en) * 1984-07-30 1987-07-28 Burr-Brown Corporation Personal computer instrumentation system including carrier board having bus-oriented plug-in instrumentation modules
KR970003915B1 (ko) 1987-06-24 1997-03-22 미다 가쓰시게 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈
JPH02235389A (ja) 1989-03-08 1990-09-18 Mitsubishi Electric Corp 電子回路装置
JPH03145186A (ja) 1989-10-30 1991-06-20 Mitsubishi Electric Corp 半導体モジュール
US5191404A (en) 1989-12-20 1993-03-02 Digital Equipment Corporation High density memory array packaging
JPH04206765A (ja) 1990-11-30 1992-07-28 Mitsubishi Electric Corp 半導体モジユール
JPH04312992A (ja) 1991-03-18 1992-11-04 Mitsubishi Electric Corp 半導体装置
JPH04335561A (ja) 1991-05-13 1992-11-24 Mitsubishi Electric Corp 半導体装置
JPH05152509A (ja) * 1991-11-27 1993-06-18 Hitachi Ltd 電子回路システム装置
JP2575566B2 (ja) * 1992-01-24 1997-01-29 株式会社東芝 半導体装置
JPH0679990A (ja) 1992-09-04 1994-03-22 Mitsubishi Electric Corp Ｉｃメモリカード
US5495397A (en) 1993-04-27 1996-02-27 International Business Machines Corporation Three dimensional package and architecture for high performance computer
US5636997A (en) 1993-07-06 1997-06-10 Hitachi Maxell, Ltd. Connection apparatus of circuit board
US5548486A (en) 1994-01-21 1996-08-20 International Business Machines Corporation Pinned module
US5842874A (en) * 1994-05-25 1998-12-01 Molex Incorporated Dual housing board-to-board connector
US5583749A (en) 1994-11-30 1996-12-10 Altera Corporation Baseboard and daughtercard apparatus for reconfigurable computing systems
US5491612A (en) 1995-02-21 1996-02-13 Fairchild Space And Defense Corporation Three-dimensional modular assembly of integrated circuits
US5754408A (en) 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies
US5754409A (en) * 1996-11-06 1998-05-19 Dynamem, Inc. Foldable electronic assembly module
JPH10173122A (ja) * 1996-12-06 1998-06-26 Mitsubishi Electric Corp メモリモジュール
US5949657A (en) * 1997-12-01 1999-09-07 Karabatsos; Chris Bottom or top jumpered foldable electronic assembly

Also Published As

Publication number Publication date
US6222739B1 (en) 2001-04-24
EP1050077B1 (de) 2007-12-05
JP2004507067A (ja) 2004-03-04
DE69937672D1 (de) 2008-01-17
DE69937672T2 (de) 2008-11-13
EP1050077A1 (de) 2000-11-08
EP1050077A4 (de) 2002-07-31

Similar Documents

Publication Publication Date Title
DE69937672D1 (de) Parallelgestapelte computermodule hoher dichte
US5335146A (en) High density packaging for device requiring large numbers of unique signals utilizing orthogonal plugging and zero insertion force connetors
KR970701885A (ko) 고대역폭 컴퓨터를 위한 모듈 구조(modular architecture for high bandwidth computers)
TW333696B (en) Memory module
ES323650A1 (es) Una disposicion de circuitos impresos de gran velocidad de trabajo,para modulos de circuito miniatura o de gran densidad.
GB1131055A (en) Electronic circuit modules and modular assembly including the same
KR920010613A (ko) 3 디멘션 써킷 모듈
WO2002034021A3 (en) Carrier-based electronic module
DE60308183D1 (de) Pufferanordnung für speicher
DE60123762D1 (de) Elektronikmodul mit trägermontierten ic-gehäusen in 3d-anordnung
SE9702923D0 (sv) Power transistor module packaging structure
WO2004008817A3 (en) A multi-configuration processor-memory device
ES2169687A1 (es) Unidad electronica de control con elemento de activacion y elemento detratamiento de control.
WO2002033752A3 (en) Electronic module having canopy-type carriers
HK1008616A1 (en) High performance, low cost multi-chip module package
TW384557B (en) System for connecting a set of opposite connectors
ATE522953T1 (de) Flexible baugruppe gestapelter chips
SE0203370D0 (sv) Anordning
DE502004001921D1 (de) Aderanschlussmodul für leiterplatten
ATE375702T1 (de) Träger für integrierte schaltungen
KR20080006749A (ko) 메모리 모듈 실장 테스트 시스템
KR960016666A (ko) 전자 회로 기판용 서브랙 및 그 지지체
CN208047095U (zh) 一种pcb线路板的固定装置
CN110727631B (zh) 一种基于双中板正交与非正交异构互连的h型组装方法
CN210519047U (zh) 基于插接式连接子板的模块化开发板

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties