ATE380394T1 - Parallelgestapelte computermodule hoher dichte - Google Patents
Parallelgestapelte computermodule hoher dichteInfo
- Publication number
- ATE380394T1 ATE380394T1 AT99903153T AT99903153T ATE380394T1 AT E380394 T1 ATE380394 T1 AT E380394T1 AT 99903153 T AT99903153 T AT 99903153T AT 99903153 T AT99903153 T AT 99903153T AT E380394 T1 ATE380394 T1 AT E380394T1
- Authority
- AT
- Austria
- Prior art keywords
- boards
- high density
- primary
- board
- trace
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
- H05K7/1431—Retention mechanisms for CPU modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Stackable Containers (AREA)
- Advance Control (AREA)
- Multi Processors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US892598A | 1998-01-20 | 1998-01-20 | |
US09/228,867 US6222739B1 (en) | 1998-01-20 | 1999-01-12 | High-density computer module with stacked parallel-plane packaging |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE380394T1 true ATE380394T1 (de) | 2007-12-15 |
Family
ID=32033051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT99903153T ATE380394T1 (de) | 1998-01-20 | 1999-01-19 | Parallelgestapelte computermodule hoher dichte |
Country Status (5)
Country | Link |
---|---|
US (1) | US6222739B1 (de) |
EP (1) | EP1050077B1 (de) |
JP (1) | JP2004507067A (de) |
AT (1) | ATE380394T1 (de) |
DE (1) | DE69937672T2 (de) |
Families Citing this family (99)
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KR970003915B1 (ko) | 1987-06-24 | 1997-03-22 | 미다 가쓰시게 | 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈 |
JPH02235389A (ja) | 1989-03-08 | 1990-09-18 | Mitsubishi Electric Corp | 電子回路装置 |
JPH03145186A (ja) | 1989-10-30 | 1991-06-20 | Mitsubishi Electric Corp | 半導体モジュール |
US5191404A (en) | 1989-12-20 | 1993-03-02 | Digital Equipment Corporation | High density memory array packaging |
JPH04206765A (ja) | 1990-11-30 | 1992-07-28 | Mitsubishi Electric Corp | 半導体モジユール |
JPH04312992A (ja) | 1991-03-18 | 1992-11-04 | Mitsubishi Electric Corp | 半導体装置 |
JPH04335561A (ja) | 1991-05-13 | 1992-11-24 | Mitsubishi Electric Corp | 半導体装置 |
JPH05152509A (ja) * | 1991-11-27 | 1993-06-18 | Hitachi Ltd | 電子回路システム装置 |
JP2575566B2 (ja) * | 1992-01-24 | 1997-01-29 | 株式会社東芝 | 半導体装置 |
JPH0679990A (ja) | 1992-09-04 | 1994-03-22 | Mitsubishi Electric Corp | Icメモリカード |
US5495397A (en) | 1993-04-27 | 1996-02-27 | International Business Machines Corporation | Three dimensional package and architecture for high performance computer |
US5636997A (en) | 1993-07-06 | 1997-06-10 | Hitachi Maxell, Ltd. | Connection apparatus of circuit board |
US5548486A (en) | 1994-01-21 | 1996-08-20 | International Business Machines Corporation | Pinned module |
US5842874A (en) * | 1994-05-25 | 1998-12-01 | Molex Incorporated | Dual housing board-to-board connector |
US5583749A (en) | 1994-11-30 | 1996-12-10 | Altera Corporation | Baseboard and daughtercard apparatus for reconfigurable computing systems |
US5491612A (en) | 1995-02-21 | 1996-02-13 | Fairchild Space And Defense Corporation | Three-dimensional modular assembly of integrated circuits |
US5754408A (en) | 1995-11-29 | 1998-05-19 | Mitsubishi Semiconductor America, Inc. | Stackable double-density integrated circuit assemblies |
US5754409A (en) * | 1996-11-06 | 1998-05-19 | Dynamem, Inc. | Foldable electronic assembly module |
JPH10173122A (ja) * | 1996-12-06 | 1998-06-26 | Mitsubishi Electric Corp | メモリモジュール |
US5949657A (en) * | 1997-12-01 | 1999-09-07 | Karabatsos; Chris | Bottom or top jumpered foldable electronic assembly |
-
1999
- 1999-01-12 US US09/228,867 patent/US6222739B1/en not_active Expired - Lifetime
- 1999-01-19 JP JP2000540577A patent/JP2004507067A/ja active Pending
- 1999-01-19 AT AT99903153T patent/ATE380394T1/de not_active IP Right Cessation
- 1999-01-19 DE DE69937672T patent/DE69937672T2/de not_active Expired - Lifetime
- 1999-01-19 EP EP99903153A patent/EP1050077B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1050077A4 (de) | 2002-07-31 |
EP1050077A1 (de) | 2000-11-08 |
US6222739B1 (en) | 2001-04-24 |
DE69937672T2 (de) | 2008-11-13 |
DE69937672D1 (de) | 2008-01-17 |
EP1050077B1 (de) | 2007-12-05 |
JP2004507067A (ja) | 2004-03-04 |
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