ES2169687A1 - Unidad electronica de control con elemento de activacion y elemento detratamiento de control. - Google Patents

Unidad electronica de control con elemento de activacion y elemento detratamiento de control.

Info

Publication number
ES2169687A1
ES2169687A1 ES200002351A ES200002351A ES2169687A1 ES 2169687 A1 ES2169687 A1 ES 2169687A1 ES 200002351 A ES200002351 A ES 200002351A ES 200002351 A ES200002351 A ES 200002351A ES 2169687 A1 ES2169687 A1 ES 2169687A1
Authority
ES
Spain
Prior art keywords
circuit board
processing element
control processing
control unit
drive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES200002351A
Other languages
English (en)
Other versions
ES2169687B2 (es
Inventor
Toru Murowaki
Toshoaki Yagura
Yoshitaka Nakamo
Taku Iida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP27930199A external-priority patent/JP4023047B2/ja
Priority claimed from JP28421899A external-priority patent/JP2001111266A/ja
Priority claimed from JP28839899A external-priority patent/JP4062835B2/ja
Application filed by Denso Corp filed Critical Denso Corp
Publication of ES2169687A1 publication Critical patent/ES2169687A1/es
Application granted granted Critical
Publication of ES2169687B2 publication Critical patent/ES2169687B2/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connection Or Junction Boxes (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Unidad electrónica de control con elemento de activación y elemento de tratamiento. En una unidad electrónica (1) de control, un elemento de activación (5) que puede generar calor y un elemento (3) de tratamiento de control, que puede verse afectado por el calor, se montan respectivamente en una placa (11) de circuito de activación y en una placa (9) de circuito de control diferentes, y las dos placas se conectan una con otra mediante una placa (13) de circuito impreso flexible. La parte de unión de la placa (13) de circuito impreso flexible con la placa (9) de circuito de control es una parte lateral posterior de un conectador (2) montado en la placa (9) de circuito de control, al mismo lado que el elemento (3) de tratamiento de control. Por tanto, se evita que el calor generado por el elemento de activación (5) sea transmitido al elemento (3) de tratamiento de control, sin obstaculizar la instalación.
ES200002351A 1999-09-30 2000-09-28 Unidad electronica de control con elemento de activacion y elemento de tratamiento de control. Expired - Fee Related ES2169687B2 (es)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP11-279301 1999-09-30
JP27930199A JP4023047B2 (ja) 1999-09-30 1999-09-30 電子制御装置
JP28421899A JP2001111266A (ja) 1999-10-05 1999-10-05 電子制御装置
JP11-284218 1999-10-05
JP11-288398 1999-10-08
JP28839899A JP4062835B2 (ja) 1999-10-08 1999-10-08 電子制御装置

Publications (2)

Publication Number Publication Date
ES2169687A1 true ES2169687A1 (es) 2002-07-01
ES2169687B2 ES2169687B2 (es) 2004-10-16

Family

ID=27336644

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200002351A Expired - Fee Related ES2169687B2 (es) 1999-09-30 2000-09-28 Unidad electronica de control con elemento de activacion y elemento de tratamiento de control.

Country Status (3)

Country Link
US (1) US6341066B1 (es)
DE (1) DE10048379A1 (es)
ES (1) ES2169687B2 (es)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT406725B (de) * 1998-02-24 2000-08-25 Siemens Ag Oesterreich Elektronisches gerät
US20030214800A1 (en) * 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US20030156400A1 (en) * 1999-07-15 2003-08-21 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
US6466447B2 (en) 2000-02-24 2002-10-15 Denso Corporation Electronic control unit having flexible wires connecting connector to circuit board
JP2002058134A (ja) * 2000-08-09 2002-02-22 Auto Network Gijutsu Kenkyusho:Kk 電子制御ユニットの搭載構造
DE10110948A1 (de) * 2001-03-07 2002-09-19 Siemens Ag Mechatronische Getriebesteuerung
US6842325B2 (en) * 2001-09-19 2005-01-11 Square D Company Flexible circuit adhered to metal frame of device
US6845013B2 (en) * 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
JP2003264386A (ja) * 2002-03-07 2003-09-19 Denso Corp 電子制御機器
DE10214953A1 (de) * 2002-04-04 2003-10-30 Infineon Technologies Ag Leistungsmodul mit mindestens zwei Substraten und Verfahren zu seiner Herstellung
JP2004064912A (ja) 2002-07-30 2004-02-26 Hitachi Ltd 自動車制御装置
JP2005117887A (ja) * 2003-09-19 2005-04-28 Auto Network Gijutsu Kenkyusho:Kk 車載用回路ユニットの取付構造及び車載用回路ユニット
JP4211580B2 (ja) * 2003-11-18 2009-01-21 株式会社デンソー 電子装置の筐体構造
JP2005312130A (ja) * 2004-04-19 2005-11-04 Auto Network Gijutsu Kenkyusho:Kk 電気接続箱
JP2005312129A (ja) * 2004-04-19 2005-11-04 Auto Network Gijutsu Kenkyusho:Kk 電気接続箱
US7172432B2 (en) * 2005-03-31 2007-02-06 Intel Corporation Stacked multiple connection module
JP2006332648A (ja) * 2005-05-20 2006-12-07 Sumitomo Electric Ind Ltd フレキシブル基板を用いた多ピン同軸モジュールと回路基板の結線構造
DE102006018854A1 (de) * 2006-04-22 2007-11-22 Sma Technologie Ag Gehäuse eines Stromrichters
JP4325687B2 (ja) * 2007-02-23 2009-09-02 株式会社デンソー 電子装置
DE102007032139A1 (de) * 2007-06-30 2009-01-02 Robert Bosch Gmbh Steuervorrichtung mit Positionssensor
DE102007038676B4 (de) * 2007-08-15 2023-09-21 Sew-Eurodrive Gmbh & Co Kg Elektrogerät und Antrieb
US20090091889A1 (en) * 2007-10-09 2009-04-09 Oman Todd P Power electronic module having improved heat dissipation capability
DE102008060357A1 (de) * 2008-12-03 2010-06-10 Audi Ag Steuergerät zum Ansteuern einer elektrischen Maschine in einem Kraftwagen und Kraftwagen mit Steuergerät
DE102009060780A1 (de) * 2009-12-22 2011-06-30 Automotive Lighting Reutlingen GmbH, 72762 Elektronisches Steuergerät und Gasentladungslampe für eine Beleuchtungseinrichtung eines Kraftfahrzeugs mit einem solchen Steuergerät
DE102009060777A1 (de) 2009-12-22 2011-06-30 Automotive Lighting Reutlingen GmbH, 72762 Elektronisches Steuergerät und Verfahren zur Herstellung einer Einheit aus einem Grundkörper und einer Leiterplatte zum Einsatz in einem solchen Steuergerät
JP5824672B2 (ja) * 2011-02-24 2015-11-25 パナソニックＩｐマネジメント株式会社 パワーモジュール
JP5281121B2 (ja) * 2011-06-14 2013-09-04 三菱電機株式会社 車載電子装置の基板収納筐体
US9064869B2 (en) 2013-08-23 2015-06-23 Infineon Technologies Ag Semiconductor module and a method for fabrication thereof by extended embedding technologies
US9681558B2 (en) 2014-08-12 2017-06-13 Infineon Technologies Ag Module with integrated power electronic circuitry and logic circuitry
US10211158B2 (en) 2014-10-31 2019-02-19 Infineon Technologies Ag Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
GB2549128B (en) 2016-04-06 2019-06-12 Ge Aviat Systems Ltd Power control system with improved thermal performance
US11818842B1 (en) * 2020-03-06 2023-11-14 Amazon Technologies, Inc. Configurable circuit board for abstracting third-party controls
DE102022205358A1 (de) 2022-05-30 2023-11-30 Robert Bosch Gesellschaft mit beschränkter Haftung Elektronische Baugruppe, insbesondere eine elektronische Leistungsbaugruppe für Hybridfahrzeuge oder Elektrofahrzeuge

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4689721A (en) * 1986-01-10 1987-08-25 Trw Inc. Dual printed circuit board module
EP0374833A2 (en) * 1988-12-23 1990-06-27 Sanyo Electric Co., Ltd. Connector structure for hybrid integrated circuit
US5093761A (en) * 1989-08-21 1992-03-03 O.K Print Corporation Circuit board device
US5657203A (en) * 1991-05-31 1997-08-12 Nippondenso Co., Ltd. Electronic device having a plurality of circuit boards arranged therein

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666408B2 (ja) 1987-12-04 1994-08-24 富士電機株式会社 多層形半導体装置
EP0516149B1 (en) 1991-05-31 1998-09-23 Denso Corporation Electronic device
JPH0621330A (ja) 1992-06-30 1994-01-28 Mitsubishi Electric Corp 半導体パワーモジュール
JP2956363B2 (ja) 1992-07-24 1999-10-04 富士電機株式会社 パワー半導体装置
US6031730A (en) * 1998-11-17 2000-02-29 Siemens Automotive Corporation Connector for electrically connecting circuit boards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4689721A (en) * 1986-01-10 1987-08-25 Trw Inc. Dual printed circuit board module
EP0374833A2 (en) * 1988-12-23 1990-06-27 Sanyo Electric Co., Ltd. Connector structure for hybrid integrated circuit
US5093761A (en) * 1989-08-21 1992-03-03 O.K Print Corporation Circuit board device
US5657203A (en) * 1991-05-31 1997-08-12 Nippondenso Co., Ltd. Electronic device having a plurality of circuit boards arranged therein

Also Published As

Publication number Publication date
ES2169687B2 (es) 2004-10-16
DE10048379A1 (de) 2001-04-12
US6341066B1 (en) 2002-01-22

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