MXPA02008042A - Metodo y aparato para proporcionar energia a un microprocesador con manejo de interfase integrada termica y electromagnetica. - Google Patents
Metodo y aparato para proporcionar energia a un microprocesador con manejo de interfase integrada termica y electromagnetica.Info
- Publication number
- MXPA02008042A MXPA02008042A MXPA02008042A MXPA02008042A MXPA02008042A MX PA02008042 A MXPA02008042 A MX PA02008042A MX PA02008042 A MXPA02008042 A MX PA02008042A MX PA02008042 A MXPA02008042 A MX PA02008042A MX PA02008042 A MXPA02008042 A MX PA02008042A
- Authority
- MX
- Mexico
- Prior art keywords
- microprocessor
- circuit board
- integrated thermal
- providing power
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Combinations Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Se describe una arquitectura de empaque de microprocesador que utiliza un ensamble de tablero de circuito modular que proporciona energia a un microprocesador mientras que tambien proporciona una interfase integrada termica y electromagnetica (EMI). El ensamble de tablero de circuito modular comprende un substrato que tiene un componente montado en el mismo, un tablero de circuito incluyendo un circuito para suministrar energia al componente, y por lo menos un dispositivo de interconexion conductor dispuesto entre el substrato y el tablero de circuito, el dispositivo de interconexion conductor configurado para acoplar electricamente el circuito a la computadora.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18347400P | 2000-02-18 | 2000-02-18 | |
US18676900P | 2000-03-03 | 2000-03-03 | |
US18777700P | 2000-03-08 | 2000-03-08 | |
US19605900P | 2000-04-10 | 2000-04-10 | |
US21981300P | 2000-07-21 | 2000-07-21 | |
US23297100P | 2000-09-14 | 2000-09-14 | |
PCT/US2001/005067 WO2001065344A2 (en) | 2000-02-18 | 2001-02-16 | Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA02008042A true MXPA02008042A (es) | 2004-09-06 |
Family
ID=27558742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA02008042A MXPA02008042A (es) | 2000-02-18 | 2001-02-16 | Metodo y aparato para proporcionar energia a un microprocesador con manejo de interfase integrada termica y electromagnetica. |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1256263A2 (es) |
JP (1) | JP2003529921A (es) |
KR (1) | KR100699094B1 (es) |
CN (1) | CN1419803A (es) |
AU (1) | AU2001266551A1 (es) |
CA (1) | CA2400568A1 (es) |
MX (1) | MXPA02008042A (es) |
WO (1) | WO2001065344A2 (es) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030214800A1 (en) | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
DE10107839A1 (de) * | 2001-02-16 | 2002-09-05 | Philips Corp Intellectual Pty | Anordnung mit einem auf einem Träger montierten integrierten Schaltkreis und einer Stromversorgungsbaugruppenanordnung |
US6936917B2 (en) * | 2001-09-26 | 2005-08-30 | Molex Incorporated | Power delivery connector for integrated circuits utilizing integrated capacitors |
AU2003213618A1 (en) * | 2002-02-25 | 2003-09-09 | Molex Incorporated | Electrical connector equipped with filter |
US6940724B2 (en) * | 2003-04-24 | 2005-09-06 | Power-One Limited | DC-DC converter implemented in a land grid array package |
US6979784B1 (en) | 2003-10-17 | 2005-12-27 | Advanced Micro Devices, Inc. | Component power interface board |
US7091586B2 (en) * | 2003-11-04 | 2006-08-15 | Intel Corporation | Detachable on package voltage regulation module |
US7149086B2 (en) | 2004-12-10 | 2006-12-12 | Intel Corporation | Systems to cool multiple electrical components |
KR100724916B1 (ko) * | 2006-01-02 | 2007-06-04 | 삼성전자주식회사 | 전자회로 패키지 |
SG135074A1 (en) | 2006-02-28 | 2007-09-28 | Micron Technology Inc | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices |
CN102026481A (zh) * | 2009-09-18 | 2011-04-20 | 仁宝电脑工业股份有限公司 | 电路板叠合结构 |
US9128123B2 (en) * | 2011-06-03 | 2015-09-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interposer test structures and methods |
CN102569223B (zh) * | 2012-01-11 | 2016-09-14 | 华为技术有限公司 | 一种功率器件绝缘散热结构及电路板、电源设备 |
JP6104602B2 (ja) * | 2012-12-26 | 2017-03-29 | 株式会社東芝 | 電子機器 |
US9519319B2 (en) * | 2014-03-14 | 2016-12-13 | Sandisk Technologies Llc | Self-supporting thermal tube structure for electronic assemblies |
FR3036917B1 (fr) * | 2015-05-28 | 2018-11-02 | IFP Energies Nouvelles | Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore. |
CN111315112A (zh) * | 2015-06-26 | 2020-06-19 | 台达电子工业股份有限公司 | 一种用于芯片供电的组装结构、电子设备 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6230367U (es) * | 1985-08-07 | 1987-02-24 | ||
FR2621173B1 (fr) * | 1987-09-29 | 1989-12-08 | Bull Sa | Boitier pour circuit integre de haute densite |
KR100208053B1 (ko) * | 1994-07-04 | 1999-07-15 | 모리시타 요이찌 | 집적회로장치 |
FR2722334B1 (fr) * | 1994-07-06 | 1997-01-17 | Barbin Jean Philippe | Support actif pour circuit integre, notamment pour un processeur |
US5980267A (en) * | 1996-06-28 | 1999-11-09 | Intel Corporation | Connector scheme for a power pod power delivery system |
US6018465A (en) * | 1996-12-31 | 2000-01-25 | Intel Corporation | Apparatus for mounting a chip package to a chassis of a computer |
US6356448B1 (en) * | 1999-11-02 | 2002-03-12 | Inceptechnologies, Inc. | Inter-circuit encapsulated packaging for power delivery |
US6304450B1 (en) * | 1999-07-15 | 2001-10-16 | Incep Technologies, Inc. | Inter-circuit encapsulated packaging |
-
2001
- 2001-02-16 JP JP2001563974A patent/JP2003529921A/ja not_active Withdrawn
- 2001-02-16 MX MXPA02008042A patent/MXPA02008042A/es unknown
- 2001-02-16 EP EP01944108A patent/EP1256263A2/en not_active Withdrawn
- 2001-02-16 CA CA002400568A patent/CA2400568A1/en not_active Abandoned
- 2001-02-16 KR KR1020027010820A patent/KR100699094B1/ko not_active IP Right Cessation
- 2001-02-16 AU AU2001266551A patent/AU2001266551A1/en not_active Abandoned
- 2001-02-16 CN CN01807247A patent/CN1419803A/zh active Pending
- 2001-02-16 WO PCT/US2001/005067 patent/WO2001065344A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CA2400568A1 (en) | 2001-09-07 |
WO2001065344A2 (en) | 2001-09-07 |
KR100699094B1 (ko) | 2007-03-21 |
CN1419803A (zh) | 2003-05-21 |
EP1256263A2 (en) | 2002-11-13 |
WO2001065344B1 (en) | 2002-06-27 |
WO2001065344A3 (en) | 2002-04-25 |
KR20020092961A (ko) | 2002-12-12 |
AU2001266551A1 (en) | 2001-09-12 |
JP2003529921A (ja) | 2003-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MXPA02008042A (es) | Metodo y aparato para proporcionar energia a un microprocesador con manejo de interfase integrada termica y electromagnetica. | |
WO2001033927A8 (en) | Inter-circuit encapsulated packaging for power delivery | |
TW355913B (en) | Heat conductive substrate mounted in PC board hole for transferring heat from IC to heat sink | |
AU6121598A (en) | Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board | |
SG70079A1 (en) | Multi-pin electrical connector for printed circuit board | |
AU5495998A (en) | Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment | |
EP0602443A3 (en) | Printed circuit board mounting device for electrical connectors. | |
AU2002211084A1 (en) | Methods of manufacturing a printed circuit board shielded against interfering radiation | |
KR20000012090A (en) | Assembly having module type jack and radiation diode | |
HK1017227A1 (en) | A two-part electromagnetic radiation shielding device for mounting on a printed circuit board. | |
AU2001247879A1 (en) | Emi and rfi shielding for printed circuit boards | |
ES2169687A1 (es) | Unidad electronica de control con elemento de activacion y elemento detratamiento de control. | |
TW525838U (en) | Electrical connector having printed circuit board mounted therein | |
AU7036200A (en) | A printed circuit board assembly | |
WO2002039490A3 (en) | A power distribution printed circuit board for a semiconductor processing system | |
MY136587A (en) | Method for producing an electrical circuit | |
MY121435A (en) | Surface mounting part | |
HK1020394A1 (en) | Substrate for semiconductor device, semiconductor device and method for manufacturing the same, circuit board, and electronic equipment | |
TW528218U (en) | Electrical connector having printed circuit board mounted therein | |
SG126772A1 (en) | An integrated circuit assembly | |
TW536015U (en) | Shielded electrical connector for mounting on a printed circuit board | |
HK1050608A1 (en) | Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard. | |
TW200520676A (en) | An electronic apparatus for the reduction of electronic magnetic interference | |
TW403254U (en) | Layout structure for installing two connectors on both sides of printed circuit board | |
WO2003096414A3 (fr) | Assemblage de composants de puissance sur un circuit imprime ainsi qu'un procede d'un tel assemblage |