FR2722334B1 - Support actif pour circuit integre, notamment pour un processeur - Google Patents
Support actif pour circuit integre, notamment pour un processeurInfo
- Publication number
- FR2722334B1 FR2722334B1 FR9408333A FR9408333A FR2722334B1 FR 2722334 B1 FR2722334 B1 FR 2722334B1 FR 9408333 A FR9408333 A FR 9408333A FR 9408333 A FR9408333 A FR 9408333A FR 2722334 B1 FR2722334 B1 FR 2722334B1
- Authority
- FR
- France
- Prior art keywords
- processor
- integrated circuit
- active support
- active
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0262—Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10196—Variable component, e.g. variable resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9408333A FR2722334B1 (fr) | 1994-07-06 | 1994-07-06 | Support actif pour circuit integre, notamment pour un processeur |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9408333A FR2722334B1 (fr) | 1994-07-06 | 1994-07-06 | Support actif pour circuit integre, notamment pour un processeur |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2722334A1 FR2722334A1 (fr) | 1996-01-12 |
FR2722334B1 true FR2722334B1 (fr) | 1997-01-17 |
Family
ID=9465055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9408333A Expired - Fee Related FR2722334B1 (fr) | 1994-07-06 | 1994-07-06 | Support actif pour circuit integre, notamment pour un processeur |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2722334B1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6623279B2 (en) | 1999-07-15 | 2003-09-23 | Incep Technologies, Inc. | Separable power delivery connector |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5864478A (en) * | 1996-06-28 | 1999-01-26 | Intel Corporation | Power pod/power delivery system |
FR2772998B1 (fr) * | 1997-12-23 | 2000-02-11 | Aerospatiale | Dispositif et procede d'interconnexion entre deux dispositifs electroniques |
US6556455B2 (en) | 1999-07-15 | 2003-04-29 | Incep Technologies, Inc. | Ultra-low impedance power interconnection system for electronic packages |
US6452113B2 (en) | 1999-07-15 | 2002-09-17 | Incep Technologies, Inc. | Apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US20030214800A1 (en) | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
WO2001065344A2 (fr) * | 2000-02-18 | 2001-09-07 | Incep Technologies, Inc. | Procede et appareil d'alimentation en courant d'un microprocesseur a gestion de chaleur integree et d'interference electromagnetique |
US6992378B2 (en) * | 2000-12-30 | 2006-01-31 | Intel Corporation | Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4872844A (en) * | 1988-07-08 | 1989-10-10 | Amp Incorporated | Component-carrying adapter for chip carrier socket |
EP0641046B1 (fr) * | 1993-08-31 | 1998-04-08 | Advanced Micro Devices, Inc. | Appareil pour modifier un signal électrique |
-
1994
- 1994-07-06 FR FR9408333A patent/FR2722334B1/fr not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6623279B2 (en) | 1999-07-15 | 2003-09-23 | Incep Technologies, Inc. | Separable power delivery connector |
Also Published As
Publication number | Publication date |
---|---|
FR2722334A1 (fr) | 1996-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100331 |