ATE360889T1 - Elektronischer aufbau mit substrat und eingebettetem kondensator und herstellungsverfahren - Google Patents

Elektronischer aufbau mit substrat und eingebettetem kondensator und herstellungsverfahren

Info

Publication number
ATE360889T1
ATE360889T1 AT01959277T AT01959277T ATE360889T1 AT E360889 T1 ATE360889 T1 AT E360889T1 AT 01959277 T AT01959277 T AT 01959277T AT 01959277 T AT01959277 T AT 01959277T AT E360889 T1 ATE360889 T1 AT E360889T1
Authority
AT
Austria
Prior art keywords
capacitor
substrate
manufacturing
electronic structure
embedded
Prior art date
Application number
AT01959277T
Other languages
German (de)
English (en)
Inventor
Kishore Chakravorty
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE360889T1 publication Critical patent/ATE360889T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Die Bonding (AREA)
AT01959277T 2000-07-31 2001-07-26 Elektronischer aufbau mit substrat und eingebettetem kondensator und herstellungsverfahren ATE360889T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/631,037 US6611419B1 (en) 2000-07-31 2000-07-31 Electronic assembly comprising substrate with embedded capacitors

Publications (1)

Publication Number Publication Date
ATE360889T1 true ATE360889T1 (de) 2007-05-15

Family

ID=24529522

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01959277T ATE360889T1 (de) 2000-07-31 2001-07-26 Elektronischer aufbau mit substrat und eingebettetem kondensator und herstellungsverfahren

Country Status (9)

Country Link
US (1) US6611419B1 (enExample)
EP (2) EP1515365B1 (enExample)
JP (1) JP2004505469A (enExample)
KR (1) KR100591217B1 (enExample)
CN (1) CN100492628C (enExample)
AT (1) ATE360889T1 (enExample)
AU (1) AU2001280850A1 (enExample)
DE (1) DE60128145T2 (enExample)
WO (1) WO2002011207A2 (enExample)

Families Citing this family (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US6970362B1 (en) * 2000-07-31 2005-11-29 Intel Corporation Electronic assemblies and systems comprising interposer with embedded capacitors
JP4129717B2 (ja) * 2001-05-30 2008-08-06 株式会社ルネサステクノロジ 半導体装置
US7385286B2 (en) * 2001-06-05 2008-06-10 Matsushita Electric Industrial Co., Ltd. Semiconductor module
JPWO2003007379A1 (ja) * 2001-07-12 2004-11-04 株式会社日立製作所 電子回路部品
JP3967108B2 (ja) * 2001-10-26 2007-08-29 富士通株式会社 半導体装置およびその製造方法
US8749054B2 (en) 2010-06-24 2014-06-10 L. Pierre de Rochemont Semiconductor carrier with vertical power FET module
JP2004079701A (ja) * 2002-08-14 2004-03-11 Sony Corp 半導体装置及びその製造方法
JP4243117B2 (ja) * 2002-08-27 2009-03-25 新光電気工業株式会社 半導体パッケージとその製造方法および半導体装置
US6844505B1 (en) * 2002-11-04 2005-01-18 Ncr Corporation Reducing noise effects in circuit boards
US20040231885A1 (en) * 2003-03-07 2004-11-25 Borland William J. Printed wiring boards having capacitors and methods of making thereof
US7626828B1 (en) * 2003-07-30 2009-12-01 Teradata Us, Inc. Providing a resistive element between reference plane layers in a circuit board
US8569142B2 (en) * 2003-11-28 2013-10-29 Blackberry Limited Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
US6943294B2 (en) * 2003-12-22 2005-09-13 Intel Corporation Integrating passive components on spacer in stacked dies
US7132743B2 (en) * 2003-12-23 2006-11-07 Intel Corporation Integrated circuit package substrate having a thin film capacitor structure
US7256980B2 (en) * 2003-12-30 2007-08-14 Du Pont Thin film capacitors on ceramic
US20050154105A1 (en) * 2004-01-09 2005-07-14 Summers John D. Compositions with polymers for advanced materials
US20070019789A1 (en) * 2004-03-29 2007-01-25 Jmar Research, Inc. Systems and methods for achieving a required spot says for nanoscale surface analysis using soft x-rays
JP2005286112A (ja) * 2004-03-30 2005-10-13 Airex Inc プリント配線板及びその製造方法
KR101053587B1 (ko) * 2004-06-04 2011-08-03 엘지전자 주식회사 세탁기의 원격제어용 기판 어셈블리
US20060001149A1 (en) * 2004-06-30 2006-01-05 Victor Prokofiev Packaged substrate having variable width conductors and a variably spaced reference plane
US7216406B2 (en) * 2004-09-29 2007-05-15 Intel Corporation Method forming split thin film capacitors with multiple voltages
WO2006039699A2 (en) 2004-10-01 2006-04-13 De Rochemont L Pierre Ceramic antenna module and methods of manufacture thereof
US7501698B2 (en) * 2004-10-26 2009-03-10 Kabushiki Kaisha Toshiba Method and system for an improved power distribution network for use with a semiconductor device
US7269029B2 (en) * 2004-11-09 2007-09-11 International Business Machines Corporation Rapid fire test board
US20060158828A1 (en) * 2004-12-21 2006-07-20 Amey Daniel I Jr Power core devices and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
TWI414218B (zh) * 2005-02-09 2013-11-01 日本特殊陶業股份有限公司 配線基板及配線基板內建用之電容器
WO2006104613A2 (en) 2005-03-01 2006-10-05 X2Y Attenuators, Llc Conditioner with coplanar conductors
US7548432B2 (en) * 2005-03-24 2009-06-16 Agency For Science, Technology And Research Embedded capacitor structure
US7492570B2 (en) * 2005-04-13 2009-02-17 Kabushiki Kaisha Toshiba Systems and methods for reducing simultaneous switching noise in an integrated circuit
US20060289976A1 (en) * 2005-06-23 2006-12-28 Intel Corporation Pre-patterned thin film capacitor and method for embedding same in a package substrate
EP1964159A4 (en) * 2005-06-30 2017-09-27 L. Pierre De Rochemont Electrical components and method of manufacture
US8350657B2 (en) 2005-06-30 2013-01-08 Derochemont L Pierre Power management module and method of manufacture
US7621041B2 (en) 2005-07-11 2009-11-24 E. I. Du Pont De Nemours And Company Methods for forming multilayer structures
US7435627B2 (en) * 2005-08-11 2008-10-14 International Business Machines Corporation Techniques for providing decoupling capacitance
US7705423B2 (en) * 2005-10-21 2010-04-27 Georgia Tech Research Corporation Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit
US7456459B2 (en) * 2005-10-21 2008-11-25 Georgia Tech Research Corporation Design of low inductance embedded capacitor layer connections
US7504706B2 (en) * 2005-10-21 2009-03-17 E. I. Du Pont De Nemours Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
US7701052B2 (en) * 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices
US8520402B1 (en) * 2005-10-25 2013-08-27 Xilinx, Inc. Decoupling capacitor circuit assembly
US8354294B2 (en) 2006-01-24 2013-01-15 De Rochemont L Pierre Liquid chemical deposition apparatus and process and products therefrom
KR100744903B1 (ko) 2006-02-22 2007-08-01 삼성전기주식회사 디커플링 기능을 갖는 다층 기판
US7848512B2 (en) * 2006-03-27 2010-12-07 Kurt Eldracher Personal audio device accessory
US20080019552A1 (en) * 2006-03-27 2008-01-24 Kurt Eldracher Personal audio device accessory
US20070244267A1 (en) * 2006-04-10 2007-10-18 Dueber Thomas E Hydrophobic crosslinkable compositions for electronic applications
US20070236859A1 (en) * 2006-04-10 2007-10-11 Borland William J Organic encapsulant compositions for protection of electronic components
US20070291440A1 (en) * 2006-06-15 2007-12-20 Dueber Thomas E Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components
US7751205B2 (en) * 2006-07-10 2010-07-06 Ibiden Co., Ltd. Package board integrated with power supply
TWI326908B (en) * 2006-09-11 2010-07-01 Ind Tech Res Inst Packaging structure and fabricating method thereof
US7902662B2 (en) * 2007-04-02 2011-03-08 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7841075B2 (en) * 2007-06-19 2010-11-30 E. I. Du Pont De Nemours And Company Methods for integration of thin-film capacitors into the build-up layers of a PWB
US7791896B1 (en) 2007-06-20 2010-09-07 Teradata Us, Inc. Providing an embedded capacitor in a circuit board
TWI364824B (en) * 2007-08-08 2012-05-21 Advanced Semiconductor Eng Semiconductor structure and method of fabricating the same
US8564967B2 (en) 2007-12-03 2013-10-22 Cda Processing Limited Liability Company Device and method for reducing impedance
US7863724B2 (en) * 2008-02-12 2011-01-04 International Business Machines Corporation Circuit substrate having post-fed die side power supply connections
US7959598B2 (en) 2008-08-20 2011-06-14 Asante Solutions, Inc. Infusion pump systems and methods
FI20095110A0 (fi) 2009-02-06 2009-02-06 Imbera Electronics Oy Elektroniikkamoduuli, jossa on EMI-suoja
US8409963B2 (en) * 2009-04-28 2013-04-02 CDA Procesing Limited Liability Company Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers
US8391017B2 (en) * 2009-04-28 2013-03-05 Georgia Tech Research Corporation Thin-film capacitor structures embedded in semiconductor packages and methods of making
US8952858B2 (en) 2009-06-17 2015-02-10 L. Pierre de Rochemont Frequency-selective dipole antennas
US8922347B1 (en) 2009-06-17 2014-12-30 L. Pierre de Rochemont R.F. energy collection circuit for wireless devices
KR101169531B1 (ko) * 2009-07-03 2012-07-27 가부시키가이샤 테라미크로스 반도체구성체 및 그 제조방법과 반도체장치 및 그 제조방법
WO2011077918A1 (ja) * 2009-12-24 2011-06-30 株式会社村田製作所 回路モジュール
US8552708B2 (en) 2010-06-02 2013-10-08 L. Pierre de Rochemont Monolithic DC/DC power management module with surface FET
US9023493B2 (en) 2010-07-13 2015-05-05 L. Pierre de Rochemont Chemically complex ablative max-phase material and method of manufacture
US8415781B2 (en) * 2010-08-09 2013-04-09 Ibiden Co., Ltd. Electronic component and method for manufacturing the same
WO2012027412A1 (en) 2010-08-23 2012-03-01 De Rochemont L Pierre Power fet with a resonant transistor gate
WO2012061656A2 (en) 2010-11-03 2012-05-10 De Rochemont L Pierre Semiconductor chip carriers with monolithically integrated quantum dot devices and method of manufacture thereof
US20120292777A1 (en) * 2011-05-18 2012-11-22 Lotz Jonathan P Backside Power Delivery Using Die Stacking
FR2987545B1 (fr) * 2012-02-23 2015-02-06 Thales Sa Circuit imprime de structure multicouche comprenant des lignes de transmission a faibles pertes dielectriques et son procede
KR101472628B1 (ko) * 2012-07-02 2014-12-15 삼성전기주식회사 커패시터 내장형 기판
WO2014172467A1 (en) 2013-04-16 2014-10-23 Smartloop Llc Discretionary insulin delivery systems and methods
US9561324B2 (en) 2013-07-19 2017-02-07 Bigfoot Biomedical, Inc. Infusion pump system and method
KR102078015B1 (ko) 2013-11-07 2020-04-07 삼성전기주식회사 커패시터 내장형 저온동시소성 세라믹 기판
TWI529906B (zh) * 2013-12-09 2016-04-11 矽品精密工業股份有限公司 半導體封裝件之製法
US9628052B2 (en) * 2014-02-18 2017-04-18 Qualcomm Incorporated Embedded multi-terminal capacitor
US9659850B2 (en) * 2014-12-08 2017-05-23 Qualcomm Incorporated Package substrate comprising capacitor, redistribution layer and discrete coaxial connection
KR102365103B1 (ko) * 2014-12-12 2022-02-21 삼성전자주식회사 반도체 패키지
JP2016162904A (ja) * 2015-03-03 2016-09-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US9971970B1 (en) 2015-04-27 2018-05-15 Rigetti & Co, Inc. Microwave integrated quantum circuits with VIAS and methods for making the same
EP3374905A1 (en) 2016-01-13 2018-09-19 Bigfoot Biomedical, Inc. User interface for diabetes management system
HK1256995A1 (zh) 2016-01-14 2019-10-11 Bigfoot Biomedical, Inc. 药物输送设备、系统和方法中的阻塞解决方案
EP4545005A3 (en) 2016-01-14 2025-07-02 Insulet Corporation Adjusting insulin delivery rates
US12383166B2 (en) 2016-05-23 2025-08-12 Insulet Corporation Insulin delivery system and methods with risk-based set points
EP3646905B1 (en) 2016-05-26 2021-06-23 Insulet Corporation Single dose drug delivery device
AU2017376111B2 (en) 2016-12-12 2023-02-02 Bigfoot Biomedical, Inc. Alarms and alerts for medication delivery devices and related systems and methods
US10978403B2 (en) 2019-01-30 2021-04-13 Delta Electronics, Inc. Package structure and method for fabricating the same
WO2018125231A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Electronic chip with under-side power block
US10758675B2 (en) 2017-01-13 2020-09-01 Bigfoot Biomedical, Inc. System and method for adjusting insulin delivery
US10500334B2 (en) 2017-01-13 2019-12-10 Bigfoot Biomedical, Inc. System and method for adjusting insulin delivery
US10583250B2 (en) 2017-01-13 2020-03-10 Bigfoot Biomedical, Inc. System and method for adjusting insulin delivery
EP4708310A3 (en) 2017-01-13 2026-05-06 Insulet Corporation Insulin delivery methods, systems and devices
US10881793B2 (en) 2017-01-13 2021-01-05 Bigfoot Biomedical, Inc. System and method for adjusting insulin delivery
EP4708311A3 (en) 2017-01-13 2026-05-20 Insulet Corporation METHODS, SYSTEMS AND DEVICES FOR INSULIN ADMINISTRATION
USD874471S1 (en) 2017-06-08 2020-02-04 Insulet Corporation Display screen with a graphical user interface
US11121301B1 (en) 2017-06-19 2021-09-14 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafers and their methods of manufacture
US12653426B2 (en) 2017-07-13 2026-06-16 Bigfoot Biomedical, Inc. Multi-scale display of blood glucose information
US10134712B1 (en) 2017-08-23 2018-11-20 Micron Technology, Inc. Methods and systems for improving power delivery and signaling in stacked semiconductor devices
USD928199S1 (en) 2018-04-02 2021-08-17 Bigfoot Biomedical, Inc. Medication delivery device with icons
US12562251B1 (en) 2018-05-09 2026-02-24 Bigfoot Biomedical, Inc. Computing architecture for assuring the provenance of medication therapy related parameters, and related systems, methods and devices
JP7430718B2 (ja) 2018-10-18 2024-02-13 スモルテク アクティエボラーグ ディスクリート金属－絶縁体－金属（ｍｉｍ）エネルギー蓄積部品及びその製造方法
TW202038266A (zh) * 2018-11-26 2020-10-16 瑞典商斯莫勒科技公司 具有離散的能量儲存構件之半導體組件
USD920343S1 (en) 2019-01-09 2021-05-25 Bigfoot Biomedical, Inc. Display screen or portion thereof with graphical user interface associated with insulin delivery
US11404388B2 (en) 2019-04-29 2022-08-02 Qualcomm Incorporated Surface mount passive component shorted together and a die
US11202375B2 (en) * 2019-04-29 2021-12-14 Qualcomm Incorporated Surface mount passive component shorted together
USD977502S1 (en) 2020-06-09 2023-02-07 Insulet Corporation Display screen with graphical user interface
JP7351266B2 (ja) * 2020-07-07 2023-09-27 信越半導体株式会社 半導体装置の製造方法
JP7665028B2 (ja) 2020-12-18 2025-04-18 インスレット コーポレイション 薬物送達デバイスによる将来の日付および時刻における薬物ボーラス送達の、コンピューティングデバイスを用いたスケジュール設定
US12514980B2 (en) 2021-06-30 2026-01-06 Insulet Corporation Adjustment of medicament delivery by a medicament delivery device based on menstrual cycle phase
US12521486B2 (en) 2021-07-16 2026-01-13 Insulet Corporation Method for modification of insulin delivery during pregnancy in automatic insulin delivery systems
US12653949B2 (en) 2021-07-29 2026-06-16 Insulet Corporation Adaptation of medicament delivery in response to user stress load
EP4511843A1 (en) 2022-04-21 2025-02-26 Insulet Corporation Insulin adaptation and safety monitoring for sick day management
CN119563278A (zh) * 2022-07-18 2025-03-04 麦格纳动力系有限两合公司 使驱动回路电感和功率回路电感最小化的多相功率转换器电路布局
KR20250129777A (ko) 2023-01-06 2025-08-29 인슐렛 코포레이션 후속 자동 안전 제약 완화를 갖는 자동으로 또는 수동으로 개시되는 음식 볼러스 전달
JP2025102000A (ja) * 2023-12-26 2025-07-08 Tdk株式会社 電流制御モジュール、並びに、これを備えるバッテリー及び電子機器

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4926241A (en) 1988-02-19 1990-05-15 Microelectronics And Computer Technology Corporation Flip substrate for chip mount
EP0359513A3 (en) 1988-09-14 1990-12-19 Hitachi, Ltd. Semiconductor chip carrier and method of making it
US5060116A (en) 1990-04-20 1991-10-22 Grobman Warren D Electronics system with direct write engineering change capability
US5177594A (en) 1991-01-09 1993-01-05 International Business Machines Corporation Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance
US5177670A (en) 1991-02-08 1993-01-05 Hitachi, Ltd. Capacitor-carrying semiconductor module
JP2966972B2 (ja) 1991-07-05 1999-10-25 株式会社日立製作所 半導体チップキャリアとそれを実装したモジュール及びそれを組み込んだ電子機器
US5800575A (en) 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
JPH05335183A (ja) 1992-05-28 1993-12-17 Murata Mfg Co Ltd 多層基板を備えた電子部品及びその製造方法
US5354955A (en) 1992-12-02 1994-10-11 International Business Machines Corporation Direct jump engineering change system
US5377139A (en) 1992-12-11 1994-12-27 Motorola, Inc. Process forming an integrated circuit
JP3325351B2 (ja) * 1993-08-18 2002-09-17 株式会社東芝 半導体装置
US5523619A (en) * 1993-11-03 1996-06-04 International Business Machines Corporation High density memory structure
JP3309522B2 (ja) 1993-11-15 2002-07-29 株式会社村田製作所 多層基板及びその製造方法
US5639989A (en) 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
US5469324A (en) 1994-10-07 1995-11-21 Storage Technology Corporation Integrated decoupling capacitive core for a printed circuit board and method of making same
JPH08167630A (ja) * 1994-12-15 1996-06-25 Hitachi Ltd チップ接続構造
JPH08172274A (ja) 1994-12-20 1996-07-02 Murata Mfg Co Ltd セラミック多層基板
US5714801A (en) * 1995-03-31 1998-02-03 Kabushiki Kaisha Toshiba Semiconductor package
US5818699A (en) 1995-07-05 1998-10-06 Kabushiki Kaisha Toshiba Multi-chip module and production method thereof
US5691568A (en) 1996-05-31 1997-11-25 Lsi Logic Corporation Wire bondable package design with maxium electrical performance and minimum number of layers
US5796587A (en) 1996-06-12 1998-08-18 International Business Machines Corporation Printed circut board with embedded decoupling capacitance and method for producing same
US5745335A (en) 1996-06-27 1998-04-28 Gennum Corporation Multi-layer film capacitor structures and method
US5949654A (en) 1996-07-03 1999-09-07 Kabushiki Kaisha Toshiba Multi-chip module, an electronic device, and production method thereof
TW424321B (en) * 1996-10-31 2001-03-01 Sharp Kk Integrated electronic circuit
JP3882954B2 (ja) 1997-03-19 2007-02-21 Ｔｄｋ株式会社 チップ型積層セラミックコンデンサ
US6072690A (en) * 1998-01-15 2000-06-06 International Business Machines Corporation High k dielectric capacitor with low k sheathed signal vias
US6075427A (en) 1998-01-23 2000-06-13 Lucent Technologies Inc. MCM with high Q overlapping resonator
US5939782A (en) * 1998-03-03 1999-08-17 Sun Microsystems, Inc. Package construction for integrated circuit chip with bypass capacitor
US6218729B1 (en) * 1999-03-11 2001-04-17 Atmel Corporation Apparatus and method for an integrated circuit having high Q reactive components
US6183669B1 (en) * 1999-03-25 2001-02-06 Murata Manufacturing Co., Ltd. Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate
US6252761B1 (en) 1999-09-15 2001-06-26 National Semiconductor Corporation Embedded multi-layer ceramic capacitor in a low-temperature con-fired ceramic (LTCC) substrate
US6452776B1 (en) 2000-04-06 2002-09-17 Intel Corporation Capacitor with defect isolation and bypass

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DE60128145D1 (de) 2007-06-06
CN100492628C (zh) 2009-05-27
KR20020042698A (ko) 2002-06-05
US6611419B1 (en) 2003-08-26
EP1358675A2 (en) 2003-11-05
WO2002011207A3 (en) 2003-08-28
EP1515365B1 (en) 2010-03-31
KR100591217B1 (ko) 2006-06-22
JP2004505469A (ja) 2004-02-19
EP1515365A3 (en) 2006-10-04
DE60128145T2 (de) 2008-01-03
EP1358675B1 (en) 2007-04-25
WO2002011207A2 (en) 2002-02-07
CN1470069A (zh) 2004-01-21
AU2001280850A1 (en) 2002-02-13
EP1515365A2 (en) 2005-03-16

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