ATE276638T1 - Heizplatteneinheit - Google Patents

Heizplatteneinheit

Info

Publication number
ATE276638T1
ATE276638T1 AT01926082T AT01926082T ATE276638T1 AT E276638 T1 ATE276638 T1 AT E276638T1 AT 01926082 T AT01926082 T AT 01926082T AT 01926082 T AT01926082 T AT 01926082T AT E276638 T1 ATE276638 T1 AT E276638T1
Authority
AT
Austria
Prior art keywords
plate unit
substrate
heating plate
supporting case
temperature
Prior art date
Application number
AT01926082T
Other languages
English (en)
Inventor
Yasuji Hiramatsu
Yasutaka Ito
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of ATE276638T1 publication Critical patent/ATE276638T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Lubricants (AREA)
  • Laminated Bodies (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Control Of Resistance Heating (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT01926082T 2000-05-02 2001-05-01 Heizplatteneinheit ATE276638T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000133534 2000-05-02
JP2000305175A JP2002025758A (ja) 2000-05-02 2000-10-04 ホットプレートユニット
PCT/JP2001/003757 WO2001087018A1 (fr) 2000-05-02 2001-05-01 Unite de plaque de cuisson

Publications (1)

Publication Number Publication Date
ATE276638T1 true ATE276638T1 (de) 2004-10-15

Family

ID=26591421

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01926082T ATE276638T1 (de) 2000-05-02 2001-05-01 Heizplatteneinheit

Country Status (6)

Country Link
US (1) US20030089699A1 (de)
EP (3) EP1463382A1 (de)
JP (1) JP2002025758A (de)
AT (1) ATE276638T1 (de)
DE (1) DE60105529T2 (de)
WO (1) WO2001087018A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1550477A (zh) * 1999-09-06 2004-12-01 Ibiden股份有限公司 含碳的氮化铝烧结体，用于半导体制造/检测设备的基材
WO2001062686A1 (fr) * 2000-02-24 2001-08-30 Ibiden Co., Ltd. Piece frittee en nitrure d'aluminium, substrat en ceramique, corps chauffant en ceramique et mandrin electrostatique
JP2001247382A (ja) * 2000-03-06 2001-09-11 Ibiden Co Ltd セラミック基板
EP1233651A1 (de) * 2000-04-07 2002-08-21 Ibiden Co., Ltd. Keramisches heizelement
JP3516392B2 (ja) * 2000-06-16 2004-04-05 イビデン株式会社 半導体製造・検査装置用ホットプレート
EP1248293A1 (de) * 2000-07-25 2002-10-09 Ibiden Co., Ltd. Keramiksubstrat für halbleiterfertigungs-, inspektionsapparat, keramikheizer, elektrostatisch, klammerloser halter und substrat für scheibentester
JP3791432B2 (ja) 2002-02-27 2006-06-28 住友電気工業株式会社 半導体製造用加熱装置
US7202494B2 (en) * 2003-06-26 2007-04-10 Rj Mears, Llc FINFET including a superlattice
JP3918806B2 (ja) * 2003-11-20 2007-05-23 住友電気工業株式会社 被加熱物載置用ヒータ部材及び加熱処理装置
US7330369B2 (en) * 2004-04-06 2008-02-12 Bao Tran NANO-electronic memory array
US20060088692A1 (en) * 2004-10-22 2006-04-27 Ibiden Co., Ltd. Ceramic plate for a semiconductor producing/examining device
US7126093B2 (en) * 2005-02-23 2006-10-24 Ngk Insulators, Ltd. Heating systems
US20070249098A1 (en) * 2006-04-21 2007-10-25 Raymond Charles Cady Bonding plate mechanism for use in anodic bonding
US20070251938A1 (en) * 2006-04-26 2007-11-01 Watlow Electric Manufacturing Company Ceramic heater and method of securing a thermocouple thereto
NL1037065C2 (nl) * 2009-06-23 2010-12-27 Edward Bok Stripvormige transducer-opstelling, welke is opgenomen in een stripvormig gedeelte van een tunnelblok van een semiconductor substraat transfer/behandelings-tunnelopstelling ten behoeve van het daarmede tenminste mede plaatsvinden van een semiconductor behandeling van de opvolgende semiconductor substraat-gedeeltes, welke gedurende de werking ervan ononderbroken erlangs verplaatsen.
JP5570938B2 (ja) * 2009-12-11 2014-08-13 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5780062B2 (ja) * 2011-08-30 2015-09-16 東京エレクトロン株式会社 基板処理装置及び成膜装置
JP6219229B2 (ja) * 2014-05-19 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構
US10658160B2 (en) * 2014-11-12 2020-05-19 Tokyo Electron Limited Stage and substrate processing apparatus
US9887478B2 (en) * 2015-04-21 2018-02-06 Varian Semiconductor Equipment Associates, Inc. Thermally insulating electrical contact probe
US10681778B2 (en) 2017-11-21 2020-06-09 Watlow Electric Manufacturing Company Integrated heater and method of manufacture
TWI697253B (zh) * 2018-05-22 2020-06-21 美商瓦特洛威電子製造公司 一體式加熱器及製造方法
US20200386392A1 (en) * 2019-06-10 2020-12-10 Applied Materials, Inc. Heat exchange arrangement for light emitting diode lamp modules
KR102282145B1 (ko) * 2019-11-04 2021-07-29 세메스 주식회사 기판 처리 장치 및 방법

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2647799B2 (ja) * 1994-02-04 1997-08-27 日本碍子株式会社 セラミックスヒーター及びその製造方法
JP3304738B2 (ja) * 1996-02-06 2002-07-22 シャープ株式会社 調理器
JPH09260474A (ja) * 1996-03-22 1997-10-03 Sony Corp 静電チャックおよびウエハステージ
JPH10284360A (ja) * 1997-04-02 1998-10-23 Hitachi Ltd 基板温度制御装置及び方法
JPH10284382A (ja) * 1997-04-07 1998-10-23 Komatsu Ltd 温度制御装置
WO1999018602A1 (en) * 1997-10-08 1999-04-15 Applied Materials, Inc. Foam-based heat exchanger with heating element
JP3246891B2 (ja) * 1998-02-03 2002-01-15 東京エレクトロン株式会社 熱処理装置
JPH11224127A (ja) * 1998-02-06 1999-08-17 Komatsu Ltd 温度制御装置
US6359264B1 (en) * 1998-03-11 2002-03-19 Applied Materials, Inc. Thermal cycling module
WO1999049101A1 (en) * 1998-03-23 1999-09-30 Mattson Technology, Inc. Apparatus and method for cvd and thermal processing of semiconductor substrates
US5973298A (en) * 1998-04-27 1999-10-26 White Consolidated Industries, Inc. Circular film heater and porcelain enamel cooktop
US6336775B1 (en) * 1998-08-20 2002-01-08 Matsushita Electric Industrial Co., Ltd. Gas floating apparatus, gas floating-transporting apparatus, and thermal treatment apparatus
US6639191B2 (en) * 1999-01-25 2003-10-28 Ibiden Co., Ltd. Hot plate unit
US6228171B1 (en) * 1999-01-29 2001-05-08 Tokyo Electron Ltd. Heat processing apparatus
JP3348712B2 (ja) * 1999-02-10 2002-11-20 イビデン株式会社 ホットプレートユニット
JP2001118664A (ja) * 1999-08-09 2001-04-27 Ibiden Co Ltd セラミックヒータ
DE60021848T2 (de) * 1999-11-19 2006-06-08 Ibiden Co., Ltd. Keramisches heizgerät
EP1137321A1 (de) * 1999-11-30 2001-09-26 Ibiden Co., Ltd. Keramisches heizelement
JP3228924B2 (ja) * 2000-01-21 2001-11-12 イビデン株式会社 半導体製造・検査装置用セラミックヒータ
JP2001244320A (ja) * 2000-02-25 2001-09-07 Ibiden Co Ltd セラミック基板およびその製造方法
US6399926B2 (en) * 2000-04-03 2002-06-04 Sigmameltec Ltd. Heat-treating apparatus capable of high temperature uniformity
US6677557B2 (en) * 2000-05-02 2004-01-13 Ibiden Co., Ltd. Ceramic heater

Also Published As

Publication number Publication date
DE60105529T2 (de) 2005-11-17
DE60105529D1 (de) 2004-10-21
WO2001087018A1 (fr) 2001-11-15
JP2002025758A (ja) 2002-01-25
EP1463381A1 (de) 2004-09-29
EP1211912A4 (de) 2003-02-12
EP1211912B1 (de) 2004-09-15
US20030089699A1 (en) 2003-05-15
EP1211912A1 (de) 2002-06-05
EP1463382A1 (de) 2004-09-29

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Legal Events

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