ATE273403T1 - Verfahren und vorrichtung zur herstellung von substraten mit dünnen filmen - Google Patents
Verfahren und vorrichtung zur herstellung von substraten mit dünnen filmenInfo
- Publication number
- ATE273403T1 ATE273403T1 AT97908528T AT97908528T ATE273403T1 AT E273403 T1 ATE273403 T1 AT E273403T1 AT 97908528 T AT97908528 T AT 97908528T AT 97908528 T AT97908528 T AT 97908528T AT E273403 T1 ATE273403 T1 AT E273403T1
- Authority
- AT
- Austria
- Prior art keywords
- film
- film forming
- substrate
- chamber
- substrates
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 16
- 239000010409 thin film Substances 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 5
- 239000010408 film Substances 0.000 abstract 24
- 238000004519 manufacturing process Methods 0.000 abstract 5
- 238000011144 upstream manufacturing Methods 0.000 abstract 4
- 238000007796 conventional method Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Physical Vapour Deposition (AREA)
- Inorganic Insulating Materials (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7884096 | 1996-04-01 | ||
| PCT/JP1997/001054 WO1997037051A1 (fr) | 1996-04-01 | 1997-03-27 | Procede de fabrication d'un substrat a couche mince et dispositif de fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE273403T1 true ATE273403T1 (de) | 2004-08-15 |
Family
ID=13673031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT97908528T ATE273403T1 (de) | 1996-04-01 | 1997-03-27 | Verfahren und vorrichtung zur herstellung von substraten mit dünnen filmen |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5993614A (enExample) |
| EP (1) | EP0834596B1 (enExample) |
| KR (1) | KR19990022135A (enExample) |
| AT (1) | ATE273403T1 (enExample) |
| DE (1) | DE69730185T2 (enExample) |
| TW (1) | TW320687B (enExample) |
| WO (1) | WO1997037051A1 (enExample) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3370806B2 (ja) * | 1994-11-25 | 2003-01-27 | 株式会社半導体エネルギー研究所 | Mis型半導体装置の作製方法 |
| US6742066B2 (en) * | 1999-05-17 | 2004-05-25 | Hewlett-Packard Development Company, L.P. | System and method for controlling remote console functionality assist logic |
| US6275744B1 (en) * | 1997-08-01 | 2001-08-14 | Kokusai Electric Co., Ltd. | Substrate feed control |
| US6556189B1 (en) * | 1998-04-24 | 2003-04-29 | Nissha Printing Co., Ltd. | Touch panel device |
| JP4345158B2 (ja) * | 1999-10-15 | 2009-10-14 | ソニー株式会社 | 光学部品の製造装置及び製造方法 |
| KR100323991B1 (ko) * | 1999-11-16 | 2002-02-16 | 이경희 | 박막 제조 방법 및 제조 장치 |
| TW490714B (en) | 1999-12-27 | 2002-06-11 | Semiconductor Energy Lab | Film formation apparatus and method for forming a film |
| US20020011205A1 (en) | 2000-05-02 | 2002-01-31 | Shunpei Yamazaki | Film-forming apparatus, method of cleaning the same, and method of manufacturing a light-emitting device |
| US6881269B2 (en) * | 2000-08-17 | 2005-04-19 | Novartis Ag | Lens plasma coating system |
| CN1216302C (zh) * | 2001-02-27 | 2005-08-24 | 精工爱普生株式会社 | 多层膜截止滤波器及其制造方法 |
| JP2002363733A (ja) * | 2001-06-04 | 2002-12-18 | Nippon Sheet Glass Co Ltd | 被膜の形成方法 |
| JP4120546B2 (ja) * | 2002-10-04 | 2008-07-16 | 株式会社Ihi | 薄膜形成方法及び装置並びに太陽電池の製造方法及び装置並びに太陽電池 |
| US20040121146A1 (en) * | 2002-12-20 | 2004-06-24 | Xiao-Ming He | Composite barrier films and method |
| JP4476073B2 (ja) * | 2004-04-08 | 2010-06-09 | 東北パイオニア株式会社 | 有機el素子の製造方法及び製造装置 |
| JP2006058473A (ja) * | 2004-08-18 | 2006-03-02 | Oyokoden Lab Co Ltd | 誘電体多層膜フィルタ及びその製造方法 |
| WO2006024031A2 (en) | 2004-08-23 | 2006-03-02 | Hewlett-Packard Development Company, L.P. | Method and apparatus for redirection of video data |
| KR101017187B1 (ko) * | 2004-08-31 | 2011-02-25 | 엘지디스플레이 주식회사 | 스토커 시스템 |
| US20060181266A1 (en) * | 2005-02-14 | 2006-08-17 | Panelvision Technology, A California Corporation | Flat panel display inspection system |
| JP4462197B2 (ja) * | 2006-01-23 | 2010-05-12 | ソニー株式会社 | 光学ローパスフィルタ |
| DE102006057386A1 (de) * | 2006-12-04 | 2008-06-05 | Uhde Gmbh | Verfahren zum Beschichten von Substraten |
| US8318245B2 (en) | 2007-02-23 | 2012-11-27 | Essilor International (Compagnie Generale D'optique) | Method for producing an optical article coated with an antireflection or a reflective coating having improved adhesion and abrasion resistance properties |
| FR2913116B1 (fr) * | 2007-02-23 | 2009-08-28 | Essilor Int | Procede de fabrication d'un article optique revetu d'un revetement anti-reflets ou reflechissant ayant des proprietes d'adhesion et de resistance a l'abrasion ameliorees |
| JP2008033341A (ja) * | 2007-08-21 | 2008-02-14 | Seiko Epson Corp | 多層膜カットフィルターの製造方法 |
| WO2009086494A2 (en) * | 2007-12-27 | 2009-07-09 | Exatec, Llc | Multi-pass vacuum coating systems |
| JP5153410B2 (ja) * | 2008-03-31 | 2013-02-27 | Hoya株式会社 | レンズ成膜方法、蒸着装置及びレンズの製造方法 |
| TWI383207B (zh) | 2008-12-25 | 2013-01-21 | Chunghwa Picture Tubes Ltd | 背光模組之電路板固定結構 |
| CN101988186B (zh) * | 2009-08-04 | 2013-08-21 | 鸿富锦精密工业(深圳)有限公司 | 工件真空溅镀方法及装置 |
| JP2013104127A (ja) * | 2011-11-16 | 2013-05-30 | Mitsubishi Heavy Ind Ltd | 真空蒸着装置 |
| CN103403584B (zh) * | 2011-11-21 | 2016-10-19 | 旭硝子株式会社 | 带光学多层膜的玻璃构件和近红外线截止滤光片玻璃 |
| JP6243898B2 (ja) | 2012-04-19 | 2017-12-06 | インテヴァック インコーポレイテッド | 太陽電池製造のための2重マスク装置 |
| US10062600B2 (en) | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
| SG11201406893XA (en) | 2012-04-26 | 2014-11-27 | Intevac Inc | System architecture for vacuum processing |
| KR101336225B1 (ko) * | 2012-05-30 | 2013-12-03 | 주식회사 선익시스템 | 기판의 이송속도 조절을 통해 고 증착효율을 갖는 인라인 증착 시스템 |
| CN106688088B (zh) | 2014-08-05 | 2020-01-10 | 因特瓦克公司 | 注入掩膜及对齐 |
| EA034967B1 (ru) * | 2018-05-04 | 2020-04-13 | Общество С Ограниченной Ответственностью "Изовак Технологии" | Технологическая линия для формирования тонкопленочных покрытий в вакууме (варианты) |
| TWI774936B (zh) * | 2019-03-08 | 2022-08-21 | 台灣愛司帝科技股份有限公司 | 承載結構及承載設備 |
| DE102020003578A1 (de) | 2020-05-20 | 2021-11-25 | Schneider Gmbh & Co. Kg | Beschichtungsanlage, Spannring und Magazin für Brillengläser und Verfahren zum Beschichten von Brillengläsern |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62260059A (ja) * | 1986-05-02 | 1987-11-12 | Seiko Epson Corp | スパツタ装置 |
| US4859493A (en) * | 1987-03-31 | 1989-08-22 | Lemelson Jerome H | Methods of forming synthetic diamond coatings on particles using microwaves |
| JPS644472A (en) * | 1987-06-25 | 1989-01-09 | Toshiba Corp | Sputtering device |
| JPH0335216A (ja) * | 1989-06-30 | 1991-02-15 | Matsushita Electric Ind Co Ltd | 連続式スパッタ装置およびカラー液晶用基板の製造方法 |
| JPH03193873A (ja) * | 1989-12-21 | 1991-08-23 | Shinku Kikai Kogyo Kk | 連続真空薄膜形成方法および装置 |
| DE4111384C2 (de) * | 1991-04-09 | 1999-11-04 | Leybold Ag | Vorrichtung zur Beschichtung von Substraten |
| US5815396A (en) * | 1991-08-12 | 1998-09-29 | Hitachi, Ltd. | Vacuum processing device and film forming device and method using same |
| US5215420A (en) * | 1991-09-20 | 1993-06-01 | Intevac, Inc. | Substrate handling and processing system |
| US5250660A (en) * | 1991-11-12 | 1993-10-05 | Eli Lilly And Company | Peptide purification process |
| US5474611A (en) * | 1992-05-20 | 1995-12-12 | Yoichi Murayama, Shincron Co., Ltd. | Plasma vapor deposition apparatus |
| JPH0665724A (ja) * | 1992-05-20 | 1994-03-08 | Yoichi Murayama | インラインプラズマ蒸着装置 |
| JPH07278801A (ja) * | 1994-04-13 | 1995-10-24 | Idemitsu Material Kk | 真空成膜装置 |
-
1997
- 1997-03-26 TW TW086103845A patent/TW320687B/zh active
- 1997-03-27 KR KR1019970708614A patent/KR19990022135A/ko not_active Abandoned
- 1997-03-27 US US08/973,312 patent/US5993614A/en not_active Expired - Fee Related
- 1997-03-27 WO PCT/JP1997/001054 patent/WO1997037051A1/ja not_active Ceased
- 1997-03-27 EP EP97908528A patent/EP0834596B1/en not_active Expired - Lifetime
- 1997-03-27 AT AT97908528T patent/ATE273403T1/de not_active IP Right Cessation
- 1997-03-27 DE DE69730185T patent/DE69730185T2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO1997037051A1 (fr) | 1997-10-09 |
| EP0834596A4 (en) | 2003-03-26 |
| DE69730185T2 (de) | 2005-08-18 |
| EP0834596B1 (en) | 2004-08-11 |
| DE69730185D1 (de) | 2004-09-16 |
| TW320687B (enExample) | 1997-11-21 |
| US5993614A (en) | 1999-11-30 |
| EP0834596A1 (en) | 1998-04-08 |
| KR19990022135A (ko) | 1999-03-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |