DE69730185D1 - Verfahren und vorrichtung zur herstellung von substraten mit dünnen filmen - Google Patents
Verfahren und vorrichtung zur herstellung von substraten mit dünnen filmenInfo
- Publication number
- DE69730185D1 DE69730185D1 DE69730185T DE69730185T DE69730185D1 DE 69730185 D1 DE69730185 D1 DE 69730185D1 DE 69730185 T DE69730185 T DE 69730185T DE 69730185 T DE69730185 T DE 69730185T DE 69730185 D1 DE69730185 D1 DE 69730185D1
- Authority
- DE
- Germany
- Prior art keywords
- film
- film forming
- substrate
- chamber
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Physical Vapour Deposition (AREA)
- Inorganic Insulating Materials (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7884096 | 1996-04-01 | ||
JP7884096 | 1996-04-01 | ||
PCT/JP1997/001054 WO1997037051A1 (fr) | 1996-04-01 | 1997-03-27 | Procede de fabrication d'un substrat a couche mince et dispositif de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69730185D1 true DE69730185D1 (de) | 2004-09-16 |
DE69730185T2 DE69730185T2 (de) | 2005-08-18 |
Family
ID=13673031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69730185T Expired - Fee Related DE69730185T2 (de) | 1996-04-01 | 1997-03-27 | Verfahren und vorrichtung zur herstellung von substraten mit dünnen filmen |
Country Status (7)
Country | Link |
---|---|
US (1) | US5993614A (de) |
EP (1) | EP0834596B1 (de) |
KR (1) | KR19990022135A (de) |
AT (1) | ATE273403T1 (de) |
DE (1) | DE69730185T2 (de) |
TW (1) | TW320687B (de) |
WO (1) | WO1997037051A1 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3370806B2 (ja) | 1994-11-25 | 2003-01-27 | 株式会社半導体エネルギー研究所 | Mis型半導体装置の作製方法 |
US6275744B1 (en) * | 1997-08-01 | 2001-08-14 | Kokusai Electric Co., Ltd. | Substrate feed control |
KR100653904B1 (ko) * | 1998-04-24 | 2006-12-05 | 니폰샤신인사츠가부시키가이샤 | 터치패널장치 |
US20020099886A1 (en) * | 1999-05-17 | 2002-07-25 | Emerson Theodore F. | System and method for controlling remote console functionality assist logic |
JP4345158B2 (ja) | 1999-10-15 | 2009-10-14 | ソニー株式会社 | 光学部品の製造装置及び製造方法 |
KR100323991B1 (ko) * | 1999-11-16 | 2002-02-16 | 이경희 | 박막 제조 방법 및 제조 장치 |
TW490714B (en) | 1999-12-27 | 2002-06-11 | Semiconductor Energy Lab | Film formation apparatus and method for forming a film |
US20020011205A1 (en) | 2000-05-02 | 2002-01-31 | Shunpei Yamazaki | Film-forming apparatus, method of cleaning the same, and method of manufacturing a light-emitting device |
US6881269B2 (en) * | 2000-08-17 | 2005-04-19 | Novartis Ag | Lens plasma coating system |
KR100572554B1 (ko) * | 2001-02-27 | 2006-04-24 | 세이코 엡슨 가부시키가이샤 | 다층막 컷 필터 및 그 제조 방법, uv 컷 필터, 방진 유리, 표시 패널 및 투사형 표시 장치 |
JP2002363733A (ja) * | 2001-06-04 | 2002-12-18 | Nippon Sheet Glass Co Ltd | 被膜の形成方法 |
JP4120546B2 (ja) * | 2002-10-04 | 2008-07-16 | 株式会社Ihi | 薄膜形成方法及び装置並びに太陽電池の製造方法及び装置並びに太陽電池 |
US20040121146A1 (en) * | 2002-12-20 | 2004-06-24 | Xiao-Ming He | Composite barrier films and method |
JP4476073B2 (ja) * | 2004-04-08 | 2010-06-09 | 東北パイオニア株式会社 | 有機el素子の製造方法及び製造装置 |
JP2006058473A (ja) * | 2004-08-18 | 2006-03-02 | Oyokoden Lab Co Ltd | 誘電体多層膜フィルタ及びその製造方法 |
US7403204B2 (en) | 2004-08-23 | 2008-07-22 | Hewlett-Packard Development Company, L.P. | Method and apparatus for managing changes in a virtual screen buffer |
KR101017187B1 (ko) * | 2004-08-31 | 2011-02-25 | 엘지디스플레이 주식회사 | 스토커 시스템 |
US20060181266A1 (en) * | 2005-02-14 | 2006-08-17 | Panelvision Technology, A California Corporation | Flat panel display inspection system |
JP4462197B2 (ja) * | 2006-01-23 | 2010-05-12 | ソニー株式会社 | 光学ローパスフィルタ |
DE102006057386A1 (de) * | 2006-12-04 | 2008-06-05 | Uhde Gmbh | Verfahren zum Beschichten von Substraten |
US8318245B2 (en) * | 2007-02-23 | 2012-11-27 | Essilor International (Compagnie Generale D'optique) | Method for producing an optical article coated with an antireflection or a reflective coating having improved adhesion and abrasion resistance properties |
FR2913116B1 (fr) * | 2007-02-23 | 2009-08-28 | Essilor Int | Procede de fabrication d'un article optique revetu d'un revetement anti-reflets ou reflechissant ayant des proprietes d'adhesion et de resistance a l'abrasion ameliorees |
JP2008033341A (ja) * | 2007-08-21 | 2008-02-14 | Seiko Epson Corp | 多層膜カットフィルターの製造方法 |
KR20100100958A (ko) * | 2007-12-27 | 2010-09-15 | 엑사테크 엘.엘.씨. | 멀티-패스 진공 코팅 시스템 |
JP5153410B2 (ja) * | 2008-03-31 | 2013-02-27 | Hoya株式会社 | レンズ成膜方法、蒸着装置及びレンズの製造方法 |
TWI383207B (zh) | 2008-12-25 | 2013-01-21 | Chunghwa Picture Tubes Ltd | 背光模組之電路板固定結構 |
CN101988186B (zh) * | 2009-08-04 | 2013-08-21 | 鸿富锦精密工业(深圳)有限公司 | 工件真空溅镀方法及装置 |
JP2013104127A (ja) * | 2011-11-16 | 2013-05-30 | Mitsubishi Heavy Ind Ltd | 真空蒸着装置 |
CN103403584B (zh) * | 2011-11-21 | 2016-10-19 | 旭硝子株式会社 | 带光学多层膜的玻璃构件和近红外线截止滤光片玻璃 |
SG10201608512QA (en) | 2012-04-19 | 2016-12-29 | Intevac Inc | Dual-mask arrangement for solar cell fabrication |
US10062600B2 (en) | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
KR102072872B1 (ko) | 2012-04-26 | 2020-02-03 | 인테벡, 인코포레이티드 | 진공 처리용 시스템 아키텍처 |
KR101336225B1 (ko) * | 2012-05-30 | 2013-12-03 | 주식회사 선익시스템 | 기판의 이송속도 조절을 통해 고 증착효율을 갖는 인라인 증착 시스템 |
TWI662646B (zh) | 2014-08-05 | 2019-06-11 | 美商因特瓦克公司 | 植入用遮罩及其對準 |
EA034967B1 (ru) * | 2018-05-04 | 2020-04-13 | Общество С Ограниченной Ответственностью "Изовак Технологии" | Технологическая линия для формирования тонкопленочных покрытий в вакууме (варианты) |
TWI774936B (zh) * | 2019-03-08 | 2022-08-21 | 台灣愛司帝科技股份有限公司 | 承載結構及承載設備 |
DE102020003578A1 (de) | 2020-05-20 | 2021-11-25 | Schneider Gmbh & Co. Kg | Beschichtungsanlage, Spannring und Magazin für Brillengläser und Verfahren zum Beschichten von Brillengläsern |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62260059A (ja) * | 1986-05-02 | 1987-11-12 | Seiko Epson Corp | スパツタ装置 |
US4859493A (en) * | 1987-03-31 | 1989-08-22 | Lemelson Jerome H | Methods of forming synthetic diamond coatings on particles using microwaves |
JPS644472A (en) * | 1987-06-25 | 1989-01-09 | Toshiba Corp | Sputtering device |
JPH0335216A (ja) * | 1989-06-30 | 1991-02-15 | Matsushita Electric Ind Co Ltd | 連続式スパッタ装置およびカラー液晶用基板の製造方法 |
JPH03193873A (ja) * | 1989-12-21 | 1991-08-23 | Shinku Kikai Kogyo Kk | 連続真空薄膜形成方法および装置 |
DE4111384C2 (de) * | 1991-04-09 | 1999-11-04 | Leybold Ag | Vorrichtung zur Beschichtung von Substraten |
US5815396A (en) * | 1991-08-12 | 1998-09-29 | Hitachi, Ltd. | Vacuum processing device and film forming device and method using same |
US5215420A (en) * | 1991-09-20 | 1993-06-01 | Intevac, Inc. | Substrate handling and processing system |
US5250660A (en) * | 1991-11-12 | 1993-10-05 | Eli Lilly And Company | Peptide purification process |
US5474611A (en) * | 1992-05-20 | 1995-12-12 | Yoichi Murayama, Shincron Co., Ltd. | Plasma vapor deposition apparatus |
JPH0665724A (ja) * | 1992-05-20 | 1994-03-08 | Yoichi Murayama | インラインプラズマ蒸着装置 |
JPH07278801A (ja) * | 1994-04-13 | 1995-10-24 | Idemitsu Material Kk | 真空成膜装置 |
-
1997
- 1997-03-26 TW TW086103845A patent/TW320687B/zh active
- 1997-03-27 EP EP97908528A patent/EP0834596B1/de not_active Expired - Lifetime
- 1997-03-27 KR KR1019970708614A patent/KR19990022135A/ko active IP Right Grant
- 1997-03-27 US US08/973,312 patent/US5993614A/en not_active Expired - Fee Related
- 1997-03-27 AT AT97908528T patent/ATE273403T1/de not_active IP Right Cessation
- 1997-03-27 DE DE69730185T patent/DE69730185T2/de not_active Expired - Fee Related
- 1997-03-27 WO PCT/JP1997/001054 patent/WO1997037051A1/ja active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0834596B1 (de) | 2004-08-11 |
WO1997037051A1 (fr) | 1997-10-09 |
ATE273403T1 (de) | 2004-08-15 |
TW320687B (de) | 1997-11-21 |
US5993614A (en) | 1999-11-30 |
EP0834596A4 (de) | 2003-03-26 |
KR19990022135A (ko) | 1999-03-25 |
EP0834596A1 (de) | 1998-04-08 |
DE69730185T2 (de) | 2005-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69730185D1 (de) | Verfahren und vorrichtung zur herstellung von substraten mit dünnen filmen | |
AU2001252982A1 (en) | Assembly of free-standing films using a layer-by-layer process | |
TW200741823A (en) | Semiconductor device manufacturing method and substrate processing apparatus | |
US20070077356A1 (en) | Method for atomic layer deposition of materials using an atmospheric pressure for semiconductor devices | |
ATE468618T1 (de) | Verfahren zur herstellung eines optischen gerätes | |
US9946151B2 (en) | Method for producing a mask and the mask | |
WO2020072203A3 (en) | A thin film treatment process | |
ATE173302T1 (de) | Verfahren und vorrichtung zur herstellung dünner schichten von metallischen verbindungen | |
MY121762A (en) | Process and apparatus of producing optical disk and process of producing substrate | |
JPS5617011A (en) | Semiconductor device and manufacture thereof | |
EP0828286A3 (de) | Verfahren zum Herstellen von hochglanzpolierten Siliziumscheiben und Vorrichtung zur Behandlung von Siliziumscheiben | |
FR2517331A1 (fr) | Procede et dispositif pour definir un profil d'epaisseur dissymetrique pour des couches deposees par pulverisation sur un substrat semi-conducteur | |
CN110491993B (zh) | 一种pi基板的制备方法及其显示装置 | |
US6306735B1 (en) | Method for producing a semiconductor wafer | |
JPH0287101A (ja) | 反射防止膜の製造法 | |
JPH0545503A (ja) | 光学素子およびその製造方法 | |
EP2077467B9 (de) | Herstellungsverfahren von Fotomasken und Vorrichtung für dessen Umsetzung | |
US6240655B1 (en) | Fluid exchange system and an associated spherical-shaped semiconductor integrated circuit manufacturing system | |
JPS5671831A (en) | Manufacture for magnetic recording medium | |
JPS5952526A (ja) | 金属酸化膜のスパツタリング方法 | |
CN101246841B (zh) | 一种减少sti hdp制成中蛋卷状颗粒的方法 | |
JPS61154129A (ja) | 有機樹脂のエツチング方法 | |
JPS5337744A (en) | Control of atmosphere in which coated film is cured by radiation of electronrays and equipment therefor | |
JPS58179941A (ja) | 磁気記録媒体の製造方法 | |
JPS6010681A (ja) | 光電変換部材の製造装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |