AT521925A3 - Substratkassette - Google Patents
Substratkassette Download PDFInfo
- Publication number
- AT521925A3 AT521925A3 ATA51079/2019A AT510792019A AT521925A3 AT 521925 A3 AT521925 A3 AT 521925A3 AT 510792019 A AT510792019 A AT 510792019A AT 521925 A3 AT521925 A3 AT 521925A3
- Authority
- AT
- Austria
- Prior art keywords
- substrate cassette
- substrate
- housing
- cassette
- edition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Stackable Containers (AREA)
- Liquid Crystal (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Eine Substratkassette (10) zur Aufnahme mehrerer übereinandergestapelter Substrate (32), insbesondere Wafer, hat ein Gehäuse (12), das eine erste Seite (14) und eine zur ersten Seite (14) parallele zweite Seite (16) umfasst, wobei wenigstens eine längliche erste Auflage (20) für ein Substrat (32) innerhalb des Gehäuses (12) zwischen den Seiten (14, 16) vorgesehen ist, die zumindest abschnittsweise von der ersten Seite (14) beabstandet ist, wobei die erste Seite (14) der wenigstens einen ersten Auflage (20) am nächsten liegt.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2022185A NL2022185B1 (nl) | 2018-12-12 | 2018-12-12 | Substratkassette |
Publications (3)
Publication Number | Publication Date |
---|---|
AT521925A2 AT521925A2 (de) | 2020-06-15 |
AT521925A3 true AT521925A3 (de) | 2021-11-15 |
AT521925B1 AT521925B1 (de) | 2022-08-15 |
Family
ID=66166491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ATA51079/2019A AT521925B1 (de) | 2018-12-12 | 2019-12-09 | Substratkassette |
Country Status (9)
Country | Link |
---|---|
US (1) | US11049746B2 (de) |
JP (1) | JP2020167374A (de) |
KR (1) | KR20200073140A (de) |
CN (1) | CN111312635B (de) |
AT (1) | AT521925B1 (de) |
DE (1) | DE102019133136A1 (de) |
NL (1) | NL2022185B1 (de) |
SG (1) | SG10201911994SA (de) |
TW (1) | TWI824075B (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021256788A1 (ko) | 2020-06-16 | 2021-12-23 | 주식회사 엘지에너지솔루션 | 배터리 팩, 이를 포함하는 전자 디바이스 및 자동차 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000332097A (ja) * | 1999-05-17 | 2000-11-30 | Fujitsu Ltd | ウェーハ収納キャリア及びウェーハ搬送装置及びウェーハ搬送方法 |
US20030052039A1 (en) * | 2001-09-18 | 2003-03-20 | Cu Ruben S. | Wafer Boat |
US20030122146A1 (en) * | 2001-12-27 | 2003-07-03 | Toshihiko Iijima | Wafer cassette |
US20050148455A1 (en) * | 2004-01-06 | 2005-07-07 | Saint-Gobain Ceramics & Plastics, Inc. | High purity silicon carbide articles and methods |
CN201086933Y (zh) * | 2007-08-08 | 2008-07-16 | 义柏科技(深圳)有限公司 | 8英寸晶圆片架 |
US20090194456A1 (en) * | 2006-07-07 | 2009-08-06 | Entegris, Inc. | Wafer cassette |
US20120189408A1 (en) * | 2005-07-08 | 2012-07-26 | Crossing Automation, Inc. | Method and apparatus for wafer support |
US20130082015A1 (en) * | 2011-09-29 | 2013-04-04 | Semiconductor Manufacturing International Corporation | Elastic retention wheels and wafer adapter containing the same wheels |
US20140356107A1 (en) * | 2005-07-08 | 2014-12-04 | Brooks Automation, Inc. | Workpiece Structures and Apparatus for Accessing Same |
US20150083640A1 (en) * | 2008-01-13 | 2015-03-26 | Entegris, Inc. | Methods and apparatus for large diameter wafer handling |
WO2017035256A1 (en) * | 2015-08-25 | 2017-03-02 | Entegris, Inc. | Interlocking modular substrate support columns |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69526126T2 (de) * | 1995-10-13 | 2002-11-07 | Empak Inc | 300 mm behälter mit mikroumgebung und seitentür und erdungsleitung |
JPH09306980A (ja) * | 1996-05-17 | 1997-11-28 | Asahi Glass Co Ltd | 縦型ウエハボート |
US6341703B1 (en) * | 1998-04-06 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company, Ltd | Wafer cassette having dividers of different length or color |
KR20000025959A (ko) * | 1998-10-16 | 2000-05-06 | 윤종용 | 웨이퍼 캐리어 |
US6209555B1 (en) * | 1999-04-27 | 2001-04-03 | Imtec Acculine, Inc. | Substrate cassette for ultrasonic cleaning |
US7181132B2 (en) * | 2003-08-20 | 2007-02-20 | Asm International N.V. | Method and system for loading substrate supports into a substrate holder |
WO2009038244A2 (en) * | 2007-09-21 | 2009-03-26 | Visionsemicon.Co.Ltd | Magazine for depositing substrates |
US20090175707A1 (en) * | 2008-01-03 | 2009-07-09 | Bonora Anthony C | Controlled deflection of large area semiconductor substrates for shipping and manufacturing containers |
JP6104695B2 (ja) * | 2013-04-30 | 2017-03-29 | ミライアル株式会社 | 非対称溝形状ウェーハカセット |
US20140326686A1 (en) * | 2013-05-06 | 2014-11-06 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Substrate cartridge |
WO2016046985A1 (ja) * | 2014-09-26 | 2016-03-31 | ミライアル株式会社 | 基板収納容器 |
US9881826B2 (en) * | 2014-10-24 | 2018-01-30 | Lam Research Corporation | Buffer station with single exit-flow direction |
DE102015111144A1 (de) * | 2015-07-09 | 2017-01-12 | Hanwha Q.CELLS GmbH | Vorrichtung zur paarweisen Aufnahme von Substraten |
-
2018
- 2018-12-12 NL NL2022185A patent/NL2022185B1/nl active
-
2019
- 2019-12-05 DE DE102019133136.6A patent/DE102019133136A1/de active Pending
- 2019-12-05 US US16/704,875 patent/US11049746B2/en active Active
- 2019-12-09 TW TW108144877A patent/TWI824075B/zh active
- 2019-12-09 AT ATA51079/2019A patent/AT521925B1/de active
- 2019-12-10 KR KR1020190163627A patent/KR20200073140A/ko not_active Application Discontinuation
- 2019-12-11 SG SG10201911994SA patent/SG10201911994SA/en unknown
- 2019-12-11 CN CN201911268417.5A patent/CN111312635B/zh active Active
- 2019-12-11 JP JP2019223415A patent/JP2020167374A/ja active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000332097A (ja) * | 1999-05-17 | 2000-11-30 | Fujitsu Ltd | ウェーハ収納キャリア及びウェーハ搬送装置及びウェーハ搬送方法 |
US20030052039A1 (en) * | 2001-09-18 | 2003-03-20 | Cu Ruben S. | Wafer Boat |
US20030122146A1 (en) * | 2001-12-27 | 2003-07-03 | Toshihiko Iijima | Wafer cassette |
US20050148455A1 (en) * | 2004-01-06 | 2005-07-07 | Saint-Gobain Ceramics & Plastics, Inc. | High purity silicon carbide articles and methods |
US20120189408A1 (en) * | 2005-07-08 | 2012-07-26 | Crossing Automation, Inc. | Method and apparatus for wafer support |
US20140356107A1 (en) * | 2005-07-08 | 2014-12-04 | Brooks Automation, Inc. | Workpiece Structures and Apparatus for Accessing Same |
US20090194456A1 (en) * | 2006-07-07 | 2009-08-06 | Entegris, Inc. | Wafer cassette |
CN201086933Y (zh) * | 2007-08-08 | 2008-07-16 | 义柏科技(深圳)有限公司 | 8英寸晶圆片架 |
US20150083640A1 (en) * | 2008-01-13 | 2015-03-26 | Entegris, Inc. | Methods and apparatus for large diameter wafer handling |
US20130082015A1 (en) * | 2011-09-29 | 2013-04-04 | Semiconductor Manufacturing International Corporation | Elastic retention wheels and wafer adapter containing the same wheels |
WO2017035256A1 (en) * | 2015-08-25 | 2017-03-02 | Entegris, Inc. | Interlocking modular substrate support columns |
Also Published As
Publication number | Publication date |
---|---|
US20200194282A1 (en) | 2020-06-18 |
DE102019133136A1 (de) | 2020-06-18 |
JP2020167374A (ja) | 2020-10-08 |
KR20200073140A (ko) | 2020-06-23 |
US11049746B2 (en) | 2021-06-29 |
CN111312635A (zh) | 2020-06-19 |
SG10201911994SA (en) | 2020-07-29 |
TW202027203A (zh) | 2020-07-16 |
CN111312635B (zh) | 2024-04-26 |
AT521925A2 (de) | 2020-06-15 |
NL2022185B1 (nl) | 2020-07-02 |
AT521925B1 (de) | 2022-08-15 |
TWI824075B (zh) | 2023-12-01 |
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